Infineon Technologies CY62167EV30LL-45ZXIT
- Part No.:
- CY62167EV30LL-45ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62167EV30LL-45ZXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:

- Shipping:

Inventory:1,591
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Product details
Overview
CY62167EV30LL-45ZXIT from Cypress Semiconductor is an automotive-grade 16-Mbit CMOS static RAM organized as 1M × 16 or 2M × 8, operating at 45 ns access time over –40 °C to +85 °C, with 2.2 V–3.6 V supply and ultra-low standby current (1.5 µA typ). It serves as main data buffer in engine control units and ADAS domain controllers requiring deterministic timing and low-power retention.
For engineers reviewing the CY62167EV30LL-45ZXIT datasheet, CY62167EV30LL-45ZXIT pinout, CY62167EV30LL-45ZXIT application, or CY62167EV30LL-45ZXIT equivalent, key selection criteria include configurable bus width (16-bit/8-bit), automotive temperature compliance, automatic power-down behavior, and dual-package availability (TSOP I / VFBGA).
Technical Context
This SRAM implements a dual-bank byte-enable architecture with independent BHE and BLE controls, enabling selective 8-bit writes to high or low byte lanes without disturbing adjacent data. Its automatic power-down circuit reduces ICC by >99% when CE1 is HIGH or CE2 is LOW or both BHE and BLE are HIGH - verified under f = 0 conditions at VCC(max) and 85 °C.
The device supports two physical configurations: TSOP I (48-pin) with BYTE pin tied to VCC for 1M×16 mode or VSS for 2M×8 mode (where A20 appears on pin 45), and VFBGA (48-ball) with NC pins unconnected and H6 reserved for future density upgrade. All switching parameters are guaranteed over full automotive voltage and temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 or 2M × 8 configuration) |
| Access Time | 45 ns - guarantees worst-case read/write cycle timing in automotive ECU clock domains |
| Supply Voltage | 2.2 V to 3.6 V - compatible with 2.5 V and 3.3 V system rails without level-shifting |
| Standby Current | 12 µA max at 85 °C - enables >10-year battery-backed data retention in always-on modules |
| Operating Current | 4.0 mA max at fmax - supports burst reads in infotainment memory buffers without thermal derating |
| Temperature Range | –40 °C to +85 °C (Automotive-A grade) - qualified per AEC-Q100 Rev G for under-hood deployment |
| Data Retention Voltage | 1.5 V min - allows operation down to single-cell LiFePO₄ backup voltage during main rail loss |
Pinout & Package
Package: 48-pin TSOP I (Type I, 12 mm × 20 mm, 0.5 mm pitch) and 48-ball VFBGA (6 mm × 8 mm, 0.8 mm ball pitch). Pin functions validated per Figure 2 (TSOP I) and Figure 1 (VFBGA) in Document 38-05446 Rev. *Q.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word (16-bit) or 2M-word (8-bit) addressing |
| I/O0–I/O7 | Low-Byte Data I/O | Bi-directional 8-bit data path active only when BLE = LOW; high-impedance otherwise |
| I/O8–I/O15 | High-Byte Data I/O | Bi-directional 8-bit data path active only when BHE = LOW; isolated during low-byte writes |
| CE1, CE2 | Chip Enable Controls | Dual enable logic: device selected only when CE1 = LOW AND CE2 = HIGH - prevents partial selection glitches |
| OE | Output Enable | Controls output drivers only; does not affect internal state or power-down - enables bus sharing |
| WE | Write Enable | Active-LOW write strobe; write completes on first inactive edge of WE, CE1, CE2, BHE, or BLE |
| BHE, BLE | Byte Enable Inputs | Independent gating of high/low byte lanes; both HIGH forces high-Z on all I/Os and triggers auto power-down |
| VCC, VSS | Power & Ground | Separate VCC (pin 32 TSOP I) and VSS (pins 23, 41 TSOP I) reduce switching noise coupling into data paths |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Bus Width | Single device supports either 16-bit microcontroller interface (1M×16) or 8-bit MCU + peripheral expansion (2M×8), reducing BOM variants |
| Automatic Power-Down | Reduces ICC to ≤12 µA when deselected - eliminates need for external power-gating logic in battery-critical modules |
| Byte-Level Write Control | Independent BHE/BLE allows non-destructive 8-bit updates in mixed-data-width systems (e.g., CAN message buffers with header/payload separation) |
| Automotive Qualification | AEC-Q100 Grade 2 compliant with full temperature and voltage stress screening - qualified for safety-critical powertrain subsystems |
| Low-Voltage Data Retention | Maintains stored data down to 1.5 V VCC - enables seamless transition to backup power during ignition cycling without external NVSRAM |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
|
Use Scenario: Real-time storage of sensor fusion results and actuator command history in closed-loop combustion control. IC Role / Device Role / Timing Role: Primary volatile data buffer interfacing directly with 16-bit RISC core; provides deterministic 45 ns read latency for PID loop execution. Use Value: Configurable 1M×16 mode matches native bus width of automotive MCUs like Infineon TC2xx, eliminating glue logic and PCB area. |
Use Scenario: Temporary frame buffering for surround-view camera processors before JPEG compression and CAN FD transmission. IC Role / Device Role / Timing Role: High-speed scratchpad memory for image line buffers; operates in 2M×8 mode to match parallel video bus timing. Use Value: Ultra-low 1.5 µA standby current extends runtime of always-on vision modules during vehicle sleep mode. |
| Body Control Module (BCM) | Infotainment Head Unit |
|
Use Scenario: Storing door lock status, window position, and lighting profiles across ignition cycles with battery backup. IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding configuration data; retains contents at 1.5 V during brown-out events. Use Value: Data retention capability eliminates need for external EEPROM wear-leveling firmware and reduces boot-time initialization latency. |
Use Scenario: Audio DSP instruction cache and audio sample buffering in multi-zone amplifier subsystems. IC Role / Device Role / Timing Role: Low-latency memory for real-time FIR filter coefficient loading and PCM sample staging. Use Value: 45 ns access time meets sub-10 µs interrupt response requirement for Class D amplifier PWM synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-10MLI | 10 ns faster access (35 ns), but rated only to +85 °C industrial grade; no AEC-Q100 qualification | Not approved for powertrain or ADAS; limited to body electronics where extended temperature margin is unnecessary | Select only if speed is critical and automotive qualification is waived by OEM design authority |
| AS6C1008-55TIN | 55 ns access time; wider voltage range (2.7 V–5.5 V); no byte-enable or auto power-down features | Lacks BHE/BLE and automatic standby - requires external logic for partial writes and power management | Prefer only in legacy 5 V systems where compatibility outweighs power and configurability benefits |
Compared with IS61WV102416BLL-10MLI and AS6C1008-55TIN, CY62167EV30LL-45ZXIT uniquely delivers AEC-Q100 compliance, dual-bus-width flexibility, and sub-µA standby - making it the only choice for new automotive designs requiring functional safety alignment and long-term supply stability.
Availability
CY62167EV30LL-45ZXIT is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, and body control modules requiring stable component supply across automotive production lifecycles.
Supply support for CY62167EV30LL-45ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications.
CY62167EV30 belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power, high-speed data buffering in battery-constrained automotive subsystems.
FAQ
What package types are offered for CY62167EV30LL-45ZXIT?
CY62167EV30LL-45ZXIT is supplied exclusively in the 48-pin TSOP I package (Z suffix), as indicated by the 'Z' in the part number. The 'XIT' suffix denotes tape-and-reel packaging with industrial temperature screening, though the device itself is rated for Automotive-A (–40 °C to +85 °C) operation. The VFBGA variant uses a different ordering code (e.g., CY62167EV30LL-45BAXI).
How does the BYTE pin function in TSOP I configuration?
In the 48-pin TSOP I package, the BYTE pin (pin 45) must be tied to VCC for 1M × 16 operation or to VSS for 2M × 8 operation. When configured as 2M × 8, pin 45 becomes A20, and I/O8–I/O14, BHE, and BLE are unused - confirmed in the Pin Configuration section (page 3) and Product Portfolio table (page 3) of datasheet 38-05446 Rev. *Q.
Does CY62167EV30LL-45ZXIT support true 16-bit writes without byte masking?
Yes - when both BHE and BLE are asserted LOW simultaneously, the full 16-bit data path (I/O0–I/O15) is enabled for atomic writes. The device does not require external byte-mask logic; internal decoding ensures simultaneous activation of both byte lanes only when both enables are active, as defined in the Functional Description (page 1) and Truth Table (page 12).
What is the minimum VCC required to retain data after power loss?
Data retention is guaranteed down to VCC = 1.5 V, as specified in the Data Retention Characteristics table (page 6, parameter VDR). At this voltage, ICCDR remains ≤10 µA across the full automotive temperature range, enabling reliable holdover during brown-out conditions typical in 12 V automotive electrical systems.
CY62167EV30LL-45ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY62167EV30LL-45ZXIT FAQ
1.How can I place an order for CY62167EV30LL-45ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167EV30LL-45ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167EV30LL-45ZXIT reliable?
The price and inventory of CY62167EV30LL-45ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167EV30LL-45ZXIT is usually 5 days.
3.What payment methods are accepted for CY62167EV30LL-45ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167EV30LL-45ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167EV30LL-45ZXIT?
CY62167EV30LL-45ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167EV30LL-45ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167EV30LL-45ZXIT?
For technical support, including CY62167EV30LL-45ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167EV30LL-45ZXIT requirements.
6.How does Aetrix verify that CY62167EV30LL-45ZXIT is sourced from the original manufacturer or authorized distributors?
All CY62167EV30LL-45ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167EV30LL-45ZXIT meets industry standards.
7.What is the process for return or replacement of CY62167EV30LL-45ZXIT?
All CY62167EV30LL-45ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62167EV30LL-45ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167EV30LL-45ZXIT part is unused and in its original packaging.
Return procedure for CY62167EV30LL-45ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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