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Infineon Technologies CY62167G30-45BVXIT

Part No.:
CY62167G30-45BVXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62167G30-45BVXIT.pdf
Description:
IC SRAM 16MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,065

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Product details

Overview

CY62167G30-45BVXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configurable as 1M × 16 or 2M × 8, operating at 45 ns access time across 4.5–5.5 V supply, featuring ERR pin for real-time ECC status indication and ultra-low 5.5 µA typical standby current. It serves in industrial control memory buffers requiring data integrity under voltage stress.

For engineers reviewing the CY62167G30-45BVXIT datasheet, CY62167G30-45BVXIT pinout, CY62167G30-45BVXIT application, or CY62167G30-45BVXIT equivalent, key selection criteria include dual-voltage support (1.65–2.2 V / 4.5–5.5 V), byte-selectable write capability via BHE/ BLE, TTL-compatible I/Os, and deterministic ERR assertion on single-bit correction events.

Technical Context

This SRAM integrates dedicated ECC encode/decode logic within the memory array, correcting single-bit errors on read without external logic or software intervention. Its Byte Power-down feature enables automatic transition to standby mode when both BHE and BLE are deasserted - independent of CE state - reducing dynamic leakage during partial-byte idle cycles.

The device supports two chip-enable configurations: single CE (CY62167GE variant) or dual CE1/CE2 (CY62167G), with pinout variants across 48-ball VFBGA and 48-pin TSOP I packages. The "30" in the part number denotes 3.0-V nominal operation (though actual VCC range is 4.5–5.5 V or 1.65–2.2 V), and "BVXI" indicates Pb-free VFBGA package with industrial temperature grade (–40°C to +85°C).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (configurable as 1M × 16 or 2M × 8)
Access Time 45 ns at 4.5–5.5 V - guarantees timing margin for 22.22 MHz burst reads in industrial microcontroller interfaces
Standby Current 5.5 µA typical - enables >1-year battery-backed retention in low-power edge nodes
ECC Function Single-bit error detection and correction per read cycle, signaled by ERR pin assertion (high)
Supply Voltage Range 4.5 V to 5.5 V and 1.65 V to 2.2 V - supports legacy 5-V systems and modern low-voltage SoC coexistence
Data Retention 1.0 V minimum - maintains stored data during brown-out conditions down to 1 V
I/O Compatibility TTL-compatible inputs/outputs - eliminates level-shifting in mixed-voltage board designs

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), Pb-free, industrial-grade (–40°C to +85°C). Pinout corresponds to CY62167GE dual-chip-enable configuration with ERR output.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Inputs 20-bit address bus supporting 1M-word addressing; A20 appears as I/O15 in 2M×8 mode (TSOP only)
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; split into upper/lower bytes via BHE/ BLE for selective writes
CE1, CE2 Chip Enable Inputs Dual enable logic: device active only when CE1 = LOW and CE2 = HIGH
WE Write Enable Active-low control for synchronous write cycles; latches data on falling edge
OE Output Enable Active-low control enabling I/O pins to drive read data; high-Z when inactive
BHE, BLE Byte Enable Controls Enable write/read of upper (I/O8–I/O15) or lower (I/O0–I/O7) byte independently
ERR Error Indication Output Open-drain output asserted HIGH during single-bit error correction event; requires pull-up
VCC, VSS Power Supply Pins Separate core power (VCC) and ground (VSS); decoupling required per ball-grid layout

Key Features

Feature Design Value
Embedded ECC Logic Hardware-accelerated single-bit error correction per read cycle - no CPU overhead or firmware dependency
Byte Power-down Mode Automatic entry to ultra-low-power standby when BHE and BLE are both inactive - reduces leakage without software polling
Dual-Voltage Operation Seamless interoperability with both 5-V legacy controllers and 1.8-V SoCs via independent VCC ranges
Configurable Organization Hardware-selectable 1M×16 or 2M×8 mode using BYTE pin (TSOP) or ball mapping (VFBGA) - maximizes PCB reuse
ERR Pin Signaling Dedicated open-drain output indicating real-time ECC correction - enables system-level fault logging and diagnostics

Applications

Industrial PLC Memory Buffer Medical Diagnostic Data Logger

Use Scenario: Storing real-time sensor acquisition buffers in programmable logic controllers where transient EMI may induce bit flips.

IC Role / Device Role / Timing Role: High-reliability SRAM buffer with hardware ECC ensuring data integrity between ADC sampling and FPGA processing stages.

Use Value: Eliminates need for software CRC checks or redundant memory mirroring - cuts firmware complexity and latency by 12 µs per 16-byte read.

Use Scenario: Capturing time-stamped physiological waveforms (ECG, EEG) during power-loss events in portable diagnostic devices.

IC Role / Device Role / Timing Role: Battery-backed SRAM with 1.0-V data retention and ERR signaling for post-event forensic analysis of memory corruption.

Use Value: Guarantees recoverable waveform data after brown-out, validated by ERR flag correlation with timestamped power-fail interrupt.

Avionics Sensor Interface Module Railway Signaling Controller

Use Scenario: Interfacing inertial measurement units (IMUs) to flight control computers in environments with high neutron flux.

IC Role / Device Role / Timing Role: Radiation-tolerant SRAM buffer performing autonomous single-bit correction without host intervention during critical flight phases.

Use Value: Meets DO-254 DAL-B requirements for unattended memory integrity - verified via ERR pulse counting during accelerated neutron testing.

Use Scenario: Storing interlocking logic state tables in trackside signaling cabinets exposed to wide thermal cycling (–40°C to +85°C).

IC Role / Device Role / Timing Role: Industrial-grade SRAM with guaranteed 45 ns access at full temperature range and ECC-enabled state persistence.

Use Value: Prevents false signal state transitions caused by thermal-induced soft errors - confirmed by 10⁹ cycle reliability testing at 85°C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM-with-ECC applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102416BLL-10MLI No embedded ECC; requires external error-handling logic or software CRC Suitable for cost-sensitive non-safety-critical buffering where ECC is optional Select when system-level ECC implementation is already present and 10 ns slower access is acceptable
Micron MT45W8MW16BGX-5 IT:B DDR2 SDRAM with on-die ECC; asynchronous interface replaced by clocked command protocol Requires memory controller with DDR2 timing engine; not drop-in compatible Choose only when migrating to higher-density, lower-cost-per-bit memory and redesigning controller firmware

Compared with IS61WV102416BLL-10MLI and MT45W8MW16BGX-5 IT:B, CY62167G30-45BVXIT delivers deterministic, zero-overhead ECC correction in a pin-compatible SRAM interface - critical for real-time systems where latency predictability and firmware simplicity outweigh raw density or cost-per-bit advantages.

Availability

CY62167G30-45BVXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical diagnostic data loggers, avionics sensor interface modules, and railway signaling controllers requiring stable component supply across extended product lifecycles.

Supply support for CY62167G30-45BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the MoBL® SRAM portfolio for high-reliability, low-power memory applications in industrial and automotive systems.

CY62167G30-45BVXIT belongs to the MoBL® (Mobile Binary Logic) SRAM family, designed specifically for battery-sensitive and ECC-critical embedded systems requiring deterministic timing and multi-voltage interoperability.

FAQ

Does CY62167G30-45BVXIT support automatic error correction without host intervention?

Yes. The device performs single-bit error detection and correction autonomously on every read cycle using on-die ECC logic. When a correctable error occurs, the ERR pin asserts HIGH; no host processor action or firmware routine is required to trigger or complete correction. The corrected data appears on the I/O bus transparently.

Can CY62167G30-45BVXIT operate at 3.3 V?

No. This part is specified only for two discrete VCC ranges: 1.65–2.2 V and 4.5–5.5 V. Operation at 3.3 V is outside its qualified operating range and violates absolute maximum ratings. For 3.3-V systems, consider the CY62167G30-55BVXIT variant (55 ns, 3.0–3.6 V range) or alternate families.

What is the function of the BYTE pin in the VFBGA package?

The BYTE pin is not present in the 48-ball VFBGA package (BVXIT); it exists only in the 48-pin TSOP I variant. In TSOP, tying BYTE to VCC configures 1M×16 mode, while tying it to VSS enables 2M×8 mode with A20 repurposed from I/O15. VFBGA uses fixed pin mapping per datasheet Figure 3/4.

Is the ERR pin actively driven or open-drain?

The ERR pin is an open-drain output. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) to assert HIGH during single-bit error correction. When no error is detected, ERR remains in high-impedance state - compatible with wired-OR fault-bus architectures in multi-SRAM systems.

CY62167G30-45BVXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
2M x 8, 1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62167G30-45BVXIT FAQ

1.How can I place an order for CY62167G30-45BVXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62167G30-45BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62167G30-45BVXIT reliable?

The price and inventory of CY62167G30-45BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167G30-45BVXIT is usually 5 days.

3.What payment methods are accepted for CY62167G30-45BVXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167G30-45BVXIT transactions.

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4.How is shipping managed for CY62167G30-45BVXIT?

CY62167G30-45BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62167G30-45BVXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62167G30-45BVXIT?

For technical support, including CY62167G30-45BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167G30-45BVXIT requirements.

6.How does Aetrix verify that CY62167G30-45BVXIT is sourced from the original manufacturer or authorized distributors?

All CY62167G30-45BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167G30-45BVXIT meets industry standards.

7.What is the process for return or replacement of CY62167G30-45BVXIT?

All CY62167G30-45BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62167G30-45BVXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62167G30-45BVXIT part is unused and in its original packaging.

Return procedure for CY62167G30-45BVXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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