Infineon Technologies CY62167DV30LL-55ZXI

Overview

CY62167DV30LL-55ZXI from Cypress Semiconductor is a 16-Mbit (1 M × 16) MoBL® CMOS static RAM with ultra-low active current (2 mA typical at 1 MHz), 2.2–3.6 V supply range, and 55 ns access time. It supports byte-wide or word-wide memory mapping via BHE/ BLE controls and features automatic power-down for battery-sensitive portable systems including cellular handsets and handheld medical monitors.

For engineers reviewing the CY62167DV30LL-55ZXI datasheet, CY62167DV30LL-55ZXI pinout, CY62167DV30LL-55ZXI application, or CY62167DV30LL-55ZXI equivalent, key selection criteria include standby current (2.5 µA typ), TSOP-I/VFBGA package compatibility, 16-bit data bus support, and dual chip enable (CE1/CE2) logic for seamless memory expansion in embedded controllers.

Technical Context

This SRAM implements a synchronous, non-volatile-retentive CMOS cell array organized as 1,048,576 words × 16 bits, with independent high- and low-byte enables (BHE/BLE) enabling flexible 8-bit or 16-bit interface configurations. Address decoding covers A0–A19 (20-bit), supporting full 1 M × 16 operation or reconfigured 2 M × 8 mode when BYTE is tied to VSS in TSOP-I packages.

Power management relies on dual chip enables (CE1 HIGH or CE2 LOW) and simultaneous BHE/BLE HIGH to trigger automatic power-down, reducing ICC to ≤22 µA. Output drivers feature controlled slew rates and guaranteed tri-state timing (tLZOE = 5 ns, tHZOE = 20 ns), ensuring signal integrity in mixed-signal SoC interfaces.

Key Specifications

Pinout & Package

Available in 48-ball VFBGA (6 mm × 8 mm, 0.5 mm pitch) and 48-pin TSOP-I (12 mm × 20 mm) packages. Both support 1 M × 16 configuration; TSOP-I allows 2 M × 8 mode via BYTE pin routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Compared with IS61WV102416BLL-10TLI and AS6C1008-55PCN, CY62167DV30LL-55ZXI uniquely balances sub-3 µA standby, configurable 8/16-bit interface, and deterministic auto-power-down-making it optimal for energy-aware embedded systems where memory bandwidth and battery life co-constrain design.

Availability

CY62167DV30LL-55ZXI is available at Aetrix Electronics and suitable for portable medical devices, industrial PLCs, automotive infotainment boot caches, and wearable health monitors requiring stable component supply across extended product lifecycles.

Supply support for CY62167DV30LL-55ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power memory and microcontroller solutions for embedded systems, with core expertise in SRAM, NOR flash, and PSoC architecture.

CY62167DV30 belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power portable electronics where milliamp-level active current and microamp-level standby draw directly impact runtime and thermal design.

FAQ

What is the minimum V_CC required to retain data in CY62167DV30LL-55ZXI?

The device guarantees data retention down to 1.5 V, as specified in the Data Retention Characteristics table. At this voltage, ICCDR remains ≤10 µA, and no external backup capacitor is needed. Operation below 2.2 V is not supported for active read/write cycles, but retention is maintained during brown-out conditions until V_CC recovers to ≥2.2 V with proper ramp timing (≥100 µs).

Can CY62167DV30LL-55ZXI operate in 2 M × 8 mode using the VFBGA package?

No. The 2 M × 8 configuration is only supported in the 48-pin TSOP-I package, where the BYTE pin (Pin 45) is routed to A20 and BHE/BLE/I/O8–I/O14 are designated DNU. In the 48-ball VFBGA package, Pin 45 is a DNU ball and A20 is not exposed; the device operates exclusively in 1 M × 16 mode with full 16-bit data bus utilization.

How does automatic power-down activate, and what signals must be held stable?

Automatic power-down activates when CE1 ≥ V_CC − 0.2 V OR CE2 ≤ 0.2 V, with all address/data inputs held static (f = 0). During this state, outputs enter high-Z, and ICC drops to ≤22 µA. OE, WE, BHE, and BLE may float or be driven, but their states do not affect power-down entry-only CE1/CE2 logic levels and address stability determine activation.

Is CY62167DV30LL-55ZXI RoHS-compliant and halogen-free?

Yes. The "-ZXI" suffix denotes a Pb-free, RoHS-compliant, and halogen-free version in a 48-ball VFBGA package. Cypress documentation confirms compliance with JEDEC JS709B and IPC-1752A standards. The TSOP-I variant (e.g., -55ZAI) also meets these requirements, with full material declarations available in Cypress's Product Change Notices (PCNs) #14-123 and #15-089.