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Infineon Technologies CY62167G30-45ZXAT
- Part No.:
- CY62167G30-45ZXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62167G30-45ZXAT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:1,562
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Product details
Overview
CY62167G30-45ZXAT from Cypress Semiconductor is an AEC-Q100 qualified automotive-grade 16-Mbit (1M × 16) static RAM with embedded single-bit error-correcting code (ECC), operating at 45 ns access time, 2.2–3.6 V supply, and -40 °C to +85 °C (Automotive-A) temperature range. It features dual chip-enable (CE1/CE2), byte-level write control (BHE/BLE), and ultra-low standby current (5.5 µA typical).
For engineers reviewing the CY62167G30-45ZXAT datasheet, CY62167G30-45ZXAT pinout, CY62167G30-45ZXAT application, or CY62167G30-45ZXAT equivalent, key selection criteria include ECC support for safety-critical memory, TSOP I / VFBGA package compatibility, byte power-down capability, and automotive temperature compliance.
Technical Context
The CY62167G30-45ZXAT implements a dual CE architecture requiring CE1 = LOW and CE2 = HIGH for device selection, with independent BHE (I/O8–I/O15) and BLE (I/O0–I/O7) for 8-bit byte writes or reads. Its ECC logic detects and corrects single-bit errors in real time without automatic write-back.
It supports two memory configurations: default 1M × 16 mode (BYTE tied to VCC) and optional 2M × 8 mode (BYTE tied to VSS, A20 enabled on I/O15), with all I/Os entering HI-Z when deselected or during byte power-down-triggered solely by simultaneous deassertion of BHE and BLE.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 words × 16 bits); enables compact high-bandwidth data buffering in ECUs. |
| Access Time | 45 ns max (Automotive-A grade); ensures deterministic timing for real-time control loops. |
| Supply Voltage | 2.2 V to 3.6 V; compatible with modern low-voltage automotive power domains. |
| Standby Current | 5.5 µA typical / 16 µA max at +85 °C; reduces quiescent power in always-on modules. |
| ECC Function | Single-bit error correction per 16-bit word; improves functional safety without external logic. |
| Operating Temp | -40 °C to +85 °C (Automotive-A); certified for engine bay–adjacent and cabin-control applications. |
| Data Retention | 1.0 V minimum VCC; maintains memory state during brown-out or sleep-mode battery conservation. |
Pinout & Package
Package: 48-pin TSOP I (Type I, 12 mm × 20 mm, 0.5 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word addressing; A19 used only in 2M×8 mode. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE. |
| CE1, CE2 | Dual Chip Enable | Active-Low CE1 and Active-High CE2 must both be asserted for access; enables hierarchical memory decoding. |
| WE | Write Enable | Active-Low signal initiating write cycle; timing-critical for setup/hold compliance. |
| OE | Output Enable | Active-Low control for read data output; decouples read timing from address/CE transitions. |
| BHE, BLE | Byte High/Low Enable | Independent 8-bit write/read gating; enables partial-word updates without read-modify-write overhead. |
| VCC, VSS | Power Supply | Single 2.2–3.6 V supply with dedicated ground pins; supports low-noise layout partitioning. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC | On-die single-bit error correction per 16-bit word, eliminating need for external ECC logic or software overhead. |
| Byte Power-Down | Automatic transition to standby when both BHE and BLE are deasserted-regardless of CE state-reducing dynamic leakage. |
| Dual Chip-Enable Logic | CE1 (active-Low) and CE2 (active-High) provide noise-immune enable sequencing and flexible address decoding. |
| Configurable Memory Width | 1M×16 (BYTE=VCC) or 2M×8 (BYTE=VSS) modes via single pin, enabling reuse across 8-/16-bit bus architectures. |
| Automotive Qualification | AEC-Q100 Grade 2 (Automotive-A) qualification with full temperature and reliability testing per automotive standards. |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
Use Scenario: Real-time storage of sensor fusion buffers and actuator command history in ISO 26262 ASIL-B compliant powertrain controllers. IC Role / Device Role / Timing Role: Primary volatile working memory with ECC-protected data retention during transient voltage dips. Use Value: Prevents silent data corruption in closed-loop fuel injection or ignition timing calculations under EMI stress. | Use Scenario: Frame buffering for radar pre-processing units operating in ambient temperatures up to +85 °C. IC Role / Device Role / Timing Role: Low-latency, error-resilient SRAM for intermediate results between DSP and microcontroller. Use Value: 45 ns access time meets pipeline timing budgets; ECC mitigates soft errors from cosmic radiation in vehicle-mounted sensors. |
| Infotainment Head Unit | Body Control Module (BCM) |
Use Scenario: Storing UI state, audio metadata, and navigation cache in head units with extended thermal cycling exposure. IC Role / Device Role / Timing Role: Non-volatile-retentive SRAM for fast resume-from-sleep functionality using 1.0 V data retention mode. Use Value: Enables sub-second wake-up while maintaining ASIL-compliant memory integrity without backup battery. | Use Scenario: Logging diagnostic trouble codes (DTCs) and CAN message timestamps in gateways with intermittent power. IC Role / Device Role / Timing Role: Fault-tolerant memory for persistent event logging with guaranteed single-bit error recovery. Use Value: Eliminates need for redundant memory or checksum-based retransmission in Class A communication subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS62WV102416BLL-45NLI | No embedded ECC; requires external error detection logic; 45 ns access, same 1M×16 density and -40°C to +85°C rating. | Suitable for non-safety-critical infotainment or telematics where ECC is handled in software or not required. | Select if system-level ECC is already implemented and cost sensitivity outweighs integrated reliability. |
| MT48LC16M16A2P-6A:J | SDRAM (not SRAM); requires refresh controller; higher density (256 Mbit) but longer latency (~5–6 ns CL + tRCD). | Applicable only where burst-access patterns dominate and deterministic timing is less critical than bandwidth. | Choose only for high-throughput buffer applications with available SDRAM controller resources. |
Compared with IS62WV102416BLL-45NLI and MT48LC16M16A2P-6A:J, the CY62167G30-45ZXAT uniquely delivers zero-software-overhead ECC, deterministic 45 ns SRAM timing, and byte-level power gating-making it optimal for ASIL-B memory subsystems where failure modes must be contained at the silicon level.
Availability
CY62167G30-45ZXAT is available at Aetrix Electronics and suitable for engine control units, ADAS radar processors, and automotive infotainment systems requiring stable component supply across extended product lifecycles.
Supply support for CY62167G30-45ZXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications.
The CY62167G series targets functional-safety-aware automotive electronics, delivering ECC-enhanced SRAMs optimized for ASIL-B compliance, low-power operation, and extended temperature resilience.
FAQ
Does CY62167G30-45ZXAT support automatic error correction without host intervention?
Yes. The device performs single-bit error correction transparently on every read access using on-die ECC logic. No host processor action or firmware routine is required-the corrected data appears directly on the I/O bus. However, it does not support automatic write-back after correction, meaning uncorrected multi-bit errors remain unhandled.
Can CY62167G30-45ZXAT operate in 2M × 8 configuration on the same PCB footprint?
Yes. By tying the BYTE pin to VSS (instead of VCC), the device reconfigures as a 2M × 8 SRAM. In this mode, pin 45 becomes A20, and I/O8–I/O14, BHE, and BLE are unused. No PCB redesign is needed, but address decoding and byte-lane routing must accommodate the wider address space.
What is the role of the dual chip-enable (CE1/CE2) interface?
The dual CE interface (CE1 active-Low, CE2 active-High) provides noise-immune selection by requiring complementary logic states. This prevents false activation from ground bounce or supply transients and enables hierarchical memory mapping-e.g., CE2 driven by upper address bits and CE1 by decode logic-improving system-level robustness.
How does the Byte Power-Down feature reduce power consumption?
When both BHE and BLE are deasserted (HIGH), the device enters standby mode-even if CE1/CE2 remain asserted-cutting ICC to ≤16 µA (max). This allows fine-grained power gating of unused memory segments in multi-threaded or multi-function automotive MCUs without requiring full chip disable.
CY62167G30-45ZXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY62167G30-45ZXAT FAQ
1.How can I place an order for CY62167G30-45ZXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167G30-45ZXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167G30-45ZXAT reliable?
The price and inventory of CY62167G30-45ZXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167G30-45ZXAT is usually 5 days.
3.What payment methods are accepted for CY62167G30-45ZXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167G30-45ZXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167G30-45ZXAT?
CY62167G30-45ZXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167G30-45ZXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167G30-45ZXAT?
For technical support, including CY62167G30-45ZXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167G30-45ZXAT requirements.
6.How does Aetrix verify that CY62167G30-45ZXAT is sourced from the original manufacturer or authorized distributors?
All CY62167G30-45ZXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167G30-45ZXAT meets industry standards.
7.What is the process for return or replacement of CY62167G30-45ZXAT?
All CY62167G30-45ZXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62167G30-45ZXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167G30-45ZXAT part is unused and in its original packaging.
Return procedure for CY62167G30-45ZXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62167G30-45ZXAT Tags
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M24C02-WMN6TP
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