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Infineon Technologies CY62167G30-45ZXI
- Part No.:
- CY62167G30-45ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62167G30-45ZXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:588
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Product details
Overview
CY62167G30-45ZXI from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configurable as 1M × 16 or 2M × 8, operating at 45 ns access time with 1.65–2.2 V or 4.5–5.5 V supply, and featuring ultra-low 5.5 µA typical standby current. It serves in industrial control systems requiring data integrity under voltage stress or radiation-prone environments.
For engineers reviewing the CY62167G30-45ZXI datasheet, CY62167G30-45ZXI pinout, CY62167G30-45ZXI application, or CY62167G30-45ZXI equivalent, this device delivers deterministic ECC correction without write-back, byte-selectable power-down, TTL-compatible I/O, and dual-voltage support for legacy and low-power system integration.
Technical Context
The CY62167G30-45ZXI implements a synchronous CMOS SRAM core with dedicated ECC encode/decode logic that detects and corrects single-bit errors on every read cycle. Its Byte Power-down feature enables automatic transition to standby when both BHE and BLE are deasserted - independent of CE state - reducing dynamic leakage in partial-access memory subsystems.
This part supports dual chip enable (CE1/CE2) and includes dedicated byte enable (BHE/BLE), output enable (OE), and write enable (WE) controls for precise 8-bit or 16-bit data transfers. The ERR pin (present in GE variant) signals corrected errors but does not auto-initiate refresh or retry - correction occurs transparently within the read path.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (configurable as 1M × 16 or 2M × 8) |
| Access Time | 45 ns at 4.5–5.5 V - guarantees timing margin for 22.22 MHz burst reads |
| Supply Voltage Ranges | 1.65–2.2 V and 4.5–5.5 V - supports mixed-voltage board designs and legacy 5 V interfaces |
| Standby Current | 5.5 µA typical - enables >1-year battery-backed retention in industrial logging systems |
| ECC Function | Single-bit error detection and correction per read - no software overhead, no write-back latency |
| Data Retention | 1.0 V minimum - maintains stored data during brown-out or controlled power-down sequences |
| I/O Compatibility | TTL-compatible inputs/outputs - direct interface with legacy microcontrollers and FPGAs without level shifters |
Pinout & Package
Package: 48-pin TSOP I (Type I, 12 mm × 20 mm), RoHS-compliant, lead-free. Pinout validated per Figure 2 (CY62167G) and Figure 6 (CY62167GE) in datasheet 001-81537 Rev. *R.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M×16 or 2M×8 addressing; A20 repurposed as I/O15 in 2M×8 mode |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE for byte writes |
| CE1, CE2 | Dual Chip Enable Inputs | Active-low CE1 and active-high CE2 required for access - enables bank selection in multi-SRAM systems |
| WE, OE, BHE, BLE | Control Inputs | Separate write enable, output enable, and byte enables allow granular 8-bit writes and high-impedance isolation |
| VCC, VSS | Power Supply Terminals | Dual VCC pins (pins 24 & 42) and multiple VSS (pins 11, 23, 35) reduce IR drop and improve noise immunity |
| ERR | Error Indication Output | Open-drain HIGH pulse during corrected read - used for system-level fault logging, not interrupt generation |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC | Hardware-accelerated single-bit error correction per read cycle - eliminates need for external ECC logic or software overhead |
| Byte Power-down | Automatic entry into standby when BHE and BLE are both inactive - reduces idle power without CPU intervention |
| Dual-Voltage Operation | Seamless operation across 1.65–2.2 V (low-power) and 4.5–5.5 V (legacy) rails - avoids external regulators in hybrid systems |
| Configurable Organization | 1M × 16 or 2M × 8 via BYTE pin tie (VCC/VSS) - one footprint supports two memory mapping strategies |
| TTL-Compatible I/O | Direct connection to 5 V microcontrollers and FPGAs - no level-shifting circuitry required in mixed-signal designs |
Applications
| Industrial PLC Memory Buffer | Medical Imaging Frame Store |
|---|---|
|
Use Scenario: Real-time buffering of sensor data streams in programmable logic controllers with extended temperature operation. IC Role / Device Role / Timing Role: High-reliability SRAM buffer with ECC ensuring data integrity during voltage transients and EMI exposure. Use Value: Prevents silent data corruption in safety-critical control loops - verified under –40 °C to +85 °C industrial grade conditions. |
Use Scenario: Temporary storage of uncompressed DICOM image frames during acquisition in portable ultrasound devices. IC Role / Device Role / Timing Role: Low-latency, low-power frame buffer enabling rapid pixel transfer between ADC and display engine. Use Value: 45 ns access time sustains >22 MHz pixel clock rates; 5.5 µA standby extends battery life between imaging sessions. |
| Avionics Data Logger | Test & Measurement Equipment |
|
Use Scenario: Nonvolatile event logging in flight data recorders where power interruption is frequent and radiation-induced soft errors occur. IC Role / Device Role / Timing Role: ECC-enabled SRAM retaining valid data down to 1.0 V - bridges gaps until backup power engages. Use Value: Eliminates need for external checksum validation or redundant memory banks - reduces BOM count and PCB area. |
Use Scenario: High-speed waveform capture buffer in digital oscilloscopes requiring deterministic read latency and signal fidelity. IC Role / Device Role / Timing Role: Synchronous SRAM interfaced directly to FPGA logic for glitch-free sampling at 20+ MS/s. Use Value: TTL-compatible I/O and 45 ns timing ensure setup/hold compliance with FPGA I/O standards without custom timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-10MLI | No integrated ECC; requires external error handling logic or software layer | Suitable only where bit errors are statistically negligible (e.g., benign lab environments) | Select if cost sensitivity outweighs reliability requirements and system firmware can manage ECC |
| AS6C1008-55PCN | 55 ns speed grade only; no dual-voltage support (3.3 V fixed); no ERR pin or byte power-down | Limited to 3.3 V systems with relaxed timing margins and no ECC requirement | Choose only for simple, low-cost 3.3 V memory expansion where ECC and ultra-low ISB are unnecessary |
Compared with IS61WV102416BLL-10MLI and AS6C1008-55PCN, CY62167G30-45ZXI uniquely combines hardware ECC, dual-voltage operation, and sub-10 µA standby - making it the sole option for industrial or avionics SRAM where data integrity and power efficiency are co-constrained.
Availability
CY62167G30-45ZXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging frame stores, avionics data loggers, and test & measurement equipment requiring stable component supply across extended temperature and dual-voltage operation.
Supply support for CY62167G30-45ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the MoBL® SRAM portfolio, including industrial-grade memory solutions with focus on reliability and low-power design.
CY62167G30-45ZXI belongs to the MoBL® (Mobile Bitline) SRAM product line, engineered specifically for battery-sensitive and mission-critical applications demanding ECC, wide voltage range, and ultra-low standby current.
FAQ
Does CY62167G30-45ZXI support automatic error correction write-back?
No. The device performs single-bit error correction transparently during read cycles but does not initiate a write-back to the corrected location. The corrected data appears on the I/O bus, while the original erroneous bit remains unmodified in the array unless explicitly rewritten by the host system.
What is the function of the BYTE pin in the 48-pin TSOP I package?
The BYTE pin configures memory organization: tied to VCC for 1M × 16 mode (standard), or to VSS for 2M × 8 mode. In 2M × 8 mode, pin 45 becomes A20, and BHE, BLE, and I/O8–I/O14 are unused and may be left floating - no external pull-up/down required.
Can CY62167G30-45ZXI operate reliably at 1.65 V with 45 ns timing?
No. The 45 ns speed grade is specified only for the 4.5–5.5 V supply range. At 1.65–2.2 V, the maximum guaranteed access time is 55 ns. Operating at 1.65 V with 45 ns timing violates AC specifications and risks read failures under process/voltage/temperature corners.
Is the ERR pin on CY62167G30-45ZXI actively driven or open-drain?
The ERR pin is open-drain. When a single-bit error is detected and corrected during a read, ERR is pulled LOW by internal logic. An external pull-up resistor (typically 4.7 kΩ to VCC) is required to generate a HIGH-level indication for system monitoring logic.
CY62167G30-45ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY62167G30-45ZXI FAQ
1.How can I place an order for CY62167G30-45ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167G30-45ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167G30-45ZXI reliable?
The price and inventory of CY62167G30-45ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167G30-45ZXI is usually 5 days.
3.What payment methods are accepted for CY62167G30-45ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167G30-45ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167G30-45ZXI?
CY62167G30-45ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167G30-45ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167G30-45ZXI?
For technical support, including CY62167G30-45ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167G30-45ZXI requirements.
6.How does Aetrix verify that CY62167G30-45ZXI is sourced from the original manufacturer or authorized distributors?
All CY62167G30-45ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167G30-45ZXI meets industry standards.
7.What is the process for return or replacement of CY62167G30-45ZXI?
All CY62167G30-45ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62167G30-45ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167G30-45ZXI part is unused and in its original packaging.
Return procedure for CY62167G30-45ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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