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Infineon Technologies CY62167EV30LL-45BVXI
- Part No.:
- CY62167EV30LL-45BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62167EV30LL-45BVXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,978
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Product details
Overview
CY62167EV30LL-45BVXI from Cypress Semiconductor is an automotive-grade 16-Mbit CMOS static RAM organized as 1M × 16 or 2M × 8, operating at 45 ns access time over –40 °C to +85 °C, with ultra-low standby current (1.5 µA typ), wide 2.2–3.6 V supply range, and automatic power-down mode. It serves as main memory or buffer in infotainment head units requiring fast, low-power, AEC-Q100-compliant SRAM.
For engineers reviewing the CY62167EV30LL-45BVXI datasheet, CY62167EV30LL-45BVXI pinout, CY62167EV30LL-45BVXI application, or CY62167EV30LL-45BVXI equivalent, key selection criteria include TSOP I/VFBGA package compatibility, byte-enable-controlled 8-/16-bit bus configuration, automotive temperature compliance, and sub-3 µA active current at 1 MHz.
Technical Context
This SRAM implements dual chip enable (CE1/CE2) logic and independent byte enables (BHE/BLE) to support flexible 8-bit or 16-bit data bus interfacing without external glue logic. Its automatic power-down circuit reduces current by >99% when CE1 is HIGH, CE2 is LOW, or both BHE and BLE are HIGH - enabling deterministic low-power states during CPU idle cycles.
The device supports two physical configurations: 48-ball VFBGA (ball H6 unused) and 48-pin TSOP I, where the BYTE pin selects 1M×16 (BYTE = VCC) or 2M×8 (BYTE = VSS) mode. In 2M×8 mode, A20 appears on pin 45 and I/O8–I/O14, BHE, BLE are unused.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (configurable as 1M × 16 or 2M × 8) |
| Access Time | 45 ns - guarantees read data valid within 45 ns after address/CE/OE assertion for real-time automotive control loops |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with 2.5 V and 3.3 V system rails without level-shifting |
| Standby Current | 1.5 µA typical / 12 µA max - enables multi-year battery-backed operation in always-on telematics modules |
| Active Current | 2.2 mA typical at 1 MHz - supports low-frequency MCU interfaces while minimizing thermal load |
| Operating Temperature | –40 °C to +85 °C (Automotive-A grade) - qualified per AEC-Q100 for under-hood and dashboard environments |
| Data Retention Voltage | 1.5 V minimum - maintains memory state during brown-out conditions down to 1.5 V supply |
Pinout & Package
Package: 48-pin TSOP I (Type I, 12 × 20 mm body, 0.5 mm pitch) and 48-ball VFBGA (6 × 8 mm, 0.8 mm ball pitch). Pin functions validated per Document 38-05446 Rev. *Q Figures 1–2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word (16-bit) or 2M-word (8-bit) addressing space |
| I/O0–I/O7 | Data Bus (Low Byte) | Bi-directional 8-bit data path active when BLE = LOW in 16-bit mode or always in 8-bit mode |
| I/O8–I/O15 | Data Bus (High Byte) | Bi-directional 8-bit data path active only when BHE = LOW in 16-bit mode; unused in 2M×8 configuration |
| CE1, CE2 | Chip Enable Controls | Dual CE logic: device selected only when CE1 = LOW AND CE2 = HIGH - prevents partial selection glitches |
| OE | Output Enable | Controls output drivers; HIGH places I/O pins in high-Z - required for bus sharing with other peripherals |
| WE | Write Enable | Active-LOW signal initiating write cycle; timing referenced to CE1/CE2 and BHE/BLE edges per truth table |
| BHE, BLE | Byte Enable Inputs | Independent control of high/low byte writes - eliminates need for external byte masking logic |
| BYTE | Bus Width Configuration | TSOP I only: tied to VCC for 1M×16 mode; tied to VSS for 2M×8 mode (enables A20 on pin 45) |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Data Bus Width | Single device supports either 8-bit or 16-bit microcontroller interfaces via BYTE pin strap - reduces BOM count across platform variants |
| Automatic Power-Down | Reduces ICC to ≤12 µA when deselected (CE1 HIGH or CE2 LOW or BHE/BLE both HIGH) - eliminates software-controlled sleep entry overhead |
| Ultra-Low Active Current | 2.2 mA typical at 1 MHz enables continuous polling in safety-critical watchdog or sensor buffer applications without thermal derating |
| CMOS-Compatible Timing | Input thresholds (VIH/VIL) and output drive (VOH/VOL) meet standard CMOS levels across full voltage/temperature range - ensures interoperability with FPGA and MCU I/O banks |
| High-Z Output Control | Multiple independent disable paths (OE HIGH, CE inactive, BHE/BLE inactive, or WE active) guarantee bus isolation during all non-read states |
Applications
| Infotainment Head Unit Memory | ADAS Camera Buffer |
|---|---|
Use Scenario: Stores GUI assets and audio decode buffers in automotive infotainment systems with frequent UI updates and background audio playback. IC Role / Device Role / Timing Role: Primary SRAM for application processor L2 cache extension and real-time display frame buffering. Use Value: 45 ns access time enables seamless 60 Hz UI rendering; 1.5 µA standby current extends battery backup duration during ignition-off periods. | Use Scenario: Temporarily stores raw image frames from surround-view cameras before compression and transmission over Ethernet AVB. IC Role / Device Role / Timing Role: High-speed frame buffer between MIPI CSI-2 receiver and video processing ASIC. Use Value: Dual-byte enable (BHE/BLE) allows partial-frame writes without corrupting adjacent pixels; 2.2 V min VCC supports operation during cold-crank voltage dips. |
| Telematics Control Unit (TCU) | Instrument Cluster Display Cache |
Use Scenario: Holds cellular modem protocol stack state and GPS position history in always-connected vehicle tracking modules. IC Role / Device Role / Timing Role: Non-volatile shadow RAM for critical telemetry metadata during power-loss events. Use Value: Data retention down to 1.5 V ensures no loss of last-known GPS fix during engine start transient; AEC-Q100 qualification ensures reliability over 15-year vehicle lifecycle. | Use Scenario: Caches rendered instrument graphics (speedometer, tachometer, warning icons) for rapid refresh in digital dashboards. IC Role / Device Role / Timing Role: Dedicated display memory mapped directly to GPU framebuffer controller. Use Value: TSOP I package enables compact layout near display driver IC; 48-pin footprint simplifies routing of 16-bit parallel RGB interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS62WV102416BLL-45NLI | 45 ns access, 1M × 16 only, 3.3 V only (no 2.2–3.6 V range), no BYTE pin for 2M×8 reconfiguration | Lacks dual-bus-width flexibility; requires separate part numbers for 8-bit vs 16-bit designs | Select when fixed 16-bit interface and strict 3.3 V rail simplify design validation |
| AS6C4008-45TIN | 45 ns access, 512K × 8 only, 2.7–3.6 V range, no automatic power-down (ISB = 30 µA typ) | Half density, no byte-enable granularity, higher standby current limits battery-backed runtime | Select for cost-sensitive 8-bit-only applications where 8 Mbit suffices and thermal budget permits higher ISB |
Compared with IS62WV102416BLL-45NLI and AS6C4008-45TIN, CY62167EV30LL-45BVXI uniquely delivers configurable 8/16-bit operation, widest voltage range (2.2–3.6 V), and lowest verified standby current (1.5 µA typ) - making it optimal for scalable automotive platforms requiring single-SRAM reuse across multiple ECU tiers.
Availability
CY62167EV30LL-45BVXI is available at Aetrix Electronics and suitable for automotive infotainment systems, ADAS camera modules, and telematics control units requiring stable component supply across extended vehicle production lifecycles.
Supply support for CY62167EV30LL-45BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications.
CY62167EV30 belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power, high-speed memory in battery-constrained automotive subsystems such as head units and driver-assistance sensors.
FAQ
What is the function of the BYTE pin on CY62167EV30LL-45BVXI?
The BYTE pin is present only in the 48-pin TSOP I package and configures bus width: tying BYTE to VCC enables 1M × 16 operation, while tying BYTE to VSS enables 2M × 8 operation (with A20 appearing on pin 45). In VFBGA packages, BYTE functionality is internal and not exposed.
Does CY62167EV30LL-45BVXI support true 2M × 8 addressing?
Yes - in 2M × 8 mode (BYTE = VSS on TSOP I), A20 becomes addressable via pin 45, extending the address space to 2,097,152 words. The internal array is physically 2M × 8; the 1M × 16 mode accesses the same memory using byte-select logic rather than remapping.
How does automatic power-down activate, and what is its impact on timing?
Power-down activates when CE1 is HIGH, CE2 is LOW, or both BHE and BLE are HIGH. During power-down, outputs enter high-Z, ICC drops to ≤12 µA, and tPD (deselect-to-power-down) is 45 ns. Recovery requires tPU = 0 ns - full operation resumes immediately upon valid CE1/CE2 assertion.
Can CY62167EV30LL-45BVXI be used in non-automotive industrial applications?
Yes - its –40 °C to +85 °C operating range, 2.2–3.6 V supply, and AEC-Q100 qualification make it suitable for harsh industrial environments. However, non-automotive variants (e.g., CY62167EV30LL-45ZSXI) may offer lower unit cost if automotive qualification is unnecessary.
CY62167EV30LL-45BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62167EV30LL-45BVXI FAQ
1.How can I place an order for CY62167EV30LL-45BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167EV30LL-45BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167EV30LL-45BVXI reliable?
The price and inventory of CY62167EV30LL-45BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167EV30LL-45BVXI is usually 5 days.
3.What payment methods are accepted for CY62167EV30LL-45BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167EV30LL-45BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167EV30LL-45BVXI?
CY62167EV30LL-45BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167EV30LL-45BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167EV30LL-45BVXI?
For technical support, including CY62167EV30LL-45BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167EV30LL-45BVXI requirements.
6.How does Aetrix verify that CY62167EV30LL-45BVXI is sourced from the original manufacturer or authorized distributors?
All CY62167EV30LL-45BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167EV30LL-45BVXI meets industry standards.
7.What is the process for return or replacement of CY62167EV30LL-45BVXI?
All CY62167EV30LL-45BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62167EV30LL-45BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167EV30LL-45BVXI part is unused and in its original packaging.
Return procedure for CY62167EV30LL-45BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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