Infineon Technologies CY62167G18-55BVXIT
- Part No.:
- CY62167G18-55BVXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62167G18-55BVXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,157
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Product details
Overview
CY62167G18-55BVXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configurable as 1M × 16 or 2M × 8, operating at 55 ns access time over 1.65–2.2 V or 4.5–5.5 V supply, featuring ultra-low 5.5 µA typical standby current and an ERR pin for real-time ECC status indication - deployed in industrial control memory buffers requiring data integrity.
For engineers reviewing the CY62167G18-55BVXIT datasheet, CY62167G18-55BVXIT pinout, CY62167G18-55BVXIT application, or CY62167G18-55BVXIT equivalent, key selection criteria include dual-voltage support, byte-selectable ECC-enabled read/write operation, TSOP I package compatibility, and deterministic ERR signal behavior during single-bit correction events.
Technical Context
This SRAM integrates dedicated ECC encode/decode logic within the memory array, performing on-the-fly single-bit error detection and correction during every read cycle without external logic. The ERR output asserts high only when a correctable error is found and corrected in the accessed word.
It supports two chip-enable architectures (single CE or dual CE1/CE2), byte power-down via simultaneous BHE/BLE deassertion, and flexible data bus configuration (16-bit or 8-bit) via BYTE pin control in TSOP I packages. Address range spans A0–A19 (1M×16) or A0–A20 (2M×8), with NC pins reserved for future density expansion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 or 2M × 8 configuration) |
| Access Time | 55 ns at 1.65–2.2 V; enables synchronous interface timing in 18 MHz systems |
| Supply Voltage | 1.65–2.2 V or 4.5–5.5 V - supports legacy 5 V and modern low-power 1.8 V domains |
| Standby Current | 5.5 µA typical - reduces system-level quiescent power in always-on industrial nodes |
| ECC Function | Embedded single-bit error correction with ERR pin assertion - eliminates need for external ECC logic |
| Data Retention | 1.0 V minimum retention voltage - maintains data integrity during brown-out conditions |
| I/O Compatibility | TTL-compatible inputs/outputs - ensures interoperability with legacy microcontrollers and FPGAs |
Pinout & Package
The CY62167G18-55BVXIT is supplied in a Pb-free 48-pin TSOP I (Type I) surface-mount package, with pin 1 located at bottom-left corner when notch faces upward. Pin functions are validated per Figure 2 and Figure 6 of datasheet 001-81537 Rev. *R.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 1M × 16 mode; A20 becomes active only in 2M × 8 mode when BYTE = VSS |
| I/O0–I/O15 | Bidirectional Data Bus | Full 16-bit width in 1M × 16; lower byte (I/O0–I/O7) active in 2M × 8 mode |
| BHE / BLE | Byte Enable Controls | BHE enables I/O8–I/O15; BLE enables I/O0–I/O7 - enables partial-word writes |
| CE1 / CE2 | Dual Chip Enable | CE1 = LOW and CE2 = HIGH required to enable device in dual-CE configuration |
| ERR | Error Indication Output | Open-drain HIGH pulse indicates successful single-bit correction during read cycle |
| BYTE | Bus Configuration Select | Tied to VCC for 1M × 16; tied to VSS for 2M × 8 (enables A20, disables BHE/BLE/I/O8–I/O14) |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Logic | On-die Hamming-code encoder/decoder corrects single-bit errors without CPU intervention |
| Byte Power-Down | Automatic transition to standby when both BHE and BLE are deasserted - cuts ICC to ISB2 |
| Dual-Voltage Operation | Single device supports 1.8 V and 5 V systems - simplifies BOM consolidation across platforms |
| ERR Pin Assertion | Dedicated open-drain output signals correction event - enables firmware logging or fault escalation |
| Configurable Bus Width | Hardware-selectable 16-bit or 8-bit interface via BYTE pin - adapts to MCU data bus constraints |
Applications
| Industrial PLC Memory Buffer | Medical Diagnostic Imaging Cache |
|---|---|
Use Scenario: Stores real-time sensor fusion data and control state in programmable logic controllers with extended uptime requirements. IC Role / Device Role / Timing Role: Nonvolatile SRAM buffer with ECC protection between FPGA fabric and flash storage - operates at 55 ns with 1.8 V supply. Use Value: Prevents silent data corruption in safety-critical control loops; ERR pin triggers diagnostic interrupt before corrupted data propagates. |
Use Scenario: Caches raw pixel frames during CT/MRI scan acquisition where bit-flip immunity is mandated by IEC 62304. IC Role / Device Role / Timing Role: High-reliability frame buffer interfacing with ASIC image processors - uses 2M × 8 mode for 8-bit parallel pixel streaming. Use Value: Eliminates need for external ECC ICs; 1.0 V data retention preserves frame integrity during brief power interruptions. |
| Avionics Flight Management Unit | Test & Measurement Equipment |
Use Scenario: Holds navigation algorithm coefficients and GPS ephemeris tables in DO-254-compliant flight computers. IC Role / Device Role / Timing Role: ECC-protected working memory for ARM Cortex-R5F core - accessed via 16-bit AXI bus at 18 MHz. Use Value: Meets ED-80 single-event upset (SEU) mitigation requirements without software overhead; ERR signal feeds to health monitoring subsystem. |
Use Scenario: Buffers high-speed waveform capture data in digital oscilloscopes and logic analyzers with >100 MS/s sampling. IC Role / Device Role / Timing Role: Low-latency memory for FIFO-based acquisition engines - configured as 1M × 16 for burst-mode transfers. Use Value: 55 ns access + TTL compatibility ensures timing closure with FPGA-based capture logic; 5.5 µA standby extends battery life in portable units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102416BLL-10MLI | No integrated ECC; requires external error handling logic; 10 ns faster (10 ns access), but higher 25 µA standby current | Lacks hardware-level error reporting; suitable only where firmware-managed ECC is acceptable | Select when speed > reliability; avoid in safety-critical contexts requiring autonomous correction |
| Renesas R1EX24160AS0C#U0 | Includes ECC but no ERR pin; supports only 3.3 V supply; 70 ns access time limits high-throughput use | Cannot signal correction events externally; incompatible with 1.8 V or 5 V systems | Choose only for cost-sensitive 3.3 V designs where ERR visibility is unnecessary |
Compared with IS61WV102416BLL-10MLI and R1EX24160AS0C#U0, CY62167G18-55BVXIT uniquely delivers dual-voltage support, deterministic ERR signaling, and sub-10 µA standby - making it the sole option meeting concurrent industrial temperature, ECC autonomy, and power budget requirements.
Availability
CY62167G18-55BVXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging cache modules, avionics flight management units, and test equipment waveform acquisition systems requiring stable component supply across long product lifecycles.
Supply support for CY62167G18-55BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical support, and manufacturing for the MoBL® SRAM portfolio including CY62167G series.
This device belongs to the MoBL® (Mobile Bitline) low-power SRAM product line, engineered specifically for battery-operated and thermally constrained industrial and medical systems requiring ECC assurance without performance penalty.
FAQ
Does CY62167G18-55BVXIT support automatic write-back after ECC correction?
No. The device performs single-bit error correction on read-only basis and does not modify the stored data in memory array. Corrected data appears on I/O lines, but the original erroneous bit remains uncorrected in the cell - firmware must initiate a write cycle if permanent correction is required.
Can the ERR pin be left unconnected if ECC status monitoring is not needed?
Yes. The ERR pin is an open-drain output and may be left floating when unused. It does not affect memory functionality or ECC operation. No pull-up or termination is required unless the host system actively monitors the signal for diagnostics.
What happens to the BHE and BLE pins in 2M × 8 configuration?
In 2M × 8 mode (BYTE = VSS), BHE, BLE, and I/O8 through I/O14 are disabled and must be left floating. Only I/O0–I/O7 remain active, and A20 becomes functional as the 21st address line - enabling full 2M-word addressing without external demultiplexing.
Is the 48-pin TSOP I package RoHS-compliant and lead-free?
Yes. The CY62167G18-55BVXIT is manufactured in a Pb-free 48-pin TSOP I package compliant with RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) - suitable for standard reflow soldering profiles.
CY62167G18-55BVXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62167G18-55BVXIT FAQ
1.How can I place an order for CY62167G18-55BVXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167G18-55BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167G18-55BVXIT reliable?
The price and inventory of CY62167G18-55BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167G18-55BVXIT is usually 5 days.
3.What payment methods are accepted for CY62167G18-55BVXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167G18-55BVXIT transactions.
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4.How is shipping managed for CY62167G18-55BVXIT?
CY62167G18-55BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167G18-55BVXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167G18-55BVXIT?
For technical support, including CY62167G18-55BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167G18-55BVXIT requirements.
6.How does Aetrix verify that CY62167G18-55BVXIT is sourced from the original manufacturer or authorized distributors?
All CY62167G18-55BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167G18-55BVXIT meets industry standards.
7.What is the process for return or replacement of CY62167G18-55BVXIT?
All CY62167G18-55BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62167G18-55BVXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167G18-55BVXIT part is unused and in its original packaging.
Return procedure for CY62167G18-55BVXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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