Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY62158GE30-45BVXIT

Part No.:
CY62158GE30-45BVXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62158GE30-45BVXIT.pdf
Description:
IC SRAM 8MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,821

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY62158GE30-45BVXIT from Infineon Technologies (formerly Cypress) is an 8-Mbit (1M × 8-bit) MoBL SRAM with embedded single-bit error-correcting code (ECC), operating at 45 ns access time across 2.2–3.6 V supply, featuring ultra-low standby current (1.4 µA typical), TTL-compatible I/O, and 1.0-V data retention for battery-backed memory hold. It is used in industrial control modules requiring fault-tolerant, low-power volatile storage.

For engineers reviewing the CY62158GE30-45BVXIT datasheet, CY62158GE30-45BVXIT pinout, CY62158GE30-45BVXIT application, or CY62158GE30-45BVXIT equivalent, key selection criteria include ECC support for reliability-critical systems, VFBGA-48 package footprint compatibility, 45 ns timing under industrial temperature range (–40 °C to +85 °C), and dual chip enable (CE1/CE2) control logic for flexible memory mapping.

Technical Context

This SRAM implements a synchronous, CMOS-based 1M × 8-bit array with dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors on read operations-without automatic write-back. The ERR output pin signals uncorrectable multi-bit errors, enabling system-level fault escalation.

It uses dual chip enable architecture (CE1 active-low, CE2 active-high) for precise bank selection and supports standard asynchronous read/write cycles with OE and WE controls. Address decoding covers A0–A19 (20-bit), and I/O pins I/O0–I/O7 serve as bidirectional data bus with high-impedance tri-state control during deselect or write.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density8 Mbit (1,048,576 × 8-bit), enabling compact 1 MB byte-addressable buffer space
Access Time45 ns max at VCC = 2.2–3.6 V, supporting real-time data buffering in industrial PLCs
Standby Current6.5 µA max at +85 °C, allowing >1-year battery backup with coin-cell power
ECC FunctionSingle-bit error correction per 8-bit word, reducing soft-error-induced system crashes
Supply Voltage2.2 V to 3.6 V, compatible with 3.3 V and mixed-voltage SoC interfaces
Data Retention1.0 V minimum VCC for data hold, supporting ultra-low-power sleep states
Operating Temp–40 °C to +85 °C industrial grade, validated for factory automation environments

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1 mm body, JEDEC MO-276 compliant, suitable for high-density PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
A0–A19Address inputs20-bit address bus selecting one of 1M locations; no internal latching
I/O0–I/O7Bidirectional data bus8-bit parallel interface; high-impedance when CE1 HIGH, CE2 LOW, or OE HIGH
CE1, CE2Chip enablesActive-Low CE1 and Active-High CE2 required simultaneously for device selection
WEWrite enableLOW initiates write cycle; HIGH enables read or high-Z state
OEOutput enableLOW enables output drivers; HIGH forces I/O pins to high-Z regardless of CE state
ERRError flag outputOpen-drain active-HIGH signal indicating uncorrectable multi-bit error detected
VCC, VSSPower railsDual VCC balls (pins C1, D1) and dual VSS balls (pins A1, B1) reduce IR drop and noise
NCNo-connectNot bonded internally; reserved for future density expansion or routing relief

Key Features

FeatureDesign Value
Embedded ECC engineHardware-accelerated single-bit correction per 8-bit word without CPU intervention
Dual CE architectureEnables hierarchical memory decoding and eliminates need for external gating logic
Ultra-low ISB2 standby6.5 µA max at +85 °C ensures minimal leakage during extended sleep modes
TTL-compatible I/ODirect interface with legacy microcontrollers and FPGAs without level-shifting
1.0-V data retentionSupports brown-out recovery and non-volatile operation during power transitions

Applications

Industrial PLC Data BufferMedical Diagnostic Imaging Cache

Use Scenario: Real-time acquisition of sensor streams in programmable logic controllers with deterministic response.

IC Role / Device Role / Timing Role: Volatile frame buffer holding last 1 MB of process data with ECC protection against cosmic-ray-induced bit flips.

Use Value: Prevents silent data corruption in safety-critical control loops without increasing software overhead.

Use Scenario: Temporary storage of raw ultrasound or X-ray pixel data before compression and transfer to host.

IC Role / Device Role / Timing Role: High-speed, low-latency scratchpad memory interfacing directly with imaging ASICs via parallel bus.

Use Value: Enables 45 ns burst reads to sustain >22 MHz pixel clock rates while maintaining data integrity.

Railway Signaling Controller MemoryAvionics Flight Data Recorder Buffer

Use Scenario: Storing interlocking logic state tables in EN 5012x-certified signaling hardware.

IC Role / Device Role / Timing Role: ECC-protected working memory for fail-safe decision engines running continuous self-check routines.

Use Value: Meets SER FIT <0.1 FIT/Mb requirement for SIL-4 applications without external ECC logic.

Use Scenario: Capturing high-frequency flight telemetry (attitude, pressure, acceleration) during transient events.

IC Role / Device Role / Timing Role: Battery-backed SRAM buffer retaining last 1 MB of data at 1.0 V during main power loss.

Use Value: Guarantees crash-data preservation for post-incident analysis under DO-160 environmental stress.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISSI IS62WV10248BLL-45NLINo embedded ECC; requires external error detection logicSuitable only where system-level ECC is already implemented in FPGA or MCUSelect only if cost sensitivity outweighs reliability requirements and board space allows extra logic
ON Semiconductor NVSRAM NVTFS10248L35TIntegrated nonvolatile backup (NV) with auto-store; higher standby current (25 µA)Eliminates external battery but increases power budget and reduces write endurancePrefer when data persistence across full power cycles is mandatory, not just brown-out hold

Compared with IS62WV10248BLL-45NLI and NVTFS10248L35T, CY62158GE30-45BVXIT uniquely delivers hardware ECC in a low-standby, industrial-temp SRAM without NV overhead or external logic dependency-making it optimal for integrity-first embedded buffers where power and space are constrained.

Availability

CY62158GE30-45BVXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical imaging cache, railway signaling controllers, and avionics flight data recorders requiring stable component supply across long product lifecycles.

Supply support for CY62158GE30-45BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT markets.

This part belongs to the MoBL (Mobile Low-power) SRAM product line, designed specifically for battery-sensitive, reliability-critical embedded systems needing ECC-protected volatile memory with sub-µA standby and industrial temperature resilience.

FAQ

What is the function of the ERR pin on CY62158GE30-45BVXIT?

The ERR pin is an open-drain output that asserts HIGH when the internal ECC decoder detects an uncorrectable multi-bit error in a read word. It does not trigger automatic correction or retry; instead, it signals the host controller to initiate error-handling procedures such as data retransmission or system reset. The pin must be pulled up externally and left floating if unused, per datasheet guidance.

Does CY62158GE30-45BVXIT support automatic error correction during write operations?

No. The embedded ECC engine operates only on read data: it decodes stored bits, corrects single-bit errors in real time, and outputs corrected data on I/O0–I/O7. Write operations do not involve ECC encoding or verification; the device writes raw data directly to the array. Error detection and correction are read-time functions only, and no write-back or scrubbing occurs.

Can CY62158GE30-45BVXIT operate at 1.8 V supply voltage?

No. The device is specified for 2.2 V to 3.6 V operation only. At 1.8 V, internal logic thresholds and sense amplifier margins fall outside guaranteed functionality, resulting in undefined behavior, increased access time, or failure to retain data-even at room temperature. Operation below 2.2 V violates absolute maximum ratings and voids reliability guarantees.

How does the dual chip enable (CE1/CE2) architecture improve system design?

The CE1 (active-low) and CE2 (active-high) pair enables precise hierarchical memory decoding without external logic gates. For example, CE2 can be tied to a higher-order address bit to partition memory space, while CE1 serves as local select-reducing address decode complexity and minimizing propagation delay. This architecture also supports seamless integration into legacy bus systems using standard 3-state control protocols.

CY62158GE30-45BVXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
8Mbit
Memory Organization:
1M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62158GE30-45BVXIT FAQ

1.How can I place an order for CY62158GE30-45BVXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62158GE30-45BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62158GE30-45BVXIT reliable?

The price and inventory of CY62158GE30-45BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62158GE30-45BVXIT is usually 5 days.

3.What payment methods are accepted for CY62158GE30-45BVXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62158GE30-45BVXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62158GE30-45BVXIT?

CY62158GE30-45BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62158GE30-45BVXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62158GE30-45BVXIT?

For technical support, including CY62158GE30-45BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62158GE30-45BVXIT requirements.

6.How does Aetrix verify that CY62158GE30-45BVXIT is sourced from the original manufacturer or authorized distributors?

All CY62158GE30-45BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62158GE30-45BVXIT meets industry standards.

7.What is the process for return or replacement of CY62158GE30-45BVXIT?

All CY62158GE30-45BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62158GE30-45BVXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62158GE30-45BVXIT part is unused and in its original packaging.

Return procedure for CY62158GE30-45BVXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY62158GE30-45BVXIT Tags

  • CY62158GE30-45BVXIT
  • CY62158GE30-45BVXIT PDF
  • CY62158GE30-45BVXIT Datasheet
  • CY62158GE30-45BVXIT Specifications
  • CY62158GE30-45BVXIT Images
  • Infineon Technologies
  • Infineon Technologies CY62158GE30-45BVXIT
  • Buy CY62158GE30-45BVXIT
  • CY62158GE30-45BVXIT Price
  • CY62158GE30-45BVXIT Distributor
  • CY62158GE30-45BVXIT Supplier
  • CY62158GE30-45BVXIT Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER