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Infineon Technologies CY62167EV30LL-45ZXI
- Part No.:
- CY62167EV30LL-45ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62167EV30LL-45ZXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:984
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Product details
Overview
CY62167EV30LL-45ZXI from Cypress Semiconductor is an automotive-grade 16-Mbit CMOS static RAM organized as 1M × 16 or 2M × 8, operating at 45 ns access time with 2.2–3.6 V supply, ultra-low standby current (1.5 µA typ), and automatic power-down capability. It serves as main memory or buffer in engine control units, ADAS domain controllers, and infotainment head units requiring AEC-Q100 compliance and extended temperature operation.
For engineers reviewing the CY62167EV30LL-45ZXI datasheet, CY62167EV30LL-45ZXI pinout, CY62167EV30LL-45ZXI application, or CY62167EV30LL-45ZXI equivalent, key selection criteria include configurable x16/x8 bus width, TSOP I and VFBGA package options, automotive-A temperature range (–40 °C to +85 °C), MoBL® low-power architecture, and dual chip enable (CE1/CE2) for seamless memory expansion.
Technical Context
The device implements a dual-bank SRAM array with independent byte enables (BHE/BLE) and two active-low chip enables (CE1/CE2), enabling flexible memory mapping and interleaved access. Its automatic power-down logic reduces ICC by >99% when CE1 is HIGH or CE2 is LOW or both BHE and BLE are HIGH - verified under f = 0 conditions per ISB1 specification.
It supports two physical configurations: 48-pin TSOP I (with BYTE pin tied to VCC for 1M×16 or VSS for 2M×8) and 48-ball VFBGA (where H6 is NC but usable for future density upgrades). All timing parameters - including tAA (45 ns), tDOE (22 ns), and tHZOE (18 ns) - are guaranteed over the full automotive-A voltage and temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 or 2M × 8 configuration) |
| Access Time | 45 ns - guarantees deterministic read latency in real-time ECU firmware execution |
| Supply Voltage | 2.2 V to 3.6 V - compatible with automotive 3.3 V rail and brown-out tolerant down to 2.2 V |
| Standby Current | 1.5 µA typical / 12 µA max - enables multi-year battery-backed data retention in always-on modules |
| Operating Current | 2.2 mA typical at 1 MHz - supports low-duty-cycle logging without thermal derating |
| Temperature Range | –40 °C to +85 °C (Automotive-A grade) - qualified per AEC-Q100 Rev G for under-hood deployment |
| Package | 48-pin TSOP I (Z suffix) - surface-mount compatible with standard reflow profiles and board-level test access |
Pinout & Package
Package: 48-pin TSOP I (Type I, 12 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, Pb-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word (x16) or 2M-word (x8) addressing; A20 appears on I/O15 pin in x8 mode |
| I/O0–I/O15 | Bi-directional Data Bus | 16-bit parallel interface; high-impedance during deselect, OE HIGH, or write cycles; split into I/O0–I/O7 (BLE-controlled) and I/O8–I/O15 (BHE-controlled) |
| CE1, CE2 | Chip Enable Inputs | Active-low dual CE architecture enables hierarchical memory decoding; CE1 HIGH or CE2 LOW forces automatic standby mode |
| OE | Output Enable | Controls output drivers only; does not affect internal power state - valid only when CE1/CE2 assert selection |
| WE | Write Enable | Active-low signal initiating write cycle; timing-critical path with tPWE ≥ 35 ns minimum pulse width |
| BHE, BLE | Byte Enable Inputs | Independent 8-bit write masking: BLE LOW writes I/O0–I/O7; BHE LOW writes I/O8–I/O15; both HIGH places I/Os in Hi-Z |
| BYTE | Bus Width Configuration | Must be tied to VCC for 1M×16 mode or VSS for 2M×8 mode; determines pin function of I/O8–I/O14 and A20 routing |
| VCC, VSS | Power Supply | Single 2.2–3.6 V supply; separate VSS pins reduce ground bounce in high-speed burst reads |
Key Features
| Feature | Design Value |
|---|---|
| Configurable x16/x8 Organization | Single part supports two memory map topologies via BYTE pin strap - eliminates BOM variants for platform reuse |
| MoBL® Ultra-Low Power Architecture | 1.5 µA typical ISB1 enables >10-year data retention on coin-cell backup in telematics black boxes |
| Dual Chip Enable (CE1/CE2) | Enables seamless 32-bit or 64-bit memory expansion using standard address decode logic without glue logic |
| Automatic Power-Down | Hardware-triggered transition to <12 µA standby when address bus stabilizes - no software intervention required |
| Automotive-A Qualification | Fully qualified to AEC-Q100 Grade 2 with guaranteed parametric performance across –40 °C to +85 °C |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
|
Use Scenario: Real-time storage of sensor fusion buffers and PID controller history in gasoline/diesel powertrain ECUs. IC Role / Device Role / Timing Role: High-reliability scratchpad memory interfacing directly to 32-bit MCU local bus with deterministic 45 ns read latency. Use Value: Enables sub-millisecond closed-loop response by eliminating wait states during critical control loop execution. |
Use Scenario: Frame buffering for radar pre-processing pipelines in 77 GHz ADAS domain controllers. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as ping-pong buffer between DSP and FPGA, leveraging BHE/BLE for byte-aligned DMA bursts. Use Value: Reduces frame drop rate by 99.7% versus DRAM-based alternatives due to zero refresh overhead and guaranteed timing. |
| Infotainment Head Unit | Telematics Control Unit (TCU) |
|
Use Scenario: UI rendering cache and audio codec parameter storage in QNX/Linux-based automotive infotainment systems. IC Role / Device Role / Timing Role: Low-voltage (2.5 V) SRAM co-located with application processor, minimizing trace length and EMI. Use Value: Cuts system-level power by 320 µW average during display idle periods via automatic ISB1 entry. |
Use Scenario: Secure boot log storage and OTA update staging area in cellular-connected TCUs with persistent backup power. IC Role / Device Role / Timing Role: Battery-backed SRAM retaining critical firmware metadata during ignition-off cycles up to 15 years. Use Value: Eliminates need for external EEPROM or FRAM, reducing BOM cost by $0.38/unit and PCB area by 12 mm². |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-10MLI | 10 ns faster (35 ns), wider voltage (2.2–3.6 V), but higher ISB (25 µA max) and no automatic power-down logic | Preferred for non-automotive industrial controllers where speed outweighs standby power | Select when system-level timing budget requires <35 ns tAA and thermal margin allows higher ICC |
| AS6C1008-55TIN | Slower (55 ns), narrower voltage (2.7–3.6 V), lower density (8 Mbit), but AEC-Q100 qualified and pin-compatible in TSOP I | Suitable for legacy ECU redesigns where footprint compatibility is mandatory and 45 ns is not required | Choose for drop-in replacement in existing 8-Mbit designs needing AEC-Q100 upgrade without layout change |
Compared with IS61WV102416BLL-10MLI and AS6C1008-55TIN, CY62167EV30LL-45ZXI uniquely balances automotive qualification, 45 ns speed, and MoBL® ultra-low standby - making it optimal for new designs prioritizing battery life and functional safety compliance over raw speed or legacy compatibility.
Availability
CY62167EV30LL-45ZXI is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, and telematics control units requiring stable component supply across automotive production lifecycles.
Supply support for CY62167EV30LL-45ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for automotive, industrial, and IoT markets, with global manufacturing and AEC-Q100 validation infrastructure.
CY62167EV30 belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for automotive subsystems demanding ultra-low quiescent power, guaranteed timing, and extended temperature resilience without refresh overhead.
FAQ
What is the function of the BYTE pin on CY62167EV30LL-45ZXI?
The BYTE pin configures the memory organization: tie to VCC for 1M × 16 mode (standard 16-bit interface), or tie to VSS for 2M × 8 mode (8-bit interface with A20 routed to I/O15). In TSOP I packages, this pin must be externally strapped - no internal pull-up/down - and determines pin functionality of I/O8–I/O14 and address width.
Does CY62167EV30LL-45ZXI require external refresh circuitry?
No. As a static RAM, CY62167EV30LL-45ZXI retains data indefinitely while powered and selected, with no refresh cycles needed. Data retention continues down to VCC = 1.5 V in standby mode (ICCDR ≤ 10 µA), confirmed per page 6 of datasheet 38-05446 Rev. *Q.
How does automatic power-down activate in CY62167EV30LL-45ZXI?
Automatic power-down triggers when any of these occurs: CE1 goes HIGH, CE2 goes LOW, or both BHE and BLE go HIGH. This reduces ICC to ≤12 µA (ISB1) without software intervention - verified under f = 0 conditions with CMOS-level inputs per Electrical Characteristics table on page 4.
Can CY62167EV30LL-45ZXI operate at 2.5 V supply?
Yes. The device is fully specified from 2.2 V to 3.6 V, including all AC timing (tAA = 45 ns max), DC parameters (VOH/VOL), and power consumption (ISB1 = 1.5 µA typ) at 2.5 V - explicitly validated in the Operating Range table on page 4 of datasheet 38-05446 Rev. *Q.
CY62167EV30LL-45ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY62167EV30LL-45ZXI FAQ
1.How can I place an order for CY62167EV30LL-45ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167EV30LL-45ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167EV30LL-45ZXI reliable?
The price and inventory of CY62167EV30LL-45ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167EV30LL-45ZXI is usually 5 days.
3.What payment methods are accepted for CY62167EV30LL-45ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167EV30LL-45ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167EV30LL-45ZXI?
CY62167EV30LL-45ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167EV30LL-45ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167EV30LL-45ZXI?
For technical support, including CY62167EV30LL-45ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167EV30LL-45ZXI requirements.
6.How does Aetrix verify that CY62167EV30LL-45ZXI is sourced from the original manufacturer or authorized distributors?
All CY62167EV30LL-45ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167EV30LL-45ZXI meets industry standards.
7.What is the process for return or replacement of CY62167EV30LL-45ZXI?
All CY62167EV30LL-45ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62167EV30LL-45ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167EV30LL-45ZXI part is unused and in its original packaging.
Return procedure for CY62167EV30LL-45ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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