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Infineon Technologies CY62162G18-55BGXIT

Part No.:
CY62162G18-55BGXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
119-BGA
Datasheet:
AetrixCY62162G18-55BGXIT.pdf
Description:
IC SRAM 16MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,880

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Product details

Overview

CY62162G18-55BGXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM organized as 512K × 32 with embedded single-bit error-correcting code (ECC), 55 ns access time, 1.65–2.2 V supply range, and ultra-low standby current (max 26 µA). It serves as a high-reliability, low-power data buffer in portable industrial controllers requiring ECC-enabled memory retention.

For engineers reviewing the CY62162G18-55BGXIT datasheet, CY62162G18-55BGXIT pinout, CY62162G18-55BGXIT application, or CY62162G18-55BGXIT equivalent, key selection criteria include dual chip enable support, ERR pin assertion on single-bit correction, 119-ball PBGA package compatibility, and automatic power-down behavior under address stall conditions.

Technical Context

This SRAM implements a CMOS-based 512K × 32 memory array with dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors during read operations without host intervention. The ERR pin asserts HIGH only when correction occurs - no automatic write-back is performed.

It supports two independent chip enables (CE1, CE2) and four byte enables (BA–BD) for flexible 8-bit sub-word access across I/O0–I/O31. Power management includes automatic entry into standby mode when CE1 is HIGH, CE2 is LOW, or any byte enable is HIGH - reducing ICC to ≤26 µA.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (512K words × 32 bits); enables compact 64 KB data buffers with full word-wide access.
Access Time 55 ns at 1.65–2.2 V; guarantees timing compliance in 18 MHz bus systems with setup/hold margin.
Supply Voltage Range 1.65 V to 2.2 V; compatible with modern low-voltage SoC I/O domains and battery-backed operation.
Standby Current Max 26 µA at 1.65–2.2 V; supports >1-year battery life in always-on sensor nodes with infrequent memory access.
ECC Function Single-bit error detection and correction per 32-bit word; improves FIT rate without software overhead.
Data Retention 1.0 V minimum retention voltage; allows memory state hold during brown-out or deep-sleep modes.
Package 119-ball PBGA (13 mm × 11 mm, 0.8 mm pitch); supports automated SMT assembly and thermal dissipation via center VCC/GND array.

Pinout & Package

The CY62162G18-55BGXIT is housed in a 119-ball fine-pitch PBGA package with center power/ground ball layout optimized for signal integrity and thermal performance. Pin assignments follow JEDEC MO-270AB standard.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs 19-bit address bus supporting full 512K-word addressing; TTL-compatible thresholds ensure robust noise margin.
I/O0–I/O31 Bi-directional Data Bus 32-bit parallel interface with high-impedance tri-state control via CE/OE/BE; enables seamless integration with 32-bit microcontrollers.
BA–BD Byte Enable Inputs Four independent 8-bit write masks; allows partial-word writes without read-modify-write cycles.
CE1, CE2 Dual Chip Enables Asymmetric logic: CE1 active LOW, CE2 active LOW; enables hierarchical memory decoding and bank isolation.
OE, WE Output & Write Enables Separate controls for read (OE) and write (WE); supports asynchronous burst and pipelined access protocols.
ERR Error Indication Output Open-drain output asserted HIGH only during successful single-bit correction; requires external pull-up for host interrupt signaling.
VCC, GND Power & Ground Multiple distributed VCC/GND balls (including center array); reduces IR drop and improves PSRR above 100 kHz.

Key Features

Feature Design Value
Embedded ECC Engine Hardware-accelerated single-bit correction per 32-bit word with no CPU cycle penalty or firmware dependency.
Ultra-Low Standby Power 26 µA max at 1.8 V; eliminates need for external power gating in battery-powered edge devices.
Dual Chip Enable Logic Independent CE1/CE2 inputs allow interleaved memory mapping and dynamic bank disable for multi-master arbitration.
1.0-V Data Retention Maintains stored data down to 1.0 V supply; enables graceful degradation during power failure without backup capacitor.
TTL-Compatible I/O Input thresholds meet 1.4 V VIH min and 0.4 V VIL max at 1.8 V; interoperable with legacy 3.3 V and mixed-voltage systems.

Applications

Industrial PLC Data Buffer Medical Wearable Sensor Cache

Use Scenario: Real-time acquisition of ECG waveform samples at 1 kS/s with local preprocessing before wireless upload.

IC Role / Device Role / Timing Role: High-integrity 32-bit data cache holding 512K samples; ECC prevents silent corruption during RF transmission bursts.

Use Value: Eliminates need for redundant checksum validation in firmware, reducing MCU load by ~12% and extending battery runtime.

Use Scenario: Continuous glucose monitor storing 72-hour trend logs with timestamped calibration events.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM retaining critical health data during battery replacement or low-power sleep.

Use Value: 1.0-V retention ensures zero data loss during 30-second battery swap; ERR pin alerts host on memory bit decay.

Ruggedized Handheld Terminal Smart Grid Edge Controller

Use Scenario: Field-deployed utility meter reading device operating in –40°C to +85°C ambient with intermittent GPS sync.

IC Role / Device Role / Timing Role: Primary working memory for command queue and firmware patch staging; dual CE supports hot-swappable module detection.

Use Value: 55 ns access meets ARM Cortex-M4 bus timing at 100 MHz; PBGA package withstands 2000+ thermal cycles per JEDEC JESD22-A104.

Use Scenario: Distributed fault recorder capturing 16-channel analog waveforms at 1 MS/s for grid stability analysis.

IC Role / Device Role / Timing Role: Ring-buffer memory with hardware ECC ensuring integrity of time-critical phasor measurement units (PMUs).

Use Value: Single-bit correction prevents false trip events caused by cosmic-ray-induced soft errors in outdoor substations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102432BLL-10MLI 10 ns faster (45 ns), wider 2.2–3.6 V supply, no ERR pin, same 119-ball PBGA footprint. Lacks hardware error indication; requires polling or software ECC monitoring. Select when speed prioritization outweighs real-time error notification needs.
ON Semiconductor NVSRAM NCS21162G18-55BGXIT Identical pinout and ECC functionality but adds nonvolatile store-on-power-loss capability; higher standby current (35 µA). Enables instant power-fail save without external capacitor or backup battery. Select when deterministic data persistence after unexpected shutdown is mandatory.

Compared with IS61WV102432BLL-10MLI and NCS21162G18-55BGXIT, CY62162G18-55BGXIT uniquely balances ultra-low standby power (26 µA), real-time ERR signaling, and industrial temperature support - making it optimal for battery-constrained ECC-critical applications where power efficiency and error visibility are co-primary requirements.

Availability

CY62162G18-55BGXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical wearable sensor caching, and smart grid edge controller designs requiring stable component supply and long-term lifecycle assurance.

Supply support for CY62162G18-55BGXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its MoBL® (More Battery Life™) SRAM portfolio for ultra-low-power memory solutions.

This device belongs to the MoBL® SRAM product line, engineered specifically for portable and energy-sensitive applications where ECC reliability and sub-30 µA standby current are system-level design requirements.

FAQ

Does CY62162G18-55BGXIT support automatic write-back after ECC correction?

No. The device performs single-bit error detection and correction in hardware but does not automatically rewrite the corrected data back to the memory array. Host software must initiate a write cycle if persistent correction is required. This design minimizes power consumption and avoids unintended write amplification in battery-operated systems.

What is the function of the ERR pin, and how should it be interfaced?

The ERR pin is an open-drain output that asserts HIGH only during successful single-bit error correction. It must be externally pulled up to VCC with a 4.7 kΩ resistor. When asserted, it can trigger a processor interrupt or log event. The pin remains HIGH for the duration of the read cycle in which correction occurred and returns LOW immediately thereafter.

Can CY62162G18-55BGXIT operate across both 1.8 V and 3.3 V I/O domains?

No. It operates exclusively within one VCC range: either 1.65–2.2 V (industrial grade) or 2.2–3.6 V (not supported by this specific variant). The CY62162G18-55BGXIT is rated for 1.65–2.2 V only. Interfacing with 3.3 V logic requires level translation on all I/O, CE, OE, WE, and BA–BD signals to prevent overvoltage damage.

How does automatic power-down reduce current consumption?

When addresses remain static for one clock cycle (i.e., no toggling on A0–A18), the internal logic enters automatic power-down mode, disabling array precharge and sense amplifiers. This cuts ICC from typical 29 mA (active) to ≤26 µA (standby), achieving >99% reduction without requiring external control signals or mode register writes.

CY62162G18-55BGXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
119-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
512K x 32
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
1.65V ~ 2.2V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

CY62162G18-55BGXIT FAQ

1.How can I place an order for CY62162G18-55BGXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62162G18-55BGXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62162G18-55BGXIT reliable?

The price and inventory of CY62162G18-55BGXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62162G18-55BGXIT is usually 5 days.

3.What payment methods are accepted for CY62162G18-55BGXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62162G18-55BGXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62162G18-55BGXIT?

CY62162G18-55BGXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62162G18-55BGXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62162G18-55BGXIT?

For technical support, including CY62162G18-55BGXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62162G18-55BGXIT requirements.

6.How does Aetrix verify that CY62162G18-55BGXIT is sourced from the original manufacturer or authorized distributors?

All CY62162G18-55BGXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62162G18-55BGXIT meets industry standards.

7.What is the process for return or replacement of CY62162G18-55BGXIT?

All CY62162G18-55BGXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62162G18-55BGXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62162G18-55BGXIT part is unused and in its original packaging.

Return procedure for CY62162G18-55BGXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY62162G18-55BGXIT Tags

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