Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies CY62158H-45ZSXIT

Name: CY62158H-45ZSXIT
Brand: Infineon Technologies
SKU: CY62158H-45ZSXIT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: CY62158H-45ZSXIT

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 44-TSOP (0.400", 10.16mm Width)

Datasheet:: CY62158H-45ZSXIT.pdf

Description:: IC SRAM 8MBIT PARALLEL 44TSOP II

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,411

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

CY62158H-45ZSXIT from Cypress Semiconductor is an 8-Mbit (1M × 8) MoBL® CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 45 ns access time, and ultra-low standby current (max 16 µA). It operates across 4.5–5.5 V and supports industrial temperature range (–40 °C to +85 °C), deployed in mission-critical memory buffers for industrial controllers and avionics data loggers.

For engineers reviewing the CY62158H-45ZSXIT datasheet, CY62158H-45ZSXIT pinout, CY62158H-45ZSXIT application, or CY62158H-45ZSXIT equivalent, key selection criteria include ECC-enabled reliability, dual chip enable (CE1/CE2) control logic, TSOP II package compatibility, and 1.0-V data retention capability under brownout conditions.

Technical Context

The CY62158H implements a dedicated ECC encoder/decoder block integrated into the 1M × 8 SRAM array, correcting single-bit errors on read without automatic write-back. Its dual CE architecture requires CE1 = LOW and CE2 = HIGH for selection, decoupling chip enable from output enable (OE) and write enable (WE) timing paths.

Read operations are initiated by asserting CE1 LOW, CE2 HIGH, and OE LOW while holding WE HIGH; write operations require CE1 LOW, CE2 HIGH, and WE LOW. All eight bidirectional I/O pins enter high-impedance state when deselected (CE1 HIGH or CE2 LOW), during write cycles, or when OE is HIGH.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	8 Mbit (1,048,576 words × 8 bits); supports byte-wide data bus interface without external multiplexing.
Access Time	45 ns maximum; enables direct interfacing with legacy microcontrollers and FPGAs running at ≤22.2 MHz.
V_CC Range	4.5 V to 5.5 V; compatible with standard 5-V logic rails and tolerant of ±10% supply variation.
Standby Current	Max 16 µA at 85 °C; reduces system-level power budget in always-on monitoring subsystems.
Data Retention Voltage	1.0 V minimum; maintains stored contents during deep sleep or brownout events without backup battery.
ECC Function	Single-bit error correction per 8-bit word; detects and corrects soft errors without CPU intervention or firmware overhead.
Operating Temperature	–40 °C to +85 °C industrial grade; qualified for use in programmable logic controllers and railway signaling hardware.

Pinout & Package

Package: 44-pin TSOP II (Thin Small Outline Package, Type II), 400-mil body width, surface-mount, lead-free compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A19	Address inputs	20-bit address bus supporting full 1M-word addressing; no internal address latching required.
I/O0–I/O7	Bidirectional data I/O	8-bit TTL-compatible data path; high-impedance when deselected, OE HIGH, or during write.
CE1, CE2	Dual chip enable inputs	Active-Low CE1 and Active-High CE2 must both be asserted for device selection; enables hierarchical memory decoding.
OE	Output enable	Controls output drivers only; does not affect internal memory state or ECC operation.
WE	Write enable	Active-Low signal initiating write cycle; overlaps with CE assertion to define write window.
VCC, VSS	Power and ground	Two VCC and two VSS pins reduce IR drop and improve noise immunity in high-speed operation.
NC	No-connect	Four NC pins (pins 11, 12, 13, 14, 31, 32, 36, 37, 40, 41, 42, 43, 44 - per datasheet Figure 1); unused for internal connection; may support future density expansion.

Key Features

Feature	Design Value
Embedded ECC	Hardware-based single-bit error correction per byte; eliminates need for software ECC routines or external parity logic.
Ultra-low ISB2	Typical 5.5 µA standby current at 25 °C; extends battery life in portable diagnostic equipment and remote sensors.
1.0-V data retention	Retains valid data down to 1.0 V VCC; enables graceful degradation during power failure without data loss.
TTL-compatible I/O	VIH = 2.2 V min, VOL = 0.4 V max; interfaces directly with legacy 5-V microcontrollers and CPLDs without level shifters.
Dual CE architecture	Independent CE1 (active-Low) and CE2 (active-High) inputs; supports multi-chip memory banks with hierarchical decode.

Applications

Industrial PLC Data Buffer

Aerospace Flight Data Recorder

Use Scenario: Real-time logging of sensor inputs and actuator commands in programmable logic controllers with strict uptime requirements.

IC Role / Device Role / Timing Role: Primary volatile memory buffer with ECC protection for cyclic process data storage between scan cycles.

Use Value: Prevents silent data corruption from cosmic radiation or EMI in factory-floor environments where firmware reboot is unacceptable.

Use Scenario: Storing flight parameter snapshots during aircraft takeoff, cruise, and landing phases under extreme thermal cycling.

IC Role / Device Role / Timing Role: High-reliability scratchpad memory for black-box recording systems requiring deterministic 45 ns read/write timing.

Use Value: 1.0-V data retention ensures integrity during transient power loss during engine start-up or generator switchover.

Railway Signaling Controller

Medical Diagnostic Imaging Cache

Use Scenario: Temporary storage of interlocking logic states and track occupancy flags in EN 5012x-certified signaling hardware.

IC Role / Device Role / Timing Role: Safety-critical SRAM with ECC used in SIL-3-rated subsystems where uncorrected memory faults constitute hazardous failures.

Use Value: SER FIT rate <0.1 FIT/Mb meets IEC 61508 hardware fault tolerance requirements for safety instrumented functions.

Use Scenario: Frame buffering in portable ultrasound and X-ray imaging devices where compact size and low power are essential.

IC Role / Device Role / Timing Role: Low-profile TSOP II package enables dense PCB layout; 44-pin footprint fits tight mechanical envelopes.

Use Value: Ultra-low 16 µA max standby current extends battery runtime in handheld diagnostic tools without compromising memory density.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM with ECC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS61LV10248-10TLI	No embedded ECC; requires external error detection logic; 10 ns slower (55 ns access).	Lacks hardware-level single-bit correction; increases firmware complexity and latency in safety-critical reads.	Select only if ECC is implemented externally and timing margin allows 10 ns penalty.
AS6C8008-55ZIN	55 ns access time; no ECC; higher standby current (max 30 µA); same 44-pin TSOP II package.	Suitable for non-safety applications where cost is prioritized over reliability and power efficiency.	Choose when ECC is unnecessary and system clock permits relaxed timing.

Compared with IS61LV10248-10TLI and AS6C8008-55ZIN, CY62158H-45ZSXIT uniquely delivers hardware ECC, 45 ns speed, and sub-20 µA standby in a single 44-pin TSOP II package-enabling safer, faster, and more power-efficient memory subsystems without design trade-offs.

Availability

CY62158H-45ZSXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, aerospace flight data recording, and railway signaling controller applications requiring stable component supply across extended product lifecycles.

Supply support for CY62158H-45ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and aerospace markets.

The CY62158H belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for low-power, ECC-enhanced memory applications in harsh-environment embedded systems.

FAQ

Does CY62158H-45ZSXIT support automatic error correction write-back?

No. The CY62158H performs single-bit error correction on read but does not automatically write corrected data back to memory. Error detection and correction occur transparently during read access, and the original (uncorrected) data remains stored unless explicitly rewritten by the host system.

What is the meaning of dual chip enable (CE1/CE2) in CY62158H-45ZSXIT?

CE1 and CE2 form a logical AND function: the device is selected only when CE1 is LOW and CE2 is HIGH. This architecture enables hierarchical memory decoding-e.g., using CE2 as a bank select and CE1 as a chip select-reducing address decoder complexity in multi-SRAM systems.

Can CY62158H-45ZSXIT operate below 4.5 V?

No. The absolute minimum VCC is 4.5 V for full functional operation. However, it retains stored data down to 1.0 V in data retention mode (with CE1 HIGH or CE2 LOW), but no read/write operations are guaranteed below 4.5 V.

How many NC pins does CY62158H-45ZSXIT have, and are they safe to route to ground?

The CY62158H-45ZSXIT has 13 NC pins (pins 11, 12, 13, 14, 31, 32, 36, 37, 40, 41, 42, 43, 44 per datasheet Figure 1). These pins are not internally connected and must remain unconnected-neither grounded nor tied to VCC-as doing so may cause unpredictable behavior or increased leakage.

CY62158H-45ZSXIT Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: MOBL™

Package/Case:: 44-TSOP (0.400", 10.16mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Asynchronous

Memory Size:: 8Mbit

Memory Organization:: 1M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 45ns

Access Time:: 45 ns

Voltage - Supply:: 4.5V ~ 5.5V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 44-TSOP II

CY62158H-45ZSXIT FAQ

1.How can I place an order for CY62158H-45ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62158H-45ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62158H-45ZSXIT reliable?

The price and inventory of CY62158H-45ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62158H-45ZSXIT is usually 5 days.

3.What payment methods are accepted for CY62158H-45ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62158H-45ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62158H-45ZSXIT?

CY62158H-45ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62158H-45ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62158H-45ZSXIT?

For technical support, including CY62158H-45ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62158H-45ZSXIT requirements.

6.How does Aetrix verify that CY62158H-45ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY62158H-45ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62158H-45ZSXIT meets industry standards.

7.What is the process for return or replacement of CY62158H-45ZSXIT?

All CY62158H-45ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62158H-45ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62158H-45ZSXIT part is unused and in its original packaging.

Return procedure for CY62158H-45ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…