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Infineon Technologies CY62167EV30LL-45BVXAT
- Part No.:
- CY62167EV30LL-45BVXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62167EV30LL-45BVXAT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,900
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Product details
Overview
CY62167EV30LL-45BVXAT from Cypress Semiconductor is an automotive-grade 16-Mbit CMOS static RAM organized as 1M × 16 or 2M × 8, operating at 45 ns access time over –40 °C to +85 °C, with 2.2 V–3.6 V supply and ultra-low standby current (1.5 µA typical). It serves as main data buffer in infotainment head units requiring fast, low-power, AEC-Q100-compliant memory.
For engineers reviewing the CY62167EV30LL-45BVXAT datasheet, CY62167EV30LL-45BVXAT pinout, CY62167EV30LL-45BVXAT application, or CY62167EV30LL-45BVXAT equivalent, key selection criteria include TSOP I/VFBGA package compatibility, byte-enable-controlled 8-/16-bit mode configuration, automatic power-down behavior under CE/BE control, and guaranteed ISB2 ≤ 12 µA at +85 °C.
Technical Context
This SRAM implements dual chip enable (CE1/CE2) and independent byte enables (BHE/BLE) to support flexible 8-bit or 16-bit data bus interfacing without external logic. Its automatic power-down circuit reduces ICC by >99% when CE1 is HIGH or CE2 is LOW or both BHE and BLE are HIGH - enabling deterministic low-power states in automotive microcontroller subsystems.
The device supports two distinct memory configurations: 1M × 16 (BYTE = VCC) or 2M × 8 (BYTE = VSS), with A20 exposed only in 2M × 8 mode on TSOP I Pin 45. All timing parameters - including tRC = 45 ns, tDOE = 22 ns, and tHZOE = 18 ns - are fully specified across the Automotive-A temperature range and full VCC range (2.2 V–3.6 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 or 2M × 8 configurable) |
| Access Time | 45 ns - guarantees real-time response for MCU read/write cycles at ≤22 MHz bus frequency |
| Supply Voltage | 2.2 V–3.6 V - compatible with automotive 3.3 V rails and brown-out tolerant down to 2.2 V |
| Standby Current | Max 12 µA at +85 °C - enables multi-year battery-backed retention in always-on modules |
| Operating Current | Typ 2.2 mA at 1 MHz - supports low-duty-cycle logging in telematics ECUs without thermal derating |
| Temperature Range | –40 °C to +85 °C (Automotive-A) - qualified per AEC-Q100 Grade 2 for under-hood and cabin applications |
| Package | 48-ball VFBGA (RoHS-compliant, 6.0 mm × 8.0 mm) - enables high-density PCB layout in space-constrained ADAS domains |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 0.5 mm pitch, JEDEC MO-276AA compliant. Thermal resistance θJA = 55 °C/W (still air, 2-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word or 2M-word addressing; A19 used in both modes, A20 only in 2M×8 TSOP I |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; I/O0–I/O7 active when BLE = LOW, I/O8–I/O15 active when BHE = LOW |
| CE1, CE2 | Chip Enable Controls | Dual CE architecture enables hierarchical memory mapping; device deselected if CE1 = HIGH or CE2 = LOW |
| OE | Output Enable | Controls output drivers only; does not affect internal power state - critical for bus sharing with other peripherals |
| WE | Write Enable | Active-Low write strobe; write cycle initiated only when CE1 = LOW, CE2 = HIGH, and WE = LOW |
| BHE, BLE | Byte Enable Inputs | Independent 8-bit write masking; allows partial writes without read-modify-write overhead in firmware |
| BYTE | Memory Width Configuration | Must be tied to VCC for 1M×16 mode or VSS for 2M×8 mode; determines internal array decoding and pin function allocation |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Organization | Single part supports either 1M × 16 or 2M × 8 via BYTE pin tie-off - eliminates BOM variants for platform reuse |
| Ultra-Low Standby Power | ISB2 ≤ 12 µA at +85 °C - enables >10-year data retention in battery-backed event recorders without capacitor refresh |
| Automatic Power-Down | Reduces ICC by >99% when deselected - eliminates need for external power-gating logic in domain controllers |
| CMOS-Compatible Timing | tLZOE = 5 ns, tHZOE = 18 ns - ensures clean bus release and avoids contention during multi-master arbitration |
| Automotive Qualification | AEC-Q100 Grade 2 qualified - validated for vibration, thermal cycling, and ESD robustness in automotive environments |
Applications
| Infotainment Head Unit Memory Buffer | ADAS Camera Frame Buffer |
|---|---|
|
Use Scenario: Stores decoded UI assets and audio metadata in automotive infotainment systems with intermittent CPU access. IC Role / Device Role / Timing Role: High-speed, low-leakage SRAM acting as L2 cache between SoC and display/audio subsystems. Use Value: 45 ns access time enables seamless 60 Hz UI rendering; 12 µA max ISB2 extends backup battery life beyond 5 years. |
Use Scenario: Buffers uncompressed image frames from surround-view cameras before compression and transmission over Ethernet AVB. IC Role / Device Role / Timing Role: Dual-port-capable SRAM providing simultaneous read (encoder) and write (sensor interface) paths via byte enables. Use Value: Independent BHE/BLE control allows concurrent 8-bit writes from sensor and 16-bit reads to encoder - eliminating frame drop during motion capture. |
| Telematics Control Unit Logging | Body Control Module Event Recorder |
|
Use Scenario: Captures CAN bus diagnostic events and GPS timestamps during vehicle ignition cycles for cloud upload upon network availability. IC Role / Device Role / Timing Role: Non-volatile shadow memory holding last 500 fault codes with automatic power-down during sleep mode. Use Value: 2.2 V minimum VCC allows operation during cold-cranking; 1.5 µA typical ISB2 ensures 3+ year retention on coin-cell backup. |
Use Scenario: Records door lock/unlock sequences, window position, and lighting status for anti-theft forensics and service diagnostics. IC Role / Device Role / Timing Role: Low-power SRAM integrated into BCM's always-on domain, retaining data across ignition cycles. Use Value: BYTE-configurable 2M×8 mode provides 2 million timestamped entries; VFBGA footprint minimizes PCB area in compact BCM housings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV12816BLL-45NLI | Same density (16 Mbit), 45 ns speed, but only 1M × 16 organization; no 2M × 8 mode or BYTE pin | Lacks byte-select flexibility - requires external logic for partial writes in 8-bit bus systems | Select when fixed 16-bit interface and lower cost priority outweigh configurability needs |
| Renesas R1LV1616RSA-45PB | 45 ns, 16 Mbit, Automotive-A grade, but uses 44-pin TSOP II (not pin-compatible); higher ISB2 (25 µA max) | Higher standby current limits battery-backed retention duration in always-on modules | Select only if existing PCB layout accommodates TSOP II footprint and thermal budget permits higher leakage |
Compared with IS62WV12816BLL-45NLI and R1LV1616RSA-45PB, CY62167EV30LL-45BVXAT uniquely delivers dual-mode organization, lowest guaranteed ISB2 (12 µA), and VFBGA packaging - making it optimal for next-gen automotive platforms demanding footprint efficiency and firmware flexibility.
Availability
CY62167EV30LL-45BVXAT is available at Aetrix Electronics and suitable for automotive infotainment systems, ADAS camera subsystems, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for CY62167EV30LL-45BVXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications.
The MoBL® (More Battery Life) SRAM product line targets portable and automotive systems where ultra-low standby power and fast access time are jointly critical - especially in always-on, battery-sensitive domains.
FAQ
What is the function of the BYTE pin on CY62167EV30LL-45BVXAT?
The BYTE pin configures memory organization: tied to VCC for 1M × 16 mode (standard 16-bit interface), or to VSS for 2M × 8 mode (expands address space to 2M words with 8-bit data path). In 2M × 8 mode on TSOP I, Pin 45 becomes A20, and BHE/BLE/I/O8–I/O14 are unused.
How does automatic power-down activate in CY62167EV30LL-45BVXAT?
Automatic power-down engages when any of these conditions occur: CE1 HIGH, CE2 LOW, or both BHE and BLE HIGH. This reduces ICC to ≤12 µA without requiring external control signals - the device enters low-power state autonomously upon bus deselect.
Can CY62167EV30LL-45BVXAT operate reliably at 2.2 V across the full automotive temperature range?
Yes - all AC and DC specifications, including tRC = 45 ns and ISB2 ≤ 12 µA, are guaranteed from –40 °C to +85 °C at VCC = 2.2 V. The device meets full Automotive-A performance requirements at minimum supply voltage.
Is the 48-ball VFBGA package of CY62167EV30LL-45BVXAT RoHS-compliant and lead-free?
Yes - the "X" suffix in BVXAT denotes Pb-free (lead-free) construction per JEDEC J-STD-609. The VFBGA package uses matte tin surface finish and complies with RoHS Directive 2011/65/EU and China RoHS.
CY62167EV30LL-45BVXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62167EV30LL-45BVXAT FAQ
1.How can I place an order for CY62167EV30LL-45BVXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167EV30LL-45BVXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167EV30LL-45BVXAT reliable?
The price and inventory of CY62167EV30LL-45BVXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167EV30LL-45BVXAT is usually 5 days.
3.What payment methods are accepted for CY62167EV30LL-45BVXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167EV30LL-45BVXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167EV30LL-45BVXAT?
CY62167EV30LL-45BVXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167EV30LL-45BVXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167EV30LL-45BVXAT?
For technical support, including CY62167EV30LL-45BVXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167EV30LL-45BVXAT requirements.
6.How does Aetrix verify that CY62167EV30LL-45BVXAT is sourced from the original manufacturer or authorized distributors?
All CY62167EV30LL-45BVXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167EV30LL-45BVXAT meets industry standards.
7.What is the process for return or replacement of CY62167EV30LL-45BVXAT?
All CY62167EV30LL-45BVXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62167EV30LL-45BVXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167EV30LL-45BVXAT part is unused and in its original packaging.
Return procedure for CY62167EV30LL-45BVXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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