Infineon Technologies CY62158EV30LL-45ZSXI

Overview

CY62158EV30LL-45ZSXI from Infineon Technologies (formerly Cypress) is a 8-Mbit (1024K × 8) CMOS static RAM with 45 ns access time, 2.2–3.6 V supply range, and ultra-low standby current (2 µA typical). It operates in industrial temperature range (–40 °C to +85 °C) and is packaged in Pb-free 48-ball VFBGA. It serves as low-power main memory in portable embedded systems requiring battery longevity.

For engineers reviewing the CY62158EV30LL-45ZSXI datasheet, CY62158EV30LL-45ZSXI pinout, CY62158EV30LL-45ZSXI application, or CY62158EV30LL-45ZSXI equivalent, key selection criteria include standby current budgeting, dual chip enable timing for power gating, VFBGA thermal resistance (36.92 °C/W), and compatibility with 1024K × 8 memory expansion topologies.

Technical Context

The device implements a fully static 1024K × 8 memory array with dual independent chip enables (CE1/CE2) enabling hierarchical power-down control. Its automatic power-down mode activates when CE1 is HIGH or CE2 is LOW, placing I/Os in high-impedance state and reducing ICCDR to ≤8 µA at 1.5 V retention voltage.

Read and write operations are controlled by synchronous assertion of CE1 (LOW), CE2 (HIGH), OE (LOW for read), and WE (LOW for write). Timing parameters-including tAA (45 ns), tDOE (22 ns), and tHZOE (18 ns)-are specified under CMOS-level input conditions and 30 pF AC test load, ensuring interoperability in mixed-signal SoC interfaces.

Key Specifications

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Compared with IS61LV10248AL-10TLI and AS6C1008-55ZIN, CY62158EV30LL-45ZSXI uniquely balances 45 ns performance, 2.2 V minimum VCC, and 2 µA standby in a compact VFBGA-making it optimal for space-constrained, battery-operated edge devices where moderate speed and ultra-low quiescent power are jointly critical.

Availability

CY62158EV30LL-45ZSXI is available at Aetrix Electronics and suitable for wearable health monitors, industrial PLC I/O modules, smart meter communication hubs, and automotive body control modules requiring stable component supply across extended product lifecycles.

Supply support for CY62158EV30LL-45ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and security solutions for industrial, automotive, and IoT markets.

This device belongs to Infineon's MoBL™ (More Battery Life) SRAM product line, engineered specifically for ultra-low-power embedded memory applications where extended battery runtime and reliable data retention under voltage droop are primary design constraints.

FAQ

What is the minimum VCC required to retain data in CY62158EV30LL-45ZSXI?

The device guarantees data retention down to 1.5 V VCC, as specified in the Data Retention Characteristics table. At this voltage, ICCDR remains ≤8 µA, and no external refresh or backup circuitry is needed-enabling direct integration with supercapacitor or coin-cell backup rails without voltage regulation.

How does dual chip enable (CE1/CE2) improve power management versus single CE SRAMs?

CE1 and CE2 operate as logically independent enables: CE1 HIGH *or* CE2 LOW triggers automatic power-down. This allows hierarchical memory partitioning-e.g., one bank held active via CE2 while another enters standby via CE1-reducing system-level leakage without software intervention or external power switches.

Can CY62158EV30LL-45ZSXI be used in place of CY62158DV30?

Yes-CY62158EV30LL-45ZSXI is explicitly pin-compatible with CY62158DV30 per the datasheet Feature List. Both share identical pinout, timing, and electrical specifications, but the EV30 variant adds enhanced low-voltage operation (2.2 V min) and improved MoBL power efficiency over the DV30's 2.7 V min specification.

What thermal considerations apply to the 48-ball VFBGA package?

The VFBGA package has a junction-to-ambient thermal resistance (θJA) of 36.92 °C/W under JEDEC-standard 2-layer PCB conditions. To maintain Tj < 125 °C at max ambient (85 °C), average power dissipation must stay below 1.08 W-achievable given its 6 mA active current at 3.6 V (21.6 mW typical).