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Infineon Technologies CY62162G18-55BGXI
- Part No.:
- CY62162G18-55BGXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
CY62162G18-55BGXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 119PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,927
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Product details
Overview
CY62162G18-55BGXI from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM organized as 512K × 32 bits with embedded single-bit error-correcting code (ECC), 55 ns access time, 1.65–2.2 V supply range, and ultra-low standby current (max 26 µA). It serves as a high-reliability, low-power data buffer in portable industrial controllers requiring ECC-enabled memory retention.
For engineers reviewing the CY62162G18-55BGXI datasheet, CY62162G18-55BGXI pinout, CY62162G18-55BGXI application, or CY62162G18-55BGXI equivalent, key selection criteria include ECC support for fault-tolerant operation, dual chip enable (CE1/CE2) for flexible memory expansion, 119-ball PBGA package compatibility, and 1.0-V data retention capability under power loss.
Technical Context
This CMOS static RAM implements a full 512K × 32-bit array with dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors on-the-fly during read operations. The ERR pin asserts HIGH only upon successful single-bit correction-no automatic write-back is performed.
It supports two independent chip enables (CE1 active-low, CE2 active-high) and four byte enables (BA–BD) for granular 8-bit access across the 32-bit bus. Automatic power-down reduces ICC to ≤26 µA when CE1 is HIGH, CE2 is LOW, or all byte enables are deasserted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 32 bits = 16 Mbit total capacity; supports parallel 32-bit data transfers |
| Access Time | 55 ns at 1.65–2.2 V; defines maximum clock rate for synchronous interface timing |
| ECC Function | Single-bit error detection and correction per 32-bit word; ERR pin signals correction event |
| Standby Current | Max 26 µA at 1.65–2.2 V; enables >99% power reduction in deselected state |
| Data Retention Voltage | 1.0 V minimum; maintains stored data during brown-out or backup battery operation |
| Supply Range | 1.65 V to 2.2 V (primary); also supports 2.2 V to 3.6 V with speed derating to 45 ns |
| I/O Interface | TTL-compatible inputs/outputs; no level-shifting required for 1.8 V or 3.3 V host systems |
Pinout & Package
Package: 119-ball Fine-Pitch Ball Grid Array (FBGA), 11 mm × 13 mm, center power/ground pinout, RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting 512K-word addressing (2¹⁹ = 524,288) |
| I/O0–I/O31 | Bidirectional Data Bus | 32-bit parallel interface; high-impedance when CE1 HIGH, CE2 LOW, OE HIGH, or BA–BD HIGH |
| BA–BD | Byte Enable Inputs | Four independent 8-bit enables for selective write/read of I/O0–7, I/O8–15, I/O16–23, I/O24–31 |
| CE1, CE2 | Dual Chip Enables | CE1 active-low + CE2 active-high enable device; either signal alone can deselect memory |
| OE | Output Enable | Active-low control for output drivers; disables outputs when HIGH, regardless of CE state |
| WE | Write Enable | Active-low signal controlling write cycle initiation; must be LOW during valid address/data setup |
| ERR | Error Indication Output | Open-drain HIGH pulse indicates successful single-bit correction; no assertion on uncorrectable errors |
| VCC, GND | Power Supply | Multiple distributed VCC and GND balls ensure low-impedance power delivery and noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | Hardware-accelerated single-bit error correction per 32-bit word without CPU intervention |
| Ultra-Low Standby Power | 26 µA max at 1.8 V enables multi-year battery life in always-on portable instrumentation |
| Dual Chip Enable Architecture | Independent CE1/CE2 logic allows seamless integration into multi-chip memory banks with shared buses |
| 1.0-V Data Retention | Preserves memory contents during deep sleep or partial power loss-critical for fail-safe logging |
| Center-Power PBGA Layout | Optimized thermal and electrical performance via symmetric VCC/GND ball distribution |
Applications
| Industrial Data Logger | Medical Wearable Sensor Hub |
|---|---|
|
Use Scenario: Continuous acquisition of ECG, SpO₂, and motion sensor data with timestamped storage during battery-powered operation. IC Role / Device Role / Timing Role: Primary non-volatile buffer storing raw sensor frames before compression/transmission; ECC prevents corrupted logs due to radiation-induced bit flips. Use Value: 1.0-V data retention preserves last 72 hours of critical diagnostics even after main battery depletion. |
Use Scenario: Real-time fusion of accelerometer, gyroscope, and temperature data in a compact wearable patch. IC Role / Device Role / Timing Role: Low-latency SRAM staging memory for sensor fusion algorithms running on an ultra-low-power MCU. Use Value: 55 ns access time and 26 µA standby current extend wearable runtime beyond 14 days per charge. |
| Ruggedized Handheld Terminal | Smart Energy Meter Firmware Cache |
|
Use Scenario: Field-deployed barcode scanner operating in wide ambient temperatures (–40°C to +85°C) with intermittent connectivity. IC Role / Device Role / Timing Role: ECC-protected working memory for firmware execution and transaction buffering during offline operation. Use Value: Dual voltage range (1.65–2.2 V / 2.2–3.6 V) ensures compatibility with both Li-ion and supercapacitor backup sources. |
Use Scenario: Tamper-resistant electricity meter storing billing intervals, tariff tables, and cryptographic keys. IC Role / Device Role / Timing Role: Secure, error-resilient cache for AES-128 encryption keys and time-stamped consumption records. Use Value: ERR pin enables firmware-level logging of memory integrity events for regulatory audit compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV51232ALL-55NLI | No integrated ECC; requires external error-handling logic; 55 ns access, 3.3 V only; 119-ball BGA | Lacks hardware ECC correction-suitable only where software-based error mitigation is acceptable | Select if cost sensitivity outweighs reliability requirements and host processor has spare cycles for ECC emulation |
| Micron MT48LC16M32B2P-6A:G | Synchronous SDRAM (not SRAM); 16 Mbit × 32, 166 MHz clocked interface; no ECC; 90-ball BGA | Requires clock management and refresh cycles; incompatible with asynchronous SRAM control logic | Choose only for bandwidth-constrained systems needing burst transfers-not for deterministic latency or ECC needs |
Compared with IS62WV51232ALL-55NLI and MT48LC16M32B2P-6A:G, CY62162G18-55BGXI uniquely delivers hardware ECC, true asynchronous operation, and sub-30 µA standby in a drop-in-compatible 119-ball footprint-making it the sole option for safety-critical, battery-limited edge nodes.
Availability
CY62162G18-55BGXI is available at Aetrix Electronics and suitable for industrial data loggers, medical wearables, rugged handheld terminals, and smart energy meters requiring stable component supply across extended product lifecycles.
Supply support for CY62162G18-55BGXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the MoBL® SRAM portfolio, delivering high-reliability memory solutions for automotive, industrial, and IoT applications.
CY62162G18-55BGXI belongs to the MoBL® (More Battery Life™) SRAM family, engineered specifically for ultra-low-power, ECC-enhanced data buffering in portable and mission-critical embedded systems.
FAQ
Does CY62162G18-55BGXI support automatic error correction write-back?
No. The device performs single-bit error detection and correction during read operations, but does not automatically rewrite corrected data back to the memory array. The ERR pin signals correction occurrence, and system firmware must handle any required logging or recovery actions.
What is the function of the ERR pin, and how should it be interfaced?
The ERR pin is an open-drain output that asserts HIGH for ~20 ns upon successful single-bit correction during a read cycle. It must be pulled up externally (typically 10 kΩ to VCC). If unused, it should be left floating per datasheet guidance-no internal pull-up or pull-down is present.
Can CY62162G18-55BGXI operate at 1.8 V and still achieve 55 ns access time?
Yes. At VCC = 1.8 V (within the 1.65–2.2 V range), the device guarantees 55 ns maximum access time across the full industrial temperature range (–40°C to +85°C), with typical ICC of 29 mA and ISB2 of 7 µA.
Is the 119-ball PBGA package of CY62162G18-55BGXI compatible with standard reflow profiles?
Yes. The package complies with JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak temperature ≤260°C, time above liquidus 60–150 s). Thermal resistance values (θJA = 20.92°C/W) are validated for 2-layer PCB mounting.
CY62162G18-55BGXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
CY62162G18-55BGXI FAQ
1.How can I place an order for CY62162G18-55BGXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62162G18-55BGXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62162G18-55BGXI reliable?
The price and inventory of CY62162G18-55BGXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62162G18-55BGXI is usually 5 days.
3.What payment methods are accepted for CY62162G18-55BGXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62162G18-55BGXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62162G18-55BGXI?
CY62162G18-55BGXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62162G18-55BGXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62162G18-55BGXI?
For technical support, including CY62162G18-55BGXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62162G18-55BGXI requirements.
6.How does Aetrix verify that CY62162G18-55BGXI is sourced from the original manufacturer or authorized distributors?
All CY62162G18-55BGXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62162G18-55BGXI meets industry standards.
7.What is the process for return or replacement of CY62162G18-55BGXI?
All CY62162G18-55BGXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62162G18-55BGXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62162G18-55BGXI part is unused and in its original packaging.
Return procedure for CY62162G18-55BGXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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