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Infineon Technologies CY62167G30-45ZXA
- Part No.:
- CY62167G30-45ZXA
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62167G30-45ZXA.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:4,091
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Product details
Overview
CY62167G30-45ZXA from Cypress Semiconductor is an AEC-Q100 qualified automotive-grade 16-Mbit (1M × 16-bit) static RAM with embedded single-bit error-correcting code (ECC), operating at 45 ns access time, 2.2–3.6 V supply, and -40 °C to +85 °C (Automotive-A) temperature range. It features dual chip-enable (CE1/CE2), byte-level control via BHE/BLE, and ultra-low standby current (5.5 µA typical). Used in engine control units and ADAS domain controllers where data integrity and low-power retention are critical.
For engineers reviewing the CY62167G30-45ZXA datasheet, CY62167G30-45ZXA pinout, CY62167G30-45ZXA application, or CY62167G30-45ZXA equivalent, key selection considerations include ECC support for safety-critical memory, dual CE timing compatibility, TSOP I vs. VFBGA package trade-offs, and byte power-down behavior under BHE/BLE deassertion.
Technical Context
The CY62167G30-45ZXA implements a 1M × 16-bit SRAM array with dedicated ECC encode/decode logic that detects and corrects single-bit errors on read, but does not support automatic write-back on error detection. Its dual chip-enable architecture requires CE1 = LOW and CE2 = HIGH for device selection, enabling hierarchical memory mapping in multi-chip systems.
It supports two operational modes: standard 1M × 16-bit configuration (BYTE tied to VCC) and 2M × 8-bit mode (BYTE tied to VSS) in the 48-pin TSOP I package. The "Byte Power Down" feature activates when both BHE and BLE are deasserted, forcing automatic entry into standby regardless of CE state-enabling fine-grained power gating per memory access granularity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits); enables compact storage for firmware buffers and real-time log tables in ECUs. |
| Access Time | 45 ns max (Automotive-A grade); ensures deterministic timing for 22 MHz synchronous bus interfaces without wait states. |
| Supply Voltage | 2.2 V to 3.6 V; compatible with automotive 3.3 V domains and tolerant of battery voltage sag down to 2.2 V. |
| Standby Current | 5.5 µA typical / 16 µA max at +85 °C; reduces quiescent power in always-on modules like CAN gateways. |
| ECC Function | Single-bit error correction per 16-bit word; satisfies ASIL-B functional safety requirements without external logic. |
| Data Retention | 1.0 V minimum VCC; maintains memory contents during deep sleep or brown-out conditions below normal operating voltage. |
| Operating Temp | -40 °C to +85 °C (Automotive-A); validated for under-hood and cabin-mounted control units per AEC-Q100 Rev G. |
Pinout & Package
Package: 48-pin TSOP I (Type I, 12 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, Pb-free. Pin 1 marked by notch/dot; pin 45 functions as A20 in 2M × 8 mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE1, CE2 | Dual chip-enable inputs | Both required active (CE1 = LOW, CE2 = HIGH) for device selection; enables bank isolation in multi-SRAM systems. |
| BHE, BLE | Byte high/low enable | BHE controls I/O8–I/O15; BLE controls I/O0–I/O7; independent byte writes reduce bus contention and power. |
| WE | Write enable | LOW-active; initiates write cycle only when CE1/CE2 and at least one byte enable are asserted. |
| OE | Output enable | LOW-active; places I/O0–I/O15 in HI-Z when HIGH, allowing shared bus operation with other peripherals. |
| A0–A19 | Address inputs | 20-bit address bus supports full 1M-word addressing; A19 unused in 2M × 8 mode (pin 45 becomes A20). |
| I/O0–I/O15 | Bidirectional data bus | 16-bit parallel interface; TTL-compatible levels simplify interfacing with microcontrollers and ASICs. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC | On-die single-bit error correction per 16-bit word eliminates need for external ECC logic or software overhead. |
| Byte Power Down | Automatic transition to standby when BHE and BLE are both deasserted-enables per-access power gating without CE manipulation. |
| Dual Chip Enable | Independent CE1/CE2 logic allows hierarchical memory decoding and avoids bus contention in multi-device configurations. |
| Configurable Organization | Hardware-selectable 1M × 16-bit (BYTE = VCC) or 2M × 8-bit (BYTE = VSS) mode increases design flexibility across platform variants. |
| Low-Voltage Data Retention | Maintains stored data at 1.0 V VCC, supporting fail-safe logging during power collapse events in automotive systems. |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
|
Use Scenario: Real-time storage of sensor fusion outputs and actuator command history for closed-loop torque control. IC Role / Device Role / Timing Role: High-reliability scratchpad memory with ECC-protected buffer for transient fault resilience during combustion cycles. Use Value: Prevents single-event upsets from corrupting throttle or ignition timing data-meeting ISO 26262 ASIL-B diagnostic coverage targets. |
Use Scenario: Frame buffering for radar pre-processing pipelines in 77 GHz front-end modules. IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory for time-critical DSP kernels running on automotive SoCs. Use Value: 45 ns access time enables zero-wait-state operation with 22 MHz AXI-lite or AHB buses used in radar signal processors. |
| Body Control Module (BCM) | Infotainment Head Unit |
|
Use Scenario: Storing door lock status, window position, and lighting configuration across ignition cycles. IC Role / Device Role / Timing Role: Non-volatile shadow RAM with 1.0 V data retention for battery-backed parameter storage. Use Value: Eliminates need for external backup capacitors or EEPROM wear leveling-reducing BOM cost and board space. |
Use Scenario: Boot-time firmware decompression buffer and runtime GUI asset caching in Linux-based head units. IC Role / Device Role / Timing Role: High-speed parallel SRAM interfaced directly to ARM Cortex-A application processor's SDRAM controller. Use Value: Dual CE architecture allows seamless interleaving with other memory-mapped peripherals without arbitration logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV102416BLL-45NLI | No embedded ECC; 45 ns access, 2.5–3.6 V, -40 °C to +85 °C; 48-pin TSOP I package. | Lacks hardware ECC-requires software-based error detection or external logic for ASIL-B compliance. | Select when ECC is handled at system level and cost sensitivity outweighs safety certification effort. |
| ON Semiconductor NVSRAM NB16L16V45Z | Non-volatile SRAM with integrated EEPROM backup; 45 ns, 3.0–3.6 V, -40 °C to +85 °C; no BHE/BLE pins. | Provides automatic data retention on power loss but lacks byte-level write control and dual CE architecture. | Select when persistent storage without external backup power is mandatory, and byte masking is not required. |
Compared with IS62WV102416BLL-45NLI and NB16L16V45Z, CY62167G30-45ZXA uniquely delivers on-die ECC, dual CE timing, and byte power-down-all in a single 48-pin TSOP I footprint-making it optimal for ASIL-B memory subsystems requiring deterministic latency and minimal external components.
Availability
CY62167G30-45ZXA is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, and body control modules requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualification.
Supply support for CY62167G30-45ZXA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications, with focus on functional safety and low-power integration.
CY62167G belongs to Cypress's MoBL® (More Battery Life) SRAM product line, engineered specifically for automotive electronics demanding AEC-Q100 qualification, ECC protection, and sub-10 µA standby current in harsh environments.
FAQ
Does CY62167G30-45ZXA support automatic error correction on write operations?
No. The embedded ECC corrects single-bit errors only during read operations. The device does not perform automatic write-back or error injection correction on writes, as explicitly stated in Note 1 of the datasheet. Error detection occurs on read; corrected data is output, but the original memory location remains unmodified unless rewritten by system firmware.
Can CY62167G30-45ZXA operate in 2M × 8-bit mode using the 48-pin TSOP I package?
Yes. When the BYTE pin is tied to VSS, the device configures as a 2M × 8-bit SRAM. In this mode, pin 45 becomes address line A20, and I/O8–I/O15, BHE, and BLE are unused. The datasheet confirms this behavior on page 4 (Pin Configurations) and in the Product Portfolio table on page 4.
What is the role of the dual chip-enable (CE1/CE2) architecture?
CE1 and CE2 function as complementary enables: the device activates only when CE1 is LOW and CE2 is HIGH. This architecture prevents partial selection glitches and enables hierarchical decoding-e.g., CE1 driven by a higher-order address decoder and CE2 by a chip-select signal-improving noise immunity in automotive wiring harnesses.
How does the Byte Power Down feature interact with chip-enable signals?
When both BHE and BLE are deasserted (HIGH), the device enters standby mode *regardless* of CE1/CE2 state-overriding chip-enable control. This allows power gating based on data bus activity rather than address decoding, reducing dynamic power in burst-mode applications like video frame buffering where byte enables reflect actual data width usage.
CY62167G30-45ZXA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY62167G30-45ZXA FAQ
1.How can I place an order for CY62167G30-45ZXA through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167G30-45ZXA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167G30-45ZXA reliable?
The price and inventory of CY62167G30-45ZXA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167G30-45ZXA is usually 5 days.
3.What payment methods are accepted for CY62167G30-45ZXA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167G30-45ZXA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167G30-45ZXA?
CY62167G30-45ZXA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167G30-45ZXA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167G30-45ZXA?
For technical support, including CY62167G30-45ZXA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167G30-45ZXA requirements.
6.How does Aetrix verify that CY62167G30-45ZXA is sourced from the original manufacturer or authorized distributors?
All CY62167G30-45ZXA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167G30-45ZXA meets industry standards.
7.What is the process for return or replacement of CY62167G30-45ZXA?
All CY62167G30-45ZXA units undergo pre-shipment inspection (PSI). If there is an issue with CY62167G30-45ZXA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167G30-45ZXA part is unused and in its original packaging.
Return procedure for CY62167G30-45ZXA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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