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Infineon Technologies CY62167EV30LL-45BVI
- Part No.:
- CY62167EV30LL-45BVI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62167EV30LL-45BVI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,051
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Product details
Overview
CY62167EV30LL-45BVI from Cypress Semiconductor is an automotive-grade 16-Mbit CMOS static RAM organized as 1M × 16 or 2M × 8, operating at 45 ns access time over –40 °C to +85 °C, with 2.2–3.6 V supply and ultra-low standby current (1.5 µA typ). It serves as main data buffer in infotainment head units requiring fast, low-power, AEC-Q100-compliant memory.
For engineers reviewing the CY62167EV30LL-45BVI datasheet, CY62167EV30LL-45BVI pinout, CY62167EV30LL-45BVI application, or CY62167EV30LL-45BVI equivalent, key selection criteria include TSOP I/VFBGA package compatibility, byte-enable-controlled 8-/16-bit bus configuration, automatic power-down behavior under CE/BE control, and automotive temperature-rated active/standby current specs.
Technical Context
The CY62167EV30LL-45BVI implements dual chip enable (CE1/CE2) logic with independent byte enables (BHE/BLE) to support flexible 8-bit or 16-bit data bus interfacing. Its automatic power-down circuit reduces ICC by >99% when CE1 is HIGH or CE2 is LOW or both BHE and BLE are HIGH.
It features CMOS-compatible input thresholds (VIH = 2.2 V min at VCC ≥ 2.7 V), output drive capability (IOH = –1.0 mA, VOL = 0.4 V max), and tristate timing with tHZOE ≤ 18 ns and tLZOE ≤ 5 ns - enabling clean bus sharing in multi-SRAM systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 or 2M × 8 configurable array) |
| Access Time | 45 ns - guarantees deterministic read latency for real-time automotive MCU interfaces |
| Supply Voltage | 2.2 V to 3.6 V - supports wide-input automotive power rails without external regulation |
| Standby Current | 1.5 µA typical / 12 µA max - enables >10-year battery-backed data retention in always-on modules |
| Operating Temperature | –40 °C to +85 °C (Automotive-A grade) - qualified per AEC-Q100 for under-hood and cabin ECUs |
| Package | 48-pin TSOP I - surface-mount compatible with standard reflow profiles and board-level test access |
| Power-Down Trigger | Automatic via CE1 HIGH or CE2 LOW or simultaneous BHE/BLE HIGH - eliminates need for external sleep controllers |
Pinout & Package
48-pin TSOP I package (JEDEC MO-141AC), 12 mm × 20 mm body, 0.5 mm pitch, lead-free finish. Pin 1 marked by notch or dot; pins numbered counter-clockwise from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address inputs | 20-bit address bus supporting full 1M-word (16-bit) or 2M-word (8-bit) addressing |
| I/O0–I/O7 | Data I/O (low byte) | Bi-directional 8-bit data path active when BLE = LOW in 16-bit mode or primary 8-bit bus in 2M×8 mode |
| I/O8–I/O15 | Data I/O (high byte) | Bi-directional 8-bit data path active only when BHE = LOW in 16-bit mode; unused in 2M×8 mode |
| CE1, CE2 | Chip enable controls | Dual CE logic: device selected only when CE1 = LOW AND CE2 = HIGH - enables hierarchical memory decoding |
| OE | Output enable | Controls output drivers only; does not affect internal state or power-down - allows shared-bus read arbitration |
| WE | Write enable | Active-LOW write strobe; initiates write when CE1 = LOW, CE2 = HIGH, and WE = LOW |
| BHE, BLE | Byte high/low enable | Selects upper/lower data byte during read/write; both HIGH forces auto power-down |
| VCC, VSS | Power and ground | Single 2.2–3.6 V supply; two VSS pins provide dedicated ground return paths for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Configurable data bus width | Hardware-selectable 1M × 16 or 2M × 8 via BYTE pin tie (VCC for 16-bit, VSS for 8-bit) - eliminates need for separate part numbers |
| Ultra-low standby power | 1.5 µA typical ISB1 - extends battery life in always-on telematics gateways without compromising wake latency |
| Automatic power-down | Self-triggered on CE/BE deassertion - removes software overhead for sleep/wake coordination in RTOS environments |
| CMOS-compatible interface | VIH/VIL thresholds meet 2.2 V/0.8 V (TSOP I) at VCC = 3.0 V - ensures robust noise margin in electrically noisy vehicle harnesses |
| Fast tristate control | tHZOE ≤ 18 ns and tLZOE ≤ 5 ns - prevents bus contention during multi-SRAM arbitration in ADAS domain controllers |
Applications
| Infotainment Head Unit Memory Buffer | ADAS Camera Preprocessing Cache |
|---|---|
|
Use Scenario: Stores decoded UI assets and audio buffers in automotive infotainment systems with continuous power cycling. IC Role / Device Role / Timing Role: High-speed SRAM acting as CPU-facing working memory for ARM Cortex-A cores, interfaced via 16-bit AXI bus with 45 ns read cycle. Use Value: 45 ns access time enables sub-100 µs UI frame rendering; 1.5 µA standby current permits <10 µW background memory retention during display-off states. |
Use Scenario: Temporarily holds raw image frames from 1.3 MP camera sensors before DSP-based object detection. IC Role / Device Role / Timing Role: Burst-mode SRAM buffer between MIPI CSI-2 receiver and vision processor, configured as 2M × 8 for byte-aligned pixel streaming. Use Value: Dual CE logic allows seamless handoff between sensor FIFO and DSP DMA engines; automatic power-down cuts idle power by >99% between frame captures. |
| Telematics Control Unit (TCU) Log Storage | Body Control Module (BCM) Event History Buffer |
|
Use Scenario: Retains GPS position logs, cellular connection history, and firmware update metadata across ignition cycles. IC Role / Device Role / Timing Role: Non-volatile shadow memory managed by microcontroller's low-power firmware, accessed intermittently at 1 MHz. Use Value: 12 µA max ISB2 at +85 °C ensures reliable 10-year log retention on coin-cell backup; 2.2–3.6 V operation matches TCU's buck-boost rail. |
Use Scenario: Captures door lock/unlock sequences, window position history, and lighting fault events for diagnostic reporting. IC Role / Device Role / Timing Role: Low-latency scratchpad for BCM's 8-bit MCU, using 1M × 16 mode for compact instruction/data co-location. Use Value: TSOP I package enables automated optical inspection (AOI) on BCM PCBs; –40 °C to +85 °C rating covers trunk-mounted installation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV12816BLL-45NLI | Same density (16 Mbit), 45 ns speed, but only 2.7–3.6 V supply range - no 2.2 V support | Lacks extended low-voltage operation required for start-stop battery transients | Prefer CY62167EV30LL-45BVI where system rail may dip below 2.7 V during cranking |
| ON Semiconductor NVSRAM N25S80-45G1T3E | Non-volatile SRAM with integrated EEPROM backup; higher standby current (25 µA typ) | Eliminates external backup battery but increases BOM cost and footprint | Choose CY62167EV30LL-45BVI when cost-sensitive, battery-backed designs prioritize lowest ISB and proven AEC-Q100 qualification |
Compared with IS62WV12816BLL-45NLI and N25S80-45G1T3E, the CY62167EV30LL-45BVI uniquely delivers 2.2 V minimum operation, 1.5 µA standby current, and dual CE logic - making it optimal for automotive subsystems subject to wide voltage transients and strict power budgets.
Availability
CY62167EV30LL-45BVI is available at Aetrix Electronics and suitable for infotainment head units, ADAS camera modules, and telematics control units requiring stable component supply across automotive production lifecycles.
Supply support for CY62167EV30LL-45BVI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for automotive, industrial, and IoT markets.
The CY62167EV30 belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power, high-speed data buffering in portable and automotive electronics with stringent thermal and voltage requirements.
FAQ
What is the function of the BYTE pin on CY62167EV30LL-45BVI?
The BYTE pin configures the device's data bus width: tied to VCC for 1M × 16 operation (using I/O0–I/O15), or to VSS for 2M × 8 operation (where I/O0–I/O7 become the sole data bus and A20 appears on pin 45). This hardware-selectable mode eliminates firmware configuration overhead and supports legacy 8-bit microcontrollers without redesign.
How does automatic power-down work without external control signals?
Automatic power-down activates when CE1 is HIGH, CE2 is LOW, or both BHE and BLE are HIGH - conditions monitored internally by the device's power-control logic. No external timer or GPIO is needed; the SRAM transitions to 1.5 µA standby within 45 ns of signal deassertion, as confirmed by tPD parameter in the datasheet.
Can CY62167EV30LL-45BVI operate reliably at 2.2 V across the full automotive temperature range?
Yes - the device is fully specified for 2.2 V to 3.6 V operation over –40 °C to +85 °C (Automotive-A grade), with all AC/DC parameters including 45 ns access time, VIH/VIL thresholds, and ISB1 ≤ 12 µA validated at VCC = 2.2 V and TA = +85 °C per datasheet Table on page 4.
Is the 48-pin TSOP I package RoHS-compliant and lead-free?
Yes - the CY62167EV30LL-45BVI carries a Pb-free 48-pin TSOP I package per the ordering code suffix 'BVI', and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3), verified in the official Cypress package diagram documentation (Document #38-05446 Rev. *Q, page 14).
CY62167EV30LL-45BVI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62167EV30LL-45BVI FAQ
1.How can I place an order for CY62167EV30LL-45BVI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167EV30LL-45BVI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167EV30LL-45BVI reliable?
The price and inventory of CY62167EV30LL-45BVI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167EV30LL-45BVI is usually 5 days.
3.What payment methods are accepted for CY62167EV30LL-45BVI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167EV30LL-45BVI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167EV30LL-45BVI?
CY62167EV30LL-45BVI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167EV30LL-45BVI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167EV30LL-45BVI?
For technical support, including CY62167EV30LL-45BVI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167EV30LL-45BVI requirements.
6.How does Aetrix verify that CY62167EV30LL-45BVI is sourced from the original manufacturer or authorized distributors?
All CY62167EV30LL-45BVI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167EV30LL-45BVI meets industry standards.
7.What is the process for return or replacement of CY62167EV30LL-45BVI?
All CY62167EV30LL-45BVI units undergo pre-shipment inspection (PSI). If there is an issue with CY62167EV30LL-45BVI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167EV30LL-45BVI part is unused and in its original packaging.
Return procedure for CY62167EV30LL-45BVI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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