Infineon Technologies CY62158G30-45BVXIT
- Part No.:
- CY62158G30-45BVXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62158G30-45BVXIT.pdf
- Description:
- IC SRAM 8MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62158G30-45BVXIT from Infineon Technologies (formerly Cypress) is an 8-Mbit (1M × 8-bit) MoBL SRAM with embedded single-bit error-correcting code (ECC), operating at 45 ns access time across 2.2–3.6 V supply, featuring ultra-low standby current (1.4 µA typ), TTL-compatible I/O, and 1.0-V data retention for battery-backed memory backup in industrial control systems.
For engineers reviewing the CY62158G30-45BVXIT datasheet, CY62158G30-45BVXIT pinout, CY62158G30-45BVXIT application, or CY62158G30-45BVXIT equivalent, key selection criteria include ECC support without automatic write-back, dual chip enable architecture, VFBGA-48 package compatibility, and industrial temperature range (–40 °C to +85 °C) operation.
Technical Context
This SRAM implements a synchronous, address-decoded 1M × 8-bit array with dedicated ECC encoder/decoder logic that detects and corrects single-bit errors on read, but does not perform automatic write-back-error correction requires host-level intervention. The device uses two independent chip enables (CE1 active-low, CE2 active-high) for hierarchical memory mapping and supports high-impedance I/O during deselect, OE disable, or write cycles.
It operates within a 2.2–3.6 V VCC range with guaranteed 45 ns access time at max speed, delivers 18 mA typical operating current at fmax, and maintains data integrity down to 1.0 V for extended retention during brown-out conditions-critical for fail-safe logging in programmable logic controllers and edge sensor nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (1,048,576 × 8-bit organization) - supports byte-wide data bus interfacing without external multiplexing |
| Access Time | 45 ns - enables direct connection to 22.22 MHz microcontroller buses without wait states |
| VCC Range | 2.2 V to 3.6 V - compatible with modern low-voltage SoCs and battery-powered industrial modules |
| Standby Current | 1.4 µA typical / 6.5 µA max - allows multi-year operation on coin-cell backup power |
| ECC Function | Single-bit error correction (no automatic write-back) - requires host firmware to read ERR flag and initiate corrective action |
| Data Retention | 1.0 V minimum - preserves memory contents during deep sleep or partial power loss in safety-critical systems |
| Package | 48-ball VFBGA (6 × 8 × 1 mm) - provides compact footprint for space-constrained PCB layouts |
Pinout & Package
The CY62158G30-45BVXIT is packaged in a 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) measuring 6 mm × 8 mm × 1 mm, optimized for high-density industrial PCBs with thermal resistance ΘJA = 36.92 °C/W (still air).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word addressing; no internal address latching |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit TTL-compatible I/O lines; tri-stated when CE1 HIGH, CE2 LOW, OE HIGH, or WE LOW |
| CE1, CE2 | Dual Chip Enables | CE1 active-low + CE2 active-high required for device selection - enables hierarchical memory banking |
| WE | Write Enable | Active-low control for write operations; asserts write cycle when CE1/CE2 enabled |
| OE | Output Enable | Active-low control for read output drive; disables outputs when HIGH |
| ERR | Error Flag Output | Open-drain output asserted LOW when single-bit error detected - requires external pull-up |
| VCC, VSS | Power Supply | Two VCC balls and two VSS balls provide low-impedance power delivery and noise reduction |
| NC | No Connect | Unbonded pads; reserved for future density scaling - must be left unconnected |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Logic | On-die Hamming-code encoder/decoder corrects single-bit errors per 8-bit word without external logic |
| Ultra-Low Standby Power | 1.4 µA typical ISB2 at 25 °C enables >10-year battery backup in tamper-evident logging systems |
| Dual Chip Enable Architecture | Independent CE1 (active-low) and CE2 (active-high) allow flexible memory partitioning in multi-master systems |
| 1.0-V Data Retention | Maintains stored data down to 1.0 V VCC - supports graceful shutdown and brown-out recovery in PLCs |
| TTL-Compatible I/O | Meets VIH ≥ 2.2 V and VOL ≤ 0.4 V at 2.2–3.6 V - interoperates directly with legacy 3.3 V microcontrollers |
Applications
| Industrial Programmable Logic Controllers | Medical Diagnostic Data Buffers |
|---|---|
Use Scenario: Real-time I/O state logging with power-fail detection and nonvolatile backup. IC Role / Device Role / Timing Role: Primary volatile working memory with ECC-protected storage of runtime variables and fault history. Use Value: Prevents corrupted configuration writes during unexpected power loss, ensuring deterministic restart behavior after brown-out events. | Use Scenario: High-integrity temporary storage of ultrasound image frames before compression and transmission. IC Role / Device Role / Timing Role: High-speed frame buffer with bit-error resilience during acquisition bursts. Use Value: Eliminates need for redundant checksum validation in time-critical imaging pipelines, reducing latency by ~12 µs per frame. |
| Railway Signaling Event Recorders | Avionics Health Monitoring Units |
Use Scenario: Tamper-resistant black-box recording of switch positions, signal aspects, and timing stamps. IC Role / Device Role / Timing Role: Battery-backed SRAM holding critical event logs with ECC-verified integrity checks. Use Value: Meets EN 50126 SIL-2 requirements for data integrity over 15-year service life under thermal cycling. | Use Scenario: Onboard engine parameter caching during transient power dips in flight control subsystems. IC Role / Device Role / Timing Role: Low-voltage-retention memory preserving sensor fusion coefficients during 100-ms brown-outs. Use Value: Sustains navigation accuracy without reinitialization, avoiding 200+ ms GPS reacquisition delay post-recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM with ECC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV10248BLL-10MLI | No built-in ECC; requires external error-handling logic or host-side software correction | Suitable only where system-level ECC implementation is feasible and latency budget permits | Select when cost sensitivity outweighs ECC integration needs and board space allows extra logic |
| AS6C1008-55ZIN | Slower 55 ns access time; no ERR flag output; no 1.0-V retention mode | Limited to non-safety-critical applications without strict data integrity or low-voltage hold requirements | Choose for legacy designs already using 55 ns timing margins and no brown-out resilience requirement |
Compared with IS61WV10248BLL-10MLI and AS6C1008-55ZIN, CY62158G30-45BVXIT uniquely delivers integrated ECC with hardware ERR signaling and 1.0-V data retention-enabling certified safety functions without host CPU overhead or external components.
Availability
CY62158G30-45BVXIT is available at Aetrix Electronics and suitable for industrial programmable logic controllers, medical diagnostic equipment, railway signaling recorders, and avionics health monitors requiring stable component supply across extended product lifecycles.
Supply support for CY62158G30-45BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions for industrial and safety-critical applications.
CY62158G30-45BVXIT belongs to Infineon's MoBL (Mobile Low-power) SRAM product line, engineered specifically for battery-backed, ECC-protected memory in harsh-environment embedded systems demanding long-term reliability and data integrity.
FAQ
Does CY62158G30-45BVXIT support automatic error correction write-back?
No. The device detects and corrects single-bit errors on read but does not automatically rewrite corrected data to memory. The ERR pin signals error occurrence, requiring host firmware to read the affected location, apply correction, and optionally rewrite. This design avoids unintended write cycles during transient faults and preserves deterministic timing behavior.
What is the function of the ERR pin, and how should it be interfaced?
The ERR pin is an open-drain output that goes LOW when a single-bit error is detected during a read operation. It must be externally pulled up to VCC via a 4.7 kΩ resistor. Host logic monitors this pin synchronously with read cycles; no internal debouncing or latching is provided, so firmware must sample ERR immediately after valid data appears on I/O pins.
Can CY62158G30-45BVXIT operate reliably at 2.2 V while delivering 45 ns access time?
Yes. The 45 ns access time is fully specified and guaranteed across the entire 2.2–3.6 V VCC range per the datasheet's AC switching characteristics table. At 2.2 V, propagation delays remain within spec due to adaptive internal timing circuits-no derating is required for timing-critical interfaces like ARM Cortex-M7 FSMC buses.
How does the dual chip enable (CE1/CE2) architecture improve system design flexibility?
CE1 (active-low) and CE2 (active-high) operate independently, allowing memory-mapped peripherals or FPGA logic to decode multiple address ranges using simple AND/NAND gates. This eliminates need for complex address comparators and supports bank-switching schemes in resource-constrained microcontrollers-e.g., enabling separate code and data banks in bootloaders with minimal gate count.
CY62158G30-45BVXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 8Mbit
- Memory Organization:
- 1M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62158G30-45BVXIT FAQ
1.How can I place an order for CY62158G30-45BVXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62158G30-45BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62158G30-45BVXIT reliable?
The price and inventory of CY62158G30-45BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62158G30-45BVXIT is usually 5 days.
3.What payment methods are accepted for CY62158G30-45BVXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62158G30-45BVXIT transactions.
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4.How is shipping managed for CY62158G30-45BVXIT?
CY62158G30-45BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62158G30-45BVXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62158G30-45BVXIT?
For technical support, including CY62158G30-45BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62158G30-45BVXIT requirements.
6.How does Aetrix verify that CY62158G30-45BVXIT is sourced from the original manufacturer or authorized distributors?
All CY62158G30-45BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62158G30-45BVXIT meets industry standards.
7.What is the process for return or replacement of CY62158G30-45BVXIT?
All CY62158G30-45BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62158G30-45BVXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62158G30-45BVXIT part is unused and in its original packaging.
Return procedure for CY62158G30-45BVXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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