Infineon Technologies CY62167DV30LL-55BVXI

Overview

CY62167DV30LL-55BVXI from Cypress Semiconductor is a 16-Mbit (1 M × 16) MoBL® CMOS static RAM with ultra-low active current (2 mA at 1 MHz), 55 ns access time, and dual-package support (48-ball VFBGA / 48-pin TSOP-I). It operates across 2.2–3.6 V, features automatic power-down reducing standby current to 2.5 µA, and supports byte-wide write enable via BHE/ BLE for embedded memory expansion in portable systems.

For engineers reviewing the CY62167DV30LL-55BVXI datasheet, CY62167DV30LL-55BVXI pinout, CY62167DV30LL-55BVXI application, or CY62167DV30LL-55BVXI equivalent, key selection criteria include its 55 ns read cycle time, 2.5 µA ISB2 standby current at 3.6 V, configurable 1M×16/2M×8 organization, and industrial temperature range (–40°C to +85°C).

Technical Context

This SRAM implements a high-speed, low-power CMOS architecture with independent byte enable logic (BHE/BLE) enabling selective 8-bit writes within the 16-bit data bus. Its automatic power-down circuit activates when CE1 is HIGH or CE2 is LOW, cutting ICC by >99% during address inactivity.

The device supports two physical configurations: as a 1 M × 16 SRAM (BYTE tied to VCC in TSOP-I) or as a 2 M × 8 SRAM (BYTE tied to VSS, A20 enabled on I/O15). Input/output pins enter high-impedance state under four conditions: chip deselect, OE HIGH, both BHE/BLE HIGH, or during write cycles.

Key Specifications

Pinout & Package

Available in 48-ball VFBGA (ball pitch 0.5 mm) and 48-pin TSOP-I packages. Both packages support identical signal mapping except for BYTE pin function in TSOP-I (must be tied to VCC for 1M×16 mode).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Compared with IS61LV102416AL-10TLI and AS6C1008-55PCN, the CY62167DV30LL-55BVXI uniquely delivers 2.2 V compatibility, integrated auto power-down, and hardware-configurable organization-reducing BOM count and firmware complexity in battery-constrained designs.

Availability

CY62167DV30LL-55BVXI is available at Aetrix Electronics and suitable for cellular baseband memory, portable medical monitor buffers, and industrial PLC data loggers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY62167DV30LL-55BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC mixed-signal arrays, and USB/USB-C solutions.

The CY62167DV30 belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power portable electronics where extended battery runtime and seamless integration with 16-bit microcontrollers are critical.

FAQ

What is the minimum V_CC required to retain data in CY62167DV30LL-55BVXI?

The device guarantees data retention down to 1.5 V V_CC, as specified in the Data Retention Characteristics table. At this voltage, ICCDR remains ≤10 µA, allowing operation from backup coin cells or brown-out conditions without data loss. This is validated across the full industrial temperature range and does not require external refresh or hold signals.

Can CY62167DV30LL-55BVXI operate in 2 M × 8 mode using the 48-ball VFBGA package?

No. The 2 M × 8 configuration is only supported in the 48-pin TSOP-I package, where the BYTE pin is accessible and used to select mode (VSS = 2M×8). In the VFBGA package, BYTE is not bonded out; the device functions exclusively as 1 M × 16. Pin 45 (A20) and unused I/O pins are not available in VFBGA.

How does automatic power-down activate, and what signals trigger it?

Automatic power-down activates when CE1 is HIGH (≥ V_CC − 0.2 V) OR CE2 is LOW (≤ 0.2 V), regardless of OE, WE, or address activity. It does not require firmware control. During this state, ICC drops to ≤22 µA (max) and outputs go high-Z. Power-up occurs within 0 ns (tPU = 0) upon re-enabling CE1/CE2.

Is CY62167DV30LL-55BVXI RoHS-compliant and halogen-free?

Yes. The "-55BVXI" suffix indicates a Pb-free, RoHS-compliant, and halogen-free version in VFBGA packaging. Cypress documentation confirms compliance with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and IPC/JEDEC J-STD-033 handling requirements for both VFBGA and TSOP-I variants.