Infineon Technologies CY62162G30-45BGXI
- Part No.:
- CY62162G30-45BGXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
CY62162G30-45BGXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62162G30-45BGXI from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM organized as 512K × 32 with embedded single-bit error-correcting code (ECC), 45 ns access time, 1.65–3.6 V dual-voltage operation, and ultra-low standby current (5.5 µA typical). It serves as a high-reliability, low-power data buffer in portable industrial controllers requiring ECC-protected memory.
For engineers reviewing the CY62162G30-45BGXI datasheet, CY62162G30-45BGXI pinout, CY62162G30-45BGXI application, or CY62162G30-45BGXI equivalent, key selection criteria include ECC-enabled bit-error resilience, dual chip enable for memory expansion, 119-ball PBGA package compatibility, and automatic power-down behavior under address inactivity.
Technical Context
This SRAM implements a CMOS-based 512K × 32 architecture with dedicated ECC encoder/decoder logic that detects and corrects single-bit errors during read operations without host intervention. The ERR pin asserts HIGH upon correction, enabling real-time fault reporting to the host processor.
It supports two independent chip enables (CE1, CE2) and four byte enables (BA–BD) for flexible 8-bit sub-word access across the 32-bit bus. Power management includes automatic power-down when CE1/CE2/BA–BD are inactive, reducing ICC to ≤16 µA at VCC = 2.2–3.6 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 32 bits = 16 Mbit total; enables full-word parallel access with byte-select granularity via BA–BD. |
| Access Time | 45 ns max at VCC = 2.2–3.6 V; ensures timing compliance in 22.22 MHz synchronous systems. |
| ECC Function | Single-bit error detection and correction per 32-bit word; no automatic write-back - requires host acknowledgment of ERR assertion. |
| Supply Voltage Range | 1.65–2.2 V or 2.2–3.6 V; supports dual-voltage system integration without level shifters. |
| Standby Current | 5.5 µA typical / 16 µA max at VCC = 2.2–3.6 V; enables >99% power reduction in deselected state. |
| Data Retention | 1.0 V minimum VCC; maintains stored data during brown-out or battery-backed sleep modes. |
| I/O Interface | TTL-compatible inputs/outputs; simplifies interfacing with legacy microcontrollers and FPGAs. |
Pinout & Package
Package: 119-ball Fine-Pitch Ball Grid Array (FBGA), 10 mm × 13 mm, center power/ground pinout, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting 512K-word addressing; A0 least significant. |
| I/O0–I/O31 | Bidirectional Data Bus | 32-bit parallel interface; high-impedance when CE1 HIGH, CE2 LOW, OE HIGH, or BA–BD HIGH. |
| BA–BD | Byte Enable Inputs | Four independent 8-bit byte selects; BA controls I/O0–I/O7, BD controls I/O24–I/O31. |
| CE1, CE2 | Dual Chip Enables | Active-LOW CE1 and active-HIGH CE2 provide hierarchical chip select for multi-SRAM systems. |
| OE, WE | Output & Write Enables | OE LOW enables read output; WE LOW initiates write; both must be controlled for mode selection. |
| ERR | Error Indication Output | Open-drain output asserted HIGH during single-bit ECC correction; requires external pull-up. |
| VCC, GND | Power & Ground | Multiple distributed VCC/GND balls ensure low-impedance supply delivery and signal integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Logic | Hardware-accelerated single-bit error correction per 32-bit word, eliminating software overhead and latency penalties. |
| Ultra-Low Standby Power | 5.5 µA typical ISB2 at 3.0 V enables multi-year battery life in always-on sensor nodes and wearables. |
| Dual-Voltage Operation | Supports 1.65–2.2 V and 2.2–3.6 V rails natively - eliminates need for external voltage translators in mixed-supply SoC designs. |
| Automatic Power-Down | Reduces ICC by >99% when address lines are static and CE/BE signals are inactive - no host firmware control required. |
| 119-Ball PBGA with Center Power | Optimized thermal and electrical performance: low θJA (20.92 °C/W) and minimized power delivery impedance. |
Applications
| Medical Wearable Monitor | Industrial PLC Data Logger |
|---|---|
|
Use Scenario: Continuous ECG waveform buffering with long-term battery operation and data integrity requirements. IC Role / Device Role / Timing Role: ECC-protected SRAM storing raw sensor samples prior to DSP processing; ERR pin triggers diagnostic flag on detected memory corruption. Use Value: Prevents silent data corruption in critical health metrics; 5.5 µA standby extends coin-cell life beyond 3 years. |
Use Scenario: Localized logging of machine status and sensor readings in factory-floor controllers with intermittent network upload. IC Role / Device Role / Timing Role: Nonvolatile-cached buffer holding timestamped I/O states; retains valid data down to 1.0 V during brown-out events. Use Value: Eliminates external backup capacitors or EEPROM writes; reduces BOM count and firmware complexity. |
| Avionics Flight Data Recorder | Smart Energy Meter |
|
Use Scenario: High-reliability short-term storage of flight parameters before transfer to nonvolatile storage. IC Role / Device Role / Timing Role: Fault-tolerant RAM capturing telemetry at 1 kHz sampling; ERR signal feeds into system health monitoring subsystem. Use Value: Meets DO-254 functional safety requirements for transient-induced bit errors without redundant memory duplication. |
Use Scenario: Tamper-resistant energy consumption tracking with secure local storage between GSM uploads. IC Role / Device Role / Timing Role: ECC-secured buffer for billing-critical kWh counters; operates across wide temperature range (–40°C to +85°C). Use Value: Guarantees metering accuracy despite radiation-induced soft errors in outdoor installations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102432BLL-10MLI | No integrated ECC; requires external error-handling logic; 10 ns faster (10 ns access), but higher 35 mA active current. | Suitable where speed dominates over reliability; not compliant with ECC-mandated safety standards. | Select only if system-level ECC implementation is already present and power budget allows >6× higher standby draw. |
| Micron MT48LC16M32B2B5-6A:J | SDRAM architecture; requires refresh controller; no ECC logic; 3.3 V only; 6 ns clock-to-data. | Used in high-throughput streaming buffers; incompatible with simple SRAM interface and ECC reporting. | Choose only for bandwidth-constrained applications with existing SDRAM controller infrastructure. |
Compared with IS61WV102432BLL-10MLI and MT48LC16M32B2B5-6A:J, CY62162G30-45BGXI uniquely delivers hardware ECC, ultra-low µA standby, and true SRAM simplicity - making it optimal for safety-critical, battery-limited edge devices where data integrity cannot be offloaded to software.
Availability
CY62162G30-45BGXI is available at Aetrix Electronics and suitable for medical wearables, industrial PLCs, avionics recorders, and smart energy meters requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.
Supply support for CY62162G30-45BGXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with strong industrial and safety-critical focus.
CY62162G30-45BGXI belongs to the MoBL® (More Battery Life™) SRAM product line, designed specifically for ultra-low-power, ECC-enhanced memory in portable and mission-critical embedded systems.
FAQ
Does CY62162G30-45BGXI support automatic error correction without host intervention?
Yes - the device performs single-bit error detection and correction autonomously during read cycles using on-die ECC logic. However, it does not perform automatic write-back; the ERR pin asserts HIGH to notify the host, which may then initiate corrective action or logging.
What is the function of the dual chip enables (CE1 and CE2)?
CE1 is active-LOW and CE2 is active-HIGH; both must be asserted simultaneously (CE1 LOW, CE2 HIGH) for normal operation. This dual-enable scheme enables hierarchical memory mapping in multi-chip systems and prevents partial selection glitches during address transitions.
Can CY62162G30-45BGXI operate at 1.8 V and still meet 45 ns access time?
No - the 45 ns speed grade is specified only for the 2.2–3.6 V VCC range. At 1.65–2.2 V, the device is rated for 55 ns access time (CY62162G18 variant); attempting 45 ns timing at 1.8 V violates AC specifications and risks data invalidation.
Is the ERR pin open-drain, and what pull-up value is recommended?
Yes - ERR is an open-drain output requiring an external pull-up resistor. A 4.7 kΩ resistor to VCC is recommended per Cypress application guidance; this ensures fast rise time while limiting current to <100 µA during assertion.
CY62162G30-45BGXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
CY62162G30-45BGXI FAQ
1.How can I place an order for CY62162G30-45BGXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62162G30-45BGXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62162G30-45BGXI reliable?
The price and inventory of CY62162G30-45BGXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62162G30-45BGXI is usually 5 days.
3.What payment methods are accepted for CY62162G30-45BGXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62162G30-45BGXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62162G30-45BGXI?
CY62162G30-45BGXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62162G30-45BGXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62162G30-45BGXI?
For technical support, including CY62162G30-45BGXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62162G30-45BGXI requirements.
6.How does Aetrix verify that CY62162G30-45BGXI is sourced from the original manufacturer or authorized distributors?
All CY62162G30-45BGXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62162G30-45BGXI meets industry standards.
7.What is the process for return or replacement of CY62162G30-45BGXI?
All CY62162G30-45BGXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62162G30-45BGXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62162G30-45BGXI part is unused and in its original packaging.
Return procedure for CY62162G30-45BGXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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