Infineon Technologies CY62158G30-45ZSXI

Overview

CY62158G30-45ZSXI from Infineon Technologies (formerly Cypress) is a MoBL 8-Mbit (1M × 8-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 45 ns access time over 2.2–3.6 V supply, featuring ultra-low standby current (1.4 µA typ), TTL-compatible I/O, and 1.0-V data retention - deployed in industrial control modules requiring high reliability under voltage brownout conditions.

For engineers reviewing the CY62158G30-45ZSXI datasheet, CY62158G30-45ZSXI pinout, CY62158G30-45ZSXI application, or CY62158G30-45ZSXI equivalent, key selection criteria include ECC support for memory integrity, dual chip enable architecture for flexible memory mapping, 44-pin TSOP II package compatibility, and industrial-grade temperature range (–40 °C to +85 °C).

Technical Context

This SRAM implements a synchronous, asynchronous read/write interface with dual chip enables (CE1 active-low, CE2 active-high) and separate OE/WE controls, enabling precise bank selection and bus isolation. Its ECC logic operates inline during read cycles, detecting and correcting single-bit errors without CPU intervention or write-back overhead.

The device uses a 20-bit address bus (A0–A19) to access 1M × 8-bit memory space and integrates dedicated sense amplifiers, row/column decoders, and ECC encoders/decoders on-die. It supports automatic power-down mode when either CE1 is deasserted or CE2 is disabled, reducing ISB2 to ≤6.5 µA at +85 °C.

Key Specifications

Pinout & Package

Package: 44-pin Thin Small Outline Package Type II (TSOP II), 12.0 mm × 20.0 mm × 1.2 mm body, lead-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM with ECC applications.

Compared with IS61WV10248BLL-10MLI and AS6C8008-55TIN, CY62158G30-45ZSXI uniquely delivers ECC, 1.0-V retention, and industrial temperature support in a single 44-pin TSOP II package - making it the sole option for safety-aware embedded systems requiring zero-error memory operation under brownout stress.

Availability

CY62158G30-45ZSXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical diagnostic data caches, railway event loggers, and avionics health monitor RAM requiring stable component supply across extended product lifecycles.

Supply support for CY62158G30-45ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with strong industrial and safety-critical system focus.

CY62158G30-45ZSXI belongs to Infineon's MoBL (Mobile Bitline) SRAM product line, engineered specifically for ultra-low-power, high-reliability embedded applications where data integrity and voltage resilience are mandatory - not just performance-optimized memory.

FAQ

Does CY62158G30-45ZSXI support automatic error correction during write operations?

No. The device performs ECC encoding on write and decoding/correction on read only. It does not implement automatic write-back on error detection, meaning corrected data remains in the read path but is not rewritten to memory unless explicitly commanded by the host system. This design minimizes latency and avoids unintended write cycles during error recovery.

Can CY62158G30-45ZSXI operate reliably at 2.2 V across its full industrial temperature range?

Yes. The datasheet specifies full functionality - including 45 ns access time, ECC operation, and 6.5 µA max ISB2 - over –40 °C to +85 °C at VCC = 2.2 V to 3.6 V. All AC and DC parameters are guaranteed across this range, with no derating required at minimum supply voltage.

What is the function of the NC pins in the 44-pin TSOP II package?

The NC (No Connect) pins - located at positions 31, 32, 36, 35, 34, 33, 37, 40, 39, 38, 12, 13, 41, 44, 43, and 42 - are not bonded to the die and serve no electrical function. They are reserved for potential future pin expansion in higher-density derivatives and must remain unconnected in PCB layout to avoid parasitic coupling or EMI issues.

Is thermal resistance data provided for the 44-pin TSOP II package?

Yes. For the 44-pin TSOP II variant, ΘJA (junction-to-ambient) is 66.93 °C/W and ΘJC (junction-to-case) is 13.09 °C/W, measured on a standard 3 × 4.5 inch, four-layer PCB in still air. These values enable accurate junction temperature estimation under worst-case power dissipation (25 mA ICC at 3.6 V = 90 mW).