Infineon Technologies CY62167ESL-55FNXIT

Overview

CY62167ESL-55FNXIT from Cypress Semiconductor is a 16-Mbit (1 M × 16 / 2 M × 8) MoBL® CMOS Static RAM with 55 ns access time, 1.65–1.95 V / 2.2–3.6 V / 4.5–5.5 V wide supply voltage support, –40 °C to +85 °C industrial temperature range, and ultra-low standby current (1.5 µA typical at 25 °C). It serves as main or buffer memory in portable embedded systems requiring battery longevity and fast random-access data retention.

For engineers reviewing the CY62167ESL-55FNXIT datasheet, CY62167ESL-55FNXIT pinout, CY62167ESL-55FNXIT application, or CY62167ESL-55FNXIT equivalent, key selection criteria include dual-voltage operation compatibility, byte-selectable 16-bit I/O architecture, automatic CE-driven power-down, WLCSP package thermal resistance (θ_JA = 26.54 °C/W), and guaranteed 55 ns read/write timing across full industrial temperature range.

Technical Context

The CY62167ESL-55FNXIT implements a 1M × 16 SRAM array with independent Byte High Enable (BHE) and Byte Low Enable (BLE) for selective 8-bit writes, supporting both 16-bit and 2M × 8 configurations. Its automatic power-down circuit reduces ICC by 99% when CE1 is HIGH or CE2 is LOW or both BHE/ BLE are HIGH.

It features CMOS-compatible input thresholds (VIH = 1.4 V min at 1.65–1.95 V VCC), tri-state output control via OE/CE/BHE/ BLE, and data retention down to 1.0 V VCC with ICCDR ≤ 10.0 µA. All AC timing parameters-including tRC = 55 ns, tDOE = 25 ns, and tPD = 55 ns-are specified over –40 °C to +85 °C and full VCC ranges.

Key Specifications

Pinout & Package

60-pin Wafer-Level Chip Scale Package (WLCSP) with 0.4 mm ball pitch, ball-up view, and NC (no-connect) balls on corners. Thermal resistance θ_JA = 26.54 °C/W (4-layer PCB), θ_JC = 0.11 °C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density low-power SRAM applications.

Compared with IS62WV102416BLL-55NLI and R1LV1616RSA-55PB, CY62167ESL-55FNXIT uniquely supports three disjoint voltage rails, achieves lowest ISB2 (1.5 µA), and delivers guaranteed 55 ns timing across full industrial temperature range-making it optimal for multi-voltage portable and automotive-qualified designs.

Availability

CY62167ESL-55FNXIT is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC I/O buffers, wireless sensor nodes, and automotive infotainment display caches requiring stable component supply across extended temperature and voltage ranges.

Supply support for CY62167ESL-55FNXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and consumer applications.

The CY62167ESL belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power portable electronics where extended battery life and small form factor are primary design constraints.

FAQ

What voltage ranges does CY62167ESL-55FNXIT support, and how do they affect system design?

CY62167ESL-55FNXIT supports three non-overlapping VCC ranges: 1.65–1.95 V, 2.2–3.6 V, and 4.5–5.5 V. This eliminates need for external level shifters when interfacing with mixed-supply SoCs or legacy 5 V peripherals. Each range has distinct VIH/VIL thresholds and timing specifications validated across –40 °C to +85 °C.

How does the automatic power-down feature reduce system power consumption?

When CE1 is HIGH or CE2 is LOW or both BHE and BLE are HIGH, the device enters automatic power-down mode, reducing ICC to ≤12 µA (ISB1) or ≤4 µA (ISB2 at 25 °C)-a 99% reduction versus active current. No software command or external control signal is needed; the behavior is fully hardware-driven and immediate.

Can CY62167ESL-55FNXIT operate in 2 M × 8 configuration, and what pins change function?

Yes-the same 1 M × 16 array is configurable as 2 M × 8 by using A0 as the LSB for byte selection. In this mode, I/O0–I/O7 carry lower-byte data and I/O8–I/O15 carry upper-byte data; BHE/ BLE remain functional for byte masking. Address lines A0–A19 retain identical roles, with no pin reassignment required.

What is the significance of the 60-pin WLCSP package's thermal resistance values?

With θ_JA = 26.54 °C/W (4-layer PCB) and θ_JC = 0.11 °C/W, the WLCSP enables efficient heat transfer directly from die to PCB copper. This allows sustained 55 ns operation at +85 °C ambient without derating, critical for sealed enclosures in automotive or industrial settings where airflow is restricted.