Infineon Technologies CY62167GE30-45BVXIT

Overview

CY62167GE30-45BVXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configurable as 1M × 16 or 2M × 8, operating at 45 ns access time with 1.65–2.2 V or 4.5–5.5 V supply, and featuring an ERR output pin for real-time ECC event indication - used in industrial control modules requiring data integrity under voltage fluctuation or radiation-prone environments.

For engineers reviewing the CY62167GE30-45BVXIT datasheet, CY62167GE30-45BVXIT pinout, CY62167GE30-45BVXIT application, or CY62167GE30-45BVXIT equivalent, this page delivers verified package mapping (48-ball VFBGA), byte-enable-controlled dual-width memory access, ultra-low 5.5 µA typical standby current, TTL-compatible I/Os, and ERR-driven fault visibility - critical for safety-aware embedded memory selection.

Technical Context

This SRAM integrates dedicated ECC encode/decode logic within the memory array, correcting single-bit errors on read without external logic or software intervention. It supports both single CE (with ERR) and dual CE (CE1/CE2) configurations, enabling flexible chip-select architecture in multi-memory systems.

The Byte Power-down feature activates automatically when both BHE and BLE are deasserted, forcing immediate transition to standby mode regardless of CE state - delivering deterministic low-power behavior during partial-byte idle cycles. The ERR pin asserts high only during successful single-bit correction events, not detection-only cases.

Key Specifications

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), RoHS-compliant, 6 mm × 8 mm body, 0.8 mm ball pitch, bottom-side thermal pad optional.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Compared with IS61WV102416BLL-10MLI and AS6C1008-55ZIN, CY62167GE30-45BVXIT uniquely delivers hardware ECC with observable ERR signaling, dual-voltage operation, and automatic byte-triggered power-down - making it the sole choice for industrial and transportation systems requiring certified data integrity and deterministic low-power behavior.

Availability

CY62167GE30-45BVXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical diagnostic devices, railway signaling loggers, and avionics health monitors requiring stable component supply across extended product lifecycles.

Supply support for CY62167GE30-45BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-reliability memory portfolio, including MoBL® SRAMs engineered for industrial, automotive, and infrastructure applications.

CY62167GE belongs to the MoBL® (Mobile Bitline) SRAM family, designed specifically for low-power, ECC-protected memory in mission-critical embedded systems where data integrity and energy efficiency are co-primary requirements.

FAQ

Does CY62167GE30-45BVXIT support automatic error correction without external circuitry?

Yes. The device performs full on-die ECC encoding and decoding: single-bit errors are corrected transparently during read operations, and the ERR pin asserts high to indicate successful correction. No external logic, FPGA IP, or software routines are required to enable this function - it is fully autonomous and hardware-implemented.

Can CY62167GE30-45BVXIT operate in both 1M × 16 and 2M × 8 modes on the same PCB?

Yes. In the 48-ball VFBGA package, the memory width is configured via the BYTE pin (pin 45): tied to VCC for 1M × 16 mode, or to VSS for 2M × 8 mode. In the latter, A20 is routed to I/O15, while BHE, BLE, and I/O8–I/O14 become no-connect - allowing one footprint to serve two distinct host bus architectures.

What is the functional difference between CY62167G and CY62167GE variants?

The CY62167GE includes the ERR output pin for hardware notification of ECC correction events; the CY62167G omits this pin and provides no error status indication. Both share identical memory density, timing, ECC logic, and power characteristics - the ERR pin is the sole distinguishing feature affecting system-level fault visibility.

Is the 48-ball VFBGA package of CY62167GE30-45BVXIT compatible with standard reflow profiles?

Yes. The part complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard Pb-free reflow profiles, including peak temperatures up to 260°C for 30 seconds. The VFBGA's 0.8 mm pitch and coplanarity ≤0.1 mm ensure reliable solder joint formation using Type 3 solder paste and standard stencil apertures.