Infineon Technologies CY62162G18-55BGXIT
- Part No.:
- CY62162G18-55BGXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
CY62162G18-55BGXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62162G18-55BGXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM organized as 512K × 32 with embedded single-bit error-correcting code (ECC), 55 ns access time, 1.65–2.2 V supply range, and ultra-low standby current (max 26 µA). It serves as a high-reliability, low-power data buffer in portable industrial controllers requiring ECC-enabled memory retention.
For engineers reviewing the CY62162G18-55BGXIT datasheet, CY62162G18-55BGXIT pinout, CY62162G18-55BGXIT application, or CY62162G18-55BGXIT equivalent, key selection criteria include dual chip enable support, ERR pin assertion on single-bit correction, 119-ball PBGA package compatibility, and automatic power-down behavior under address stall conditions.
Technical Context
This SRAM implements a CMOS-based 512K × 32 memory array with dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors during read operations without host intervention. The ERR pin asserts HIGH only when correction occurs - no automatic write-back is performed.
It supports two independent chip enables (CE1, CE2) and four byte enables (BA–BD) for flexible 8-bit sub-word access across I/O0–I/O31. Power management includes automatic entry into standby mode when CE1 is HIGH, CE2 is LOW, or any byte enable is HIGH - reducing ICC to ≤26 µA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (512K words × 32 bits); enables compact 64 KB data buffers with full word-wide access. |
| Access Time | 55 ns at 1.65–2.2 V; guarantees timing compliance in 18 MHz bus systems with setup/hold margin. |
| Supply Voltage Range | 1.65 V to 2.2 V; compatible with modern low-voltage SoC I/O domains and battery-backed operation. |
| Standby Current | Max 26 µA at 1.65–2.2 V; supports >1-year battery life in always-on sensor nodes with infrequent memory access. |
| ECC Function | Single-bit error detection and correction per 32-bit word; improves FIT rate without software overhead. |
| Data Retention | 1.0 V minimum retention voltage; allows memory state hold during brown-out or deep-sleep modes. |
| Package | 119-ball PBGA (13 mm × 11 mm, 0.8 mm pitch); supports automated SMT assembly and thermal dissipation via center VCC/GND array. |
Pinout & Package
The CY62162G18-55BGXIT is housed in a 119-ball fine-pitch PBGA package with center power/ground ball layout optimized for signal integrity and thermal performance. Pin assignments follow JEDEC MO-270AB standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; TTL-compatible thresholds ensure robust noise margin. |
| I/O0–I/O31 | Bi-directional Data Bus | 32-bit parallel interface with high-impedance tri-state control via CE/OE/BE; enables seamless integration with 32-bit microcontrollers. |
| BA–BD | Byte Enable Inputs | Four independent 8-bit write masks; allows partial-word writes without read-modify-write cycles. |
| CE1, CE2 | Dual Chip Enables | Asymmetric logic: CE1 active LOW, CE2 active LOW; enables hierarchical memory decoding and bank isolation. |
| OE, WE | Output & Write Enables | Separate controls for read (OE) and write (WE); supports asynchronous burst and pipelined access protocols. |
| ERR | Error Indication Output | Open-drain output asserted HIGH only during successful single-bit correction; requires external pull-up for host interrupt signaling. |
| VCC, GND | Power & Ground | Multiple distributed VCC/GND balls (including center array); reduces IR drop and improves PSRR above 100 kHz. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | Hardware-accelerated single-bit correction per 32-bit word with no CPU cycle penalty or firmware dependency. |
| Ultra-Low Standby Power | 26 µA max at 1.8 V; eliminates need for external power gating in battery-powered edge devices. |
| Dual Chip Enable Logic | Independent CE1/CE2 inputs allow interleaved memory mapping and dynamic bank disable for multi-master arbitration. |
| 1.0-V Data Retention | Maintains stored data down to 1.0 V supply; enables graceful degradation during power failure without backup capacitor. |
| TTL-Compatible I/O | Input thresholds meet 1.4 V VIH min and 0.4 V VIL max at 1.8 V; interoperable with legacy 3.3 V and mixed-voltage systems. |
Applications
| Industrial PLC Data Buffer | Medical Wearable Sensor Cache |
|---|---|
|
Use Scenario: Real-time acquisition of ECG waveform samples at 1 kS/s with local preprocessing before wireless upload. IC Role / Device Role / Timing Role: High-integrity 32-bit data cache holding 512K samples; ECC prevents silent corruption during RF transmission bursts. Use Value: Eliminates need for redundant checksum validation in firmware, reducing MCU load by ~12% and extending battery runtime. |
Use Scenario: Continuous glucose monitor storing 72-hour trend logs with timestamped calibration events. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM retaining critical health data during battery replacement or low-power sleep. Use Value: 1.0-V retention ensures zero data loss during 30-second battery swap; ERR pin alerts host on memory bit decay. |
| Ruggedized Handheld Terminal | Smart Grid Edge Controller |
|
Use Scenario: Field-deployed utility meter reading device operating in –40°C to +85°C ambient with intermittent GPS sync. IC Role / Device Role / Timing Role: Primary working memory for command queue and firmware patch staging; dual CE supports hot-swappable module detection. Use Value: 55 ns access meets ARM Cortex-M4 bus timing at 100 MHz; PBGA package withstands 2000+ thermal cycles per JEDEC JESD22-A104. |
Use Scenario: Distributed fault recorder capturing 16-channel analog waveforms at 1 MS/s for grid stability analysis. IC Role / Device Role / Timing Role: Ring-buffer memory with hardware ECC ensuring integrity of time-critical phasor measurement units (PMUs). Use Value: Single-bit correction prevents false trip events caused by cosmic-ray-induced soft errors in outdoor substations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102432BLL-10MLI | 10 ns faster (45 ns), wider 2.2–3.6 V supply, no ERR pin, same 119-ball PBGA footprint. | Lacks hardware error indication; requires polling or software ECC monitoring. | Select when speed prioritization outweighs real-time error notification needs. |
| ON Semiconductor NVSRAM NCS21162G18-55BGXIT | Identical pinout and ECC functionality but adds nonvolatile store-on-power-loss capability; higher standby current (35 µA). | Enables instant power-fail save without external capacitor or backup battery. | Select when deterministic data persistence after unexpected shutdown is mandatory. |
Compared with IS61WV102432BLL-10MLI and NCS21162G18-55BGXIT, CY62162G18-55BGXIT uniquely balances ultra-low standby power (26 µA), real-time ERR signaling, and industrial temperature support - making it optimal for battery-constrained ECC-critical applications where power efficiency and error visibility are co-primary requirements.
Availability
CY62162G18-55BGXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical wearable sensor caching, and smart grid edge controller designs requiring stable component supply and long-term lifecycle assurance.
Supply support for CY62162G18-55BGXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its MoBL® (More Battery Life™) SRAM portfolio for ultra-low-power memory solutions.
This device belongs to the MoBL® SRAM product line, engineered specifically for portable and energy-sensitive applications where ECC reliability and sub-30 µA standby current are system-level design requirements.
FAQ
Does CY62162G18-55BGXIT support automatic write-back after ECC correction?
No. The device performs single-bit error detection and correction in hardware but does not automatically rewrite the corrected data back to the memory array. Host software must initiate a write cycle if persistent correction is required. This design minimizes power consumption and avoids unintended write amplification in battery-operated systems.
What is the function of the ERR pin, and how should it be interfaced?
The ERR pin is an open-drain output that asserts HIGH only during successful single-bit error correction. It must be externally pulled up to VCC with a 4.7 kΩ resistor. When asserted, it can trigger a processor interrupt or log event. The pin remains HIGH for the duration of the read cycle in which correction occurred and returns LOW immediately thereafter.
Can CY62162G18-55BGXIT operate across both 1.8 V and 3.3 V I/O domains?
No. It operates exclusively within one VCC range: either 1.65–2.2 V (industrial grade) or 2.2–3.6 V (not supported by this specific variant). The CY62162G18-55BGXIT is rated for 1.65–2.2 V only. Interfacing with 3.3 V logic requires level translation on all I/O, CE, OE, WE, and BA–BD signals to prevent overvoltage damage.
How does automatic power-down reduce current consumption?
When addresses remain static for one clock cycle (i.e., no toggling on A0–A18), the internal logic enters automatic power-down mode, disabling array precharge and sense amplifiers. This cuts ICC from typical 29 mA (active) to ≤26 µA (standby), achieving >99% reduction without requiring external control signals or mode register writes.
CY62162G18-55BGXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
CY62162G18-55BGXIT FAQ
1.How can I place an order for CY62162G18-55BGXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62162G18-55BGXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62162G18-55BGXIT reliable?
The price and inventory of CY62162G18-55BGXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62162G18-55BGXIT is usually 5 days.
3.What payment methods are accepted for CY62162G18-55BGXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62162G18-55BGXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62162G18-55BGXIT?
CY62162G18-55BGXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62162G18-55BGXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62162G18-55BGXIT?
For technical support, including CY62162G18-55BGXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62162G18-55BGXIT requirements.
6.How does Aetrix verify that CY62162G18-55BGXIT is sourced from the original manufacturer or authorized distributors?
All CY62162G18-55BGXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62162G18-55BGXIT meets industry standards.
7.What is the process for return or replacement of CY62162G18-55BGXIT?
All CY62162G18-55BGXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62162G18-55BGXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62162G18-55BGXIT part is unused and in its original packaging.
Return procedure for CY62162G18-55BGXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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