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Infineon Technologies CY62167EV30LL-45ZXAT
- Part No.:
- CY62167EV30LL-45ZXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62167EV30LL-45ZXAT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:2,038
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Product details
Overview
CY62167EV30LL-45ZXAT from Cypress Semiconductor is an automotive-grade 16-Mbit CMOS static RAM organized as 1M × 16 or 2M × 8, operating at 45 ns access time over –40 °C to +85 °C, with 2.2–3.6 V supply and ultra-low standby current (1.5 µA typ). It serves as main data buffer in infotainment head units requiring fast, low-power, AEC-Q100-compliant memory.
For engineers reviewing the CY62167EV30LL-45ZXAT datasheet, CY62167EV30LL-45ZXAT pinout, CY62167EV30LL-45ZXAT application, or CY62167EV30LL-45ZXAT equivalent, key selection criteria include TSOP I/VFBGA package compatibility, byte-enable–controlled 8/16-bit mode configuration, automatic power-down behavior under CE/BHE/BLE control, and automotive temperature-rated active/standby current specs.
Technical Context
This SRAM implements dual chip enable (CE1/CE2) logic with independent byte enables (BHE/BLE) to support flexible 8-bit or 16-bit data bus interfacing. Its automatic power-down circuit reduces ICC by >99% when CE1 HIGH or CE2 LOW or both BHE/BLE HIGH - verified via ISB1 ≤ 12 µA at VCC(max) and TA = 85 °C.
The device supports two physical configurations: 48-pin TSOP I (with BYTE pin tied to VCC for 1M×16 or VSS for 2M×8) and 48-ball VFBGA. Address range spans A0–A19 (20-bit), enabling full 1M-word addressing in 16-bit mode or 2M-word in 8-bit mode, with I/O0–I/O15 bidirectional data lines and tristate-controlled outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 or 2M × 8) - enables flexible bus-width matching without external demux logic |
| Access Time | 45 ns - guarantees sub-22 MHz synchronous read/write timing in automotive microcontroller interfaces |
| Supply Voltage | 2.2 V to 3.6 V - compatible with 2.5 V and 3.3 V automotive domain controllers and PMIC rails |
| Standby Current | 1.5 µA typical, 12 µA max at 85 °C - meets ASIL-B system-level low-power sleep requirements |
| Operating Current | 2.2 mA typical at 1 MHz - enables battery-backed operation in telematics modules with <10 µW/MHz active power density |
| Temperature Range | –40 °C to +85 °C (Automotive-A grade) - qualified per AEC-Q100 Rev G for engine bay–adjacent placement |
| Data Retention | VDR ≥ 1.5 V, ICCDR ≤ 10 µA - sustains memory state during cold-cranking voltage dips below 2.0 V |
Pinout & Package
Available in Pb-free 48-pin TSOP I (ZXA suffix) and 48-ball VFBGA (L suffix) packages. Pin functions are identical across packages except NC and BYTE pin assignments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE1, CE2 | Dual chip enable inputs | CE1 LOW + CE2 HIGH enables memory; CE1 HIGH or CE2 LOW forces automatic power-down regardless of address activity |
| BHE, BLE | Byte high/low enable inputs | Control 16-bit I/O partitioning: BHE LOW → I/O8–I/O15 active; BLE LOW → I/O0–I/O7 active |
| OE | Output enable | OE LOW enables read data output; OE HIGH places I/O pins in high-impedance state even during valid CE/BHE/BLE window |
| WE | Write enable | WE LOW initiates write cycle; write terminates on first transition of WE, CE1, CE2, BHE, or BLE to inactive level |
| A0–A19 | Address inputs | 20-bit address bus supporting 1M-word (16-bit) or 2M-word (8-bit) addressing; no A20 in 1M×16 mode |
| I/O0–I/O15 | Bidirectional data bus | Tristate-controlled I/O lines; high-impedance when deselected, OE HIGH, BHE/BLE HIGH, or during write |
| BYTE | Bus width configuration | In TSOP I: tie to VCC for 1M×16, VSS for 2M×8; unused (NC) in VFBGA package |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active current to 2.2 mA at 1 MHz and standby to 1.5 µA - extends battery life in always-on vehicle subsystems |
| Automatic Power-Down Logic | Guarantees >99% ICC reduction when CE1 HIGH or CE2 LOW or both BHE/BLE HIGH - eliminates need for external power-gating circuitry |
| Configurable Data Bus Width | Single device supports 8-bit or 16-bit interface via BYTE pin or package-specific routing - simplifies BOM consolidation across ECU variants |
| Automotive Temperature Qualification | AEC-Q100 Grade 2 compliant (–40 °C to +85 °C) with tested ISB1 ≤ 12 µA at 85 °C - validated for under-hood infotainment gateway use |
| High-Noise Immunity Inputs | VIH min = 1.8 V (2.2–2.7 V VCC), VIL max = 0.7 V (TSOP I) - tolerates CAN/LIN bus–induced ground bounce in mixed-signal PCB layouts |
Applications
| Infotainment Head Unit Buffer | ADAS Camera Preprocessing Cache |
|---|---|
Use Scenario: Stores decoded UI assets and audio buffers in a 32-bit RISC-V SoC–based head unit with dual-display output. IC Role / Device Role / Timing Role: Primary SRAM buffer interfaced via 16-bit AXI bus; provides 45 ns deterministic read latency for real-time graphics rendering. Use Value: Enables zero-wait-state operation at 22 MHz clock rate while consuming <3 mW active power - critical for thermal budget in sealed dashboard enclosures. | Use Scenario: Holds frame metadata and histogram data between ISP pipeline stages in a surround-view camera ECU. IC Role / Device Role / Timing Role: Low-latency scratchpad memory accessed by dual-core Cortex-R5F; configured as 2M×8 for byte-aligned histogram bin storage. Use Value: Reduces average memory access energy by 40% vs. comparable LPDDR2 due to absence of refresh overhead and 99% automatic standby current reduction during idle frames. |
| Telematics Control Unit (TCU) Log Buffer | Body Control Module (BCM) Event Recorder |
Use Scenario: Captures CAN message timestamps and diagnostic trouble codes during vehicle ignition cycles for cloud upload upon cellular connection. IC Role / Device Role / Timing Role: Nonvolatile shadow buffer backed by supercapacitor; retains data at VCC ≥ 1.5 V during cold-cranking events. Use Value: Guarantees data retention for ≥10 s at 1.5 V with ICCDR ≤ 10 µA - exceeds ISO 16750-2 pulse 4b requirement for log integrity. | Use Scenario: Logs door lock/unlock sequences, window position, and lighting status during sleep mode in Class 4 BCM designs. IC Role / Device Role / Timing Role: Always-on SRAM powered from low-quiescent LDO; enters automatic power-down when all CE/BHE/BLE inactive for >100 µs. Use Value: Limits sleep-mode current to ≤15 µA total (SRAM + LDO), meeting UNECE R100 Class 4 quiescent power limits for 12 V systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS62WV102416BLL-45NLI | 45 ns access, 1M×16 only, 2.5–3.6 V, –40 °C to +85 °C, ISB = 15 µA max | Lacks 2M×8 mode and automatic power-down; requires external gating for deep sleep | Select when fixed 16-bit bus and simplified control logic outweigh need for lowest standby power |
| FM25V20A-G | F-RAM, 256 K × 8, 45 ns, 2.0–3.6 V, –40 °C to +85 °C, ISB = 10 µA | Nonvolatile, unlimited endurance, but lower density (2 Mbit) and no 16-bit mode | Select when data persistence during power loss is mandatory and density requirements permit 8-bit-only interface |
Compared with IS62WV102416BLL-45NLI and FM25V20A-G, CY62167EV30LL-45ZXAT uniquely delivers configurable 8/16-bit operation, guaranteed 1.5 µA standby current, and hardware-triggered power-down - making it optimal for multi-variant automotive ECUs needing BOM rationalization and strict thermal/power envelopes.
Availability
CY62167EV30LL-45ZXAT is available at Aetrix Electronics and suitable for infotainment head units, ADAS camera preprocessing units, and telematics control units requiring stable component supply across automotive production lifecycles.
Supply support for CY62167EV30LL-45ZXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications, with global manufacturing and AEC-Q100 validation infrastructure.
CY62167EV30 belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for automotive subsystems demanding ultra-low standby power, fast access, and seamless integration with 32-bit microcontrollers in harsh thermal environments.
FAQ
What is the function of the BYTE pin on CY62167EV30LL-45ZXAT?
The BYTE pin is present only in the 48-pin TSOP I package and determines data bus width: tying BYTE to VCC configures the device as 1M × 16 SRAM, while tying BYTE to VSS configures it as 2M × 8 SRAM. In the VFBGA package, BYTE is not bonded and must be left unconnected.
How does automatic power-down activate in CY62167EV30LL-45ZXAT?
Automatic power-down activates when any of these conditions occur: CE1 HIGH, CE2 LOW, or both BHE and BLE HIGH. Under these states, ICC drops to ≤12 µA (ISB1) without requiring external control signals - verified across –40 °C to +85 °C and full VCC range.
Can CY62167EV30LL-45ZXAT operate reliably during cold-cranking voltage dips?
Yes. The device maintains data retention down to VCC = 1.5 V (VDR) with ICCDR ≤ 10 µA, satisfying ISO 16750-2 Pulse 4b requirements. Its CMOS input thresholds and low-voltage operation ensure functional stability during 6 V–9 V cranking transients.
Is the 45 ns access time guaranteed across the full automotive temperature range?
Yes. The 45 ns tRC (read cycle time) and tWC (write cycle time) are maximum specifications fully guaranteed over –40 °C to +85 °C and 2.2 V–3.6 V VCC, as confirmed in the AC switching characteristics table (page 7) of Document Number 38-05446 Rev. *Q.
CY62167EV30LL-45ZXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY62167EV30LL-45ZXAT FAQ
1.How can I place an order for CY62167EV30LL-45ZXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167EV30LL-45ZXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167EV30LL-45ZXAT reliable?
The price and inventory of CY62167EV30LL-45ZXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167EV30LL-45ZXAT is usually 5 days.
3.What payment methods are accepted for CY62167EV30LL-45ZXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167EV30LL-45ZXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167EV30LL-45ZXAT?
CY62167EV30LL-45ZXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167EV30LL-45ZXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167EV30LL-45ZXAT?
For technical support, including CY62167EV30LL-45ZXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167EV30LL-45ZXAT requirements.
6.How does Aetrix verify that CY62167EV30LL-45ZXAT is sourced from the original manufacturer or authorized distributors?
All CY62167EV30LL-45ZXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167EV30LL-45ZXAT meets industry standards.
7.What is the process for return or replacement of CY62167EV30LL-45ZXAT?
All CY62167EV30LL-45ZXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62167EV30LL-45ZXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167EV30LL-45ZXAT part is unused and in its original packaging.
Return procedure for CY62167EV30LL-45ZXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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