Infineon Technologies CY62167GE30-45BVXI
- Part No.:
- CY62167GE30-45BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62167GE30-45BVXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62167GE30-45BVXI from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configurable as 1M × 16 or 2M × 8, operating at 45 ns access time across 4.5–5.5 V supply, and featuring an ERR output pin for real-time ECC event indication. It targets high-reliability embedded memory applications in industrial control and data acquisition systems where data integrity and low-power standby are critical.
For engineers reviewing the CY62167GE30-45BVXI datasheet, CY62167GE30-45BVXI pinout, CY62167GE30-45BVXI application, or CY62167GE30-45BVXI equivalent, this device requires attention to its dual-voltage support (4.5–5.5 V), ERR pin behavior during read cycles, byte-enable-controlled 8-bit/16-bit access mode, and TSOP I package pin configuration including BYTE pin logic for memory width selection.
Technical Context
This SRAM integrates dedicated ECC encode/decode circuitry that detects and corrects single-bit errors on every read access, with correction performed transparently and signaled via the open-drain ERR output (active-high). The device supports both single and dual chip enable configurations, and includes Byte Power-down functionality-asserting both BHE and BLE low forces automatic entry into ultra-low-power standby regardless of CE state.
It operates across two distinct VCC ranges: 4.5–5.5 V (45 ns speed grade) and 1.65–2.2 V (55 ns), with TTL-compatible I/Os, 1.0-V data retention, and configurable memory organization via the BYTE pin in TSOP I packages. Address range spans A0–A19 (1M × 16) or A0–A20 (2M × 8), with NC pins reserved for future density expansion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 or 2M × 8 configuration) |
| Access Time | 45 ns at 4.5–5.5 V - guarantees timing margin for 22.22 MHz burst reads in industrial controllers |
| Standby Current | Max 16 µA at 4.5–5.5 V - enables multi-year battery-backed operation in remote sensors |
| ECC Function | Single-bit error detection and correction per read cycle, signaled by ERR pin - eliminates need for external ECC logic |
| Supply Voltage | 4.5 V to 5.5 V (primary industrial range); also supports 1.65–2.2 V for ultra-low-power modes |
| Package | 48-pin TSOP I - surface-mount compatible with standard reflow profiles; BYTE pin selects 16-bit vs. 8-bit bus width |
| Data Retention | 1.0 V minimum VCC - maintains memory contents during brown-out or backup power transitions |
Pinout & Package
48-pin Thin Small Outline Package (TSOP I), RoHS-compliant, 12 × 20 mm body, 0.5 mm pitch. Pin configuration supports dual chip enable (CE1/CE2) and includes dedicated ERR output. BYTE pin determines memory width: tied to VCC for 1M × 16 mode; tied to VSS for 2M × 8 mode (A20 appears on pin 45).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 / A20 | Address Inputs | A0–A19 used in 1M × 16 mode; A20 enabled in 2M × 8 mode (pin 45) for extended addressing |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit data path; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE - enables byte-select writes/reads |
| CE1, CE2 | Dual Chip Enable Inputs | Device selected when CE1 = LOW and CE2 = HIGH - supports hierarchical memory decoding in multi-SRAM systems |
| WE, OE, BHE, BLE | Control Inputs | WE enables write; OE enables output; BHE/BLE gate upper/lower byte - allows mixed-width peripheral interfacing |
| ERR | Open-Drain Error Output | Asserted HIGH during successful single-bit correction - connects directly to interrupt controller or status register without pull-up if unused |
| BYTE | Memory Width Configuration | Hardwired to VCC or VSS at PCB level - defines internal address decoder mapping and I/O usage |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC engine | Per-read single-bit error detection and correction with no software overhead or latency penalty |
| Byte Power-down mode | Automatic transition to standby when BHE = BLE = LOW - reduces power without requiring CE management |
| TTL-compatible I/Os | Direct interface with legacy microcontrollers and FPGAs without level-shifting circuitry |
| Dual VCC support | Operates across 4.5–5.5 V (industrial) and 1.65–2.2 V (low-power) rails - simplifies mixed-supply system design |
| 1.0-V data retention | Maintains stored data down to 1.0 V - enables seamless handoff to backup battery or capacitor during main supply loss |
Applications
| Industrial PLC Memory Buffer | Medical Diagnostic Data Logger |
|---|---|
|
Use Scenario: Storing real-time sensor fusion outputs and control state snapshots in programmable logic controllers with deterministic response requirements. IC Role / Device Role / Timing Role: Primary working memory with hardware ECC ensuring bit-flip resilience in electrically noisy factory environments. Use Value: Eliminates firmware-level checksum validation overhead while guaranteeing data integrity across 10+ year deployments. |
Use Scenario: Capturing high-resolution waveform data from ECG/EEG front-ends before compression and transmission. IC Role / Device Role / Timing Role: High-speed, low-latency buffer between analog-to-digital converter and host processor - accessed at 22.22 MHz burst rate. Use Value: 45 ns access time and 16-bit bus width reduce transfer cycles by 50% versus 8-bit alternatives, lowering system power. |
| Avionics Health Monitor Cache | Railway Signaling Event Recorder |
|
Use Scenario: Caching flight-critical subsystem telemetry for post-event analysis after power interruption or reset. IC Role / Device Role / Timing Role: Nonvolatile shadow memory using 1.0-V data retention and ERR-driven fault logging. Use Value: Preserves last-known-good state across brown-outs; ERR assertion triggers diagnostic flag storage in separate nonvolatile memory. |
Use Scenario: Recording train position, signal aspect, and brake command timestamps for regulatory compliance and incident reconstruction. IC Role / Device Role / Timing Role: Write-intensive circular buffer with byte-write capability (BHE/BLE) minimizing bus contention during concurrent I/O operations. Use Value: Dual chip enable and byte-select allow simultaneous access by safety monitor and primary controller without arbitration logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-10MLI | No integrated ECC; requires external error handling; 10 ns faster (10 ns access), but higher 30 mA active current | Suitable only where ECC is implemented in FPGA logic or software - increases design complexity and latency | Select when maximum speed and lowest latency dominate over autonomous reliability; verify external ECC coverage matches system ASIL level |
| AS6C1008-55PCN | 55 ns access time, no ERR pin, no Byte Power-down, 2.7–3.6 V only - lacks dual-voltage and ECC features | Limited to non-safety-critical consumer or test equipment where cost is primary constraint | Choose only for legacy 3.3 V designs without ECC requirement; not suitable for industrial temperature or data-integrity-critical use |
Compared with IS61WV102416BLL-10MLI and AS6C1008-55PCN, CY62167GE30-45BVXI uniquely delivers hardware ECC + ERR signaling + dual-voltage support + Byte Power-down in a single TSOP I package - reducing BOM count, firmware burden, and power management complexity for safety-aware embedded systems.
Availability
CY62167GE30-45BVXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical diagnostic data loggers, and avionics health monitor caches requiring stable component supply, long-term lifecycle assurance, and guaranteed ECC functionality.
Supply support for CY62167GE30-45BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive ICs, and reliable memory solutions for mission-critical applications.
CY62167GE belongs to Infineon's MoBL® (Mobile Low-Power) SRAM product line, designed specifically for industrial and medical systems demanding ultra-low standby current, hardware-based data integrity, and flexible voltage operation without performance compromise.
FAQ
What is the function of the BYTE pin on CY62167GE30-45BVXI?
The BYTE pin configures memory organization: tied to VCC, it enables 1M × 16 mode (A0–A19 active); tied to VSS, it enables 2M × 8 mode (A0–A20 active, with A20 on pin 45). In 2M × 8 mode, BHE, BLE, and I/O8–I/O14 are unused and may float. This pin is static - set once at power-on and not dynamically controllable.
How does the ERR pin behave during normal and error-correction operation?
ERR is an open-drain output asserted HIGH only during a read cycle where a single-bit error is detected and corrected. It remains LOW otherwise, including during writes or error-free reads. If unused, ERR must be left floating - no external pull-up is required. Pulse width matches read access time (45 ns), synchronized to OE timing.
Can CY62167GE30-45BVXI operate in 1.8 V systems?
No - this specific variant (45BVXI) is rated for 4.5–5.5 V operation only. While the CY62167GE family includes 1.65–2.2 V versions (e.g., CY62167GE30-55ZSXI), the "45" speed grade and "BVXI" suffix denote the 4.5–5.5 V, 45 ns, TSOP I package variant. Using it below 4.5 V violates absolute maximum ratings and causes functional failure.
Is the CY62167GE30-45BVXI pin-compatible with CY62167G30-45BVXI?
No - CY62167G lacks the ERR pin. In the 48-pin TSOP I package, CY62167G uses pin 42 for NC, whereas CY62167GE assigns pin 42 to ERR. Board designs must route ERR separately; direct replacement requires PCB revision. Both share identical address/data/control pinouts and timing, but ERR functionality is exclusive to the 'E' suffix variant.
CY62167GE30-45BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62167GE30-45BVXI FAQ
1.How can I place an order for CY62167GE30-45BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167GE30-45BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167GE30-45BVXI reliable?
The price and inventory of CY62167GE30-45BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167GE30-45BVXI is usually 5 days.
3.What payment methods are accepted for CY62167GE30-45BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167GE30-45BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167GE30-45BVXI?
CY62167GE30-45BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167GE30-45BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167GE30-45BVXI?
For technical support, including CY62167GE30-45BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167GE30-45BVXI requirements.
6.How does Aetrix verify that CY62167GE30-45BVXI is sourced from the original manufacturer or authorized distributors?
All CY62167GE30-45BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167GE30-45BVXI meets industry standards.
7.What is the process for return or replacement of CY62167GE30-45BVXI?
All CY62167GE30-45BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62167GE30-45BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167GE30-45BVXI part is unused and in its original packaging.
Return procedure for CY62167GE30-45BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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