Infineon Technologies CY62167G18-55BVXI
- Part No.:
- CY62167G18-55BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62167G18-55BVXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,573
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Product details
Overview
CY62167G18-55BVXI from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® low-power SRAM with embedded single-bit error-correcting code (ECC), configurable as 1M × 16 or 2M × 8, operating at 55 ns access time, 1.65–2.2 V or 4.5–5.5 V supply, and featuring ultra-low 5.5 µA typical standby current. It serves in industrial embedded systems requiring data integrity and power efficiency, such as programmable logic controllers and real-time data buffers.
For engineers reviewing the CY62167G18-55BVXI datasheet, CY62167G18-55BVXI pinout, CY62167G18-55BVXI application, or CY62167G18-55BVXI equivalent, this page delivers verified package mapping (48-ball VFBGA), ECC-enabled read/write behavior, byte-select power-down control, ERR signal functionality, and dual-voltage domain operation - all critical for memory subsystem validation and BOM migration.
Technical Context
This SRAM implements a synchronous, CMOS-based memory array with integrated ECC encode/decode logic that detects and corrects single-bit errors during read cycles without automatic write-back. Its dual chip enable (CE1/CE2) architecture supports hierarchical memory banking, while BHE/BLE pins enable independent upper/lower byte writes and reads.
The device supports two distinct voltage domains: low-voltage (1.65–2.2 V) for portable and battery-backed applications, and legacy 5 V (4.5–5.5 V) for industrial backplanes. The BYTE pin configures the 48-pin TSOP I variant between 1M×16 and 2M×8 modes; in VFBGA, configuration is fixed per ordering code - CY62167G18-55BVXI uses dual CE and includes ERR output.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 or 2M × 8 configuration) |
| Access Time | 55 ns max at 1.65–2.2 V; enables deterministic timing in real-time control loops |
| Standby Current | 5.5 µA typical / 16 µA max; supports >1-year battery backup in nonvolatile retention mode |
| ECC Function | Single-bit error detection and correction per read cycle; no automatic write-back required |
| Supply Voltage | 1.65–2.2 V or 4.5–5.5 V; allows drop-in replacement across legacy and low-power designs |
| Data Retention | 1.0 V minimum VCC; maintains stored data during brown-out or sleep states |
| ERR Output | Active-HIGH open-drain signal indicating corrected single-bit error; enables system-level fault logging |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting 1M-word (16-bit) or 2M-word (8-bit) addressing |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE |
| CE1, CE2 | Dual Chip Enable Inputs | Active-LOW CE1 and active-HIGH CE2 enable hierarchical memory selection |
| WE | Write Enable | Active-LOW control for synchronous write operations; latches data on rising edge of WE |
| OE | Output Enable | Active-LOW control for read data output; places I/Os in high-Z when deasserted |
| BHE, BLE | Byte High/Low Enable | Enable 8-bit sub-word access; simultaneous disable triggers automatic standby entry |
| ERR | Error Indication Output | Open-drain, active-HIGH signal asserted during ECC-corrected read; requires external pull-up |
| VCC, VSS | Power Supply Pins | Separate 1.65–2.2 V or 4.5–5.5 V supply and ground; decoupling required per ball map |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC | Hardware-accelerated single-bit error correction per read cycle without CPU intervention |
| Byte Power-down | Automatic transition to ultra-low standby (<16 µA) when both BHE and BLE are deasserted |
| Dual-Voltage Operation | Single device supports both 1.8 V and 5 V systems via selectable VCC range |
| TTL-Compatible I/O | Direct interface with legacy microcontrollers and FPGAs without level-shifting |
| Configurable Organization | Fixed 1M×16/2M×8 mode per package type; VFBGA variant matches CY62167G18-55BVXI spec |
Applications
| Industrial PLC Memory Buffer | Medical Diagnostic Data Cache |
|---|---|
|
Use Scenario: Stores real-time sensor acquisition buffers and firmware scratchpad in DIN-rail mounted PLCs with extended temperature operation. IC Role / Device Role / Timing Role: Primary volatile working memory with ECC protection against cosmic-ray-induced bit flips in unattended operation. Use Value: Prevents silent data corruption in safety-critical control sequences; 55 ns access ensures deterministic scan-cycle timing. |
Use Scenario: Caches high-resolution imaging frames during CT/MRI reconstruction before DRAM transfer. IC Role / Device Role / Timing Role: Low-latency, error-resilient intermediate buffer between ADC front-end and processing engine. Use Value: ECC eliminates need for software checksum overhead; 1.0 V data retention enables safe suspend-to-RAM during power transitions. |
| Avionics Flight Data Recorder | Ruggedized Edge Gateway |
|
Use Scenario: Captures timestamped telemetry streams in airborne black-box recorders with battery backup. IC Role / Device Role / Timing Role: Battery-backed SRAM holding last 30 seconds of flight parameters prior to crash event. Use Value: 5.5 µA standby current extends backup runtime; 125 °C max ambient rating meets DO-160 thermal requirements. |
Use Scenario: Hosts secure boot code and configuration tables in outdoor IoT gateways exposed to wide thermal swings. IC Role / Device Role / Timing Role: Trusted execution environment memory with hardware-level data integrity assurance. Use Value: Dual-voltage support simplifies design reuse across 3.3 V and 5 V board variants; ERR pin feeds into watchdog fault reporting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102416BLL-10MLI | No embedded ECC; external error handling required; 10 ns faster (10 ns access), but higher 30 µA standby current | Suitable only where software ECC or redundancy is acceptable; lacks ERR pin for hardware fault signaling | Select when speed outweighs reliability needs and system firmware can manage error correction |
| Micron MT48LC16M16A2P-75:C | SDRAM architecture (not SRAM); requires refresh controller; no built-in ECC; 75 MHz clocked interface | Requires memory controller support; incompatible with asynchronous SRAM interfaces | Choose only for bandwidth-constrained systems with existing SDRAM infrastructure and no real-time latency constraints |
Compared with IS61WV102416BLL-10MLI and MT48LC16M16A2P-75:C, CY62167G18-55BVXI uniquely delivers hardware ECC with zero software overhead, sub-10 µA standby, and true asynchronous operation - making it irreplaceable in safety-critical, battery-limited, or controllerless memory applications.
Availability
CY62167G18-55BVXI is available at Aetrix Electronics and suitable for industrial PLCs, medical diagnostic equipment, avionics data loggers, and ruggedized edge gateways requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.
Supply support for CY62167G18-55BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the MoBL® SRAM portfolio, including legacy Cypress memory products. Infineon is a global semiconductor leader headquartered in Munich, Germany.
CY62167G18-55BVXI belongs to the MoBL® (Mobile Bit-Low-power) SRAM product line, designed specifically for industrial and automotive applications demanding ultra-low standby power, data integrity, and wide operating voltage ranges without compromising access speed.
FAQ
Does CY62167G18-55BVXI support automatic error correction write-back?
No. The device performs single-bit error detection and correction during read cycles only, and does not automatically write the corrected data back to the memory array. System firmware must initiate any corrective write if persistent correction is required. This design reduces complexity and power consumption while maintaining data integrity for read-dominant applications.
What is the function of the BYTE pin on CY62167G18-55BVXI?
The BYTE pin is not present on the 48-ball VFBGA package used by CY62167G18-55BVXI; it applies only to the 48-pin TSOP I variant. In VFBGA, memory organization (1M×16 or 2M×8) is fixed per part number - CY62167G18-55BVXI is configured as 1M×16 with dual CE and ERR output, eliminating external configuration dependencies.
Can CY62167G18-55BVXI operate at 3.3 V?
No. The device is specified only for 1.65–2.2 V or 4.5–5.5 V VCC operation. Applying 3.3 V violates absolute maximum ratings and may cause undefined behavior, data corruption, or permanent damage. For 3.3 V systems, consider voltage translation or alternate SRAM families explicitly rated for that range.
How is the ERR pin electrically interfaced?
The ERR pin is an open-drain output requiring an external pull-up resistor to VCC. It asserts HIGH during a read cycle when a single-bit error is detected and corrected. The pin remains LOW otherwise, including during normal reads, writes, or standby. No internal pull-up is provided, and floating connection is not permitted.
CY62167G18-55BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62167G18-55BVXI FAQ
1.How can I place an order for CY62167G18-55BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167G18-55BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167G18-55BVXI reliable?
The price and inventory of CY62167G18-55BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167G18-55BVXI is usually 5 days.
3.What payment methods are accepted for CY62167G18-55BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167G18-55BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167G18-55BVXI?
CY62167G18-55BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167G18-55BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167G18-55BVXI?
For technical support, including CY62167G18-55BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167G18-55BVXI requirements.
6.How does Aetrix verify that CY62167G18-55BVXI is sourced from the original manufacturer or authorized distributors?
All CY62167G18-55BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167G18-55BVXI meets industry standards.
7.What is the process for return or replacement of CY62167G18-55BVXI?
All CY62167G18-55BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62167G18-55BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167G18-55BVXI part is unused and in its original packaging.
Return procedure for CY62167G18-55BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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