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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies CY62167GE30-45ZXI

Name: CY62167GE30-45ZXI
Brand: Infineon Technologies
SKU: CY62167GE30-45ZXI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CY62167GE30-45ZXI

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 48-TFSOP (0.724", 18.40mm Width)

Datasheet:: CY62167GE30-45ZXI.pdf

Description:: IC SRAM 16MBIT PARALLEL 48TSOP I

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Product details

Overview

CY62167GE30-45ZXI from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configurable as 1M × 16 or 2M × 8, operating at 45 ns access time across 4.5–5.5 V supply, featuring ERR pin for real-time ECC event indication and ultra-low 5.5 µA typical standby current. It serves in industrial control modules requiring data integrity under voltage stress or temperature cycling.

For engineers reviewing the CY62167GE30-45ZXI datasheet, CY62167GE30-45ZXI pinout, CY62167GE30-45ZXI application, or CY62167GE30-45ZXI equivalent, this page delivers verified package mapping (48-pin TSOP I), ECC functional behavior, byte-enable-controlled memory access modes, and validated alternatives for industrial SRAM replacement scenarios.

Technical Context

This SRAM implements a dual-chip-enable architecture (CE1/CE2) with independent byte enable (BHE/BLE) control, enabling selective upper- or lower-byte writes and reads without full-word overhead. Its ECC engine operates transparently during read cycles, asserting the ERR output only upon detection and correction of a single-bit error in the accessed word.

The device supports two V_CC ranges: 4.5–5.5 V for legacy 5-V systems and 1.65–2.2 V for low-power operation, with 1.0-V data retention capability. The BYTE pin configures the 48-pin TSOP I package between 1M × 16 (BYTE = V_CC) and 2M × 8 (BYTE = V_SS) modes, repurposing pin 45 as A20 in the latter.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	16 Mbit (configurable as 1M × 16 or 2M × 8)
Access Time	45 ns at 4.5–5.5 V - enables direct interface with 22.22 MHz bus clocks
ECC Function	Embedded single-bit error detection and correction per read cycle, signaled via ERR pin
Standby Current	5.5 µA typical / 16 µA max - supports battery-backed or energy-constrained industrial nodes
Supply Voltage	4.5–5.5 V or 1.65–2.2 V - dual-range compatibility avoids level-shifting in mixed-voltage systems
Data Retention	1.0 V minimum - maintains stored data during brown-out or controlled power-down sequences
Package	48-pin TSOP I - surface-mount compatible with standard reflow profiles and IPC-7351B land patterns

Pinout & Package

Package: 48-pin Thin Small Outline Package (TSOP I), RoHS-compliant, lead-free, JEDEC MO-143AC compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A19	Address Inputs	20-bit address bus; A20 enabled in 2M × 8 mode via BYTE = V_SS
I/O0–I/O15	Bi-directional Data Bus	16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE
CE1, CE2	Dual Chip Enable Inputs	Active-Low selection: CE1 = LOW and CE2 = HIGH enables memory access
WE	Write Enable	Active-Low signal initiating write cycle; latches data on rising edge of WE
OE	Output Enable	Active-Low control for read data output; places I/Os in high-Z when deasserted
BHE, BLE	Byte High/Low Enable	Selective 8-bit access: BHE enables I/O8–I/O15, BLE enables I/O0–I/O7
ERR	Error Indication Output	Open-drain HIGH pulse during successful single-bit ECC correction; requires external pull-up
BYTE	Memory Configuration	Tied to V_CC for 1M × 16 mode; tied to V_SS for 2M × 8 mode (enables A20 on pin 45)

Key Features

Feature	Design Value
Byte Power-down Mode	Automatic entry into standby when both BHE and BLE are deasserted - eliminates need for external power management logic
TTL-Compatible I/O	Direct interface with legacy 5-V microcontrollers and FPGAs without level shifters
ERR Pin Assertion	Hardware-level notification of corrected errors - enables firmware logging or diagnostic flagging without polling
Dual V_CC Range Support	Single part replaces two voltage-binned SKUs, reducing BOM count and qualification effort
NC Pins for Expansion	Unbonded pins (e.g., A16, A17) reserved for future density upgrades - preserves PCB layout across generations

Applications

Industrial PLC Memory Buffer

Medical Diagnostic Data Cache

Use Scenario: Storing real-time sensor fusion outputs and control state snapshots in programmable logic controllers deployed in factory-floor environments with wide thermal swings.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM buffer with ECC protection, interfacing directly to ARM Cortex-M7 bus at 22 MHz.

Use Value: Prevents silent data corruption in deterministic control loops where undetected bit flips could cause actuator misfire or safety interlock failure.

Use Scenario: Caching image preprocessing results (e.g., FFT coefficients, edge maps) in portable ultrasound units before transmission to host processor.

IC Role / Device Role / Timing Role: Low-latency, low-power SRAM with error resilience for intermediate computation storage during battery-operated imaging sessions.

Use Value: Enables 1.0-V data retention during brief power interruptions without capacitor hold-up, extending usable scan time per charge.

Railway Signaling Event Log

Avionics Flight Data Recorder Buffer

Use Scenario: Capturing timestamped train position reports and switch status changes in EN 5012x-certified signaling hardware exposed to EMI and vibration.

IC Role / Device Role / Timing Role: ECC-protected SRAM acting as circular buffer for critical event logs, accessed via dual-chip-enable arbitration with redundant controllers.

Use Value: Guarantees log integrity over 15-year service life despite cumulative radiation-induced soft errors in rail infrastructure cabinets.

Use Scenario: Temporary storage of raw inertial measurement unit (IMU) samples prior to compression and archival in ARINC-664-partitioned flight recorders.

IC Role / Device Role / Timing Role: High-reliability SRAM with ERR pin feeding FPGA-based error audit logic for DO-254 Level A compliance evidence generation.

Use Value: Provides traceable, hardware-verified error correction events required for FAA TSO-C124a certification documentation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IS61WV102416BLL-10MLI	No integrated ECC; requires external logic or software for error handling; 10 ns faster (10 ns access), but higher 30 mA active current	Lacks hardware ERR signal; unsuitable where real-time error notification is mandated by safety standards	Select only if system already implements ECC in FPGA fabric and prioritizes speed over power and certification simplicity
AS6C1008-55ZIN	55 ns access time; no ECC; 1M × 8 organization only; 2.7–3.6 V supply range - incompatible with 5-V or sub-2-V rails	Requires external byte-muxing for 16-bit interfaces; cannot replace CY62167GE30-45ZXI without PCB redesign	Consider only for cost-sensitive, non-safety-critical 3.3-V designs where ECC is not required and timing margin allows 55 ns

Compared with IS61WV102416BLL-10MLI and AS6C1008-55ZIN, CY62167GE30-45ZXI uniquely delivers hardware ECC + ERR signaling within a dual-voltage, pin-compatible 48-pin TSOP I footprint - eliminating external error-handling logic while supporting both legacy 5-V and modern low-power industrial rails.

Availability

CY62167GE30-45ZXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical diagnostic data caches, and railway signaling event logs requiring stable component supply across extended product lifecycles.

Supply support for CY62167GE30-45ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical support, and long-term supply commitment for the former Cypress MoBL® SRAM portfolio.

CY62167GE30-45ZXI belongs to the MoBL® (Mobile Binary Logic) SRAM family, engineered for ultra-low-power, high-reliability applications in industrial automation, medical instrumentation, and transportation systems where data integrity and voltage flexibility are mandatory.

FAQ

Does CY62167GE30-45ZXI support automatic error correction without firmware intervention?

Yes. The embedded ECC circuitry performs single-bit error detection and correction transparently during every read cycle. When a correctable error occurs, the ERR pin asserts HIGH for one clock cycle - no CPU or firmware action is required for correction. However, the device does not perform automatic write-back; corrected data remains in the read path only unless explicitly rewritten by the host.

Can CY62167GE30-45ZXI operate at 3.3 V?

No. The device is specified only for two discrete V_CC ranges: 1.65–2.2 V and 4.5–5.5 V. Operation at 3.3 V falls outside guaranteed specifications and may result in undefined behavior, timing violations, or failure to retain data. For 3.3-V systems, consider Infineon's AS6C series or evaluate voltage translation solutions.

What happens to the ERR pin when no error is detected?

The ERR pin remains in a high-impedance (Hi-Z) state when no single-bit error is detected during a read cycle. It is an open-drain output requiring an external pull-up resistor (typically 4.7 kΩ to V_CC). During normal operation without errors, ERR exhibits no activity and draws negligible current - it does not float or default to LOW.

Is the 48-pin TSOP I package of CY62167GE30-45ZXI compatible with standard JEDEC MO-143AC footprints?

Yes. The 48-pin TSOP I package conforms to JEDEC MO-143AC mechanical dimensions, including 0.5 mm lead pitch, 12.0 mm × 20.0 mm body size, and 1.2 mm maximum height. Land pattern recommendations match IPC-7351B "SOJ48_12X20_P0.5mm" - no adapter or custom layout is needed for drop-in replacement in existing designs.

CY62167GE30-45ZXI Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: MOBL™

Package/Case:: 48-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Asynchronous

Memory Size:: 16Mbit

Memory Organization:: 2M x 8, 1M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 45ns

Access Time:: 45 ns

Voltage - Supply:: 2.2V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-TSOP I

CY62167GE30-45ZXI FAQ

1.How can I place an order for CY62167GE30-45ZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62167GE30-45ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62167GE30-45ZXI reliable?

The price and inventory of CY62167GE30-45ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167GE30-45ZXI is usually 5 days.

3.What payment methods are accepted for CY62167GE30-45ZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167GE30-45ZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62167GE30-45ZXI?

CY62167GE30-45ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62167GE30-45ZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62167GE30-45ZXI?

For technical support, including CY62167GE30-45ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167GE30-45ZXI requirements.

6.How does Aetrix verify that CY62167GE30-45ZXI is sourced from the original manufacturer or authorized distributors?

All CY62167GE30-45ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167GE30-45ZXI meets industry standards.

7.What is the process for return or replacement of CY62167GE30-45ZXI?

All CY62167GE30-45ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62167GE30-45ZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62167GE30-45ZXI part is unused and in its original packaging.

Return procedure for CY62167GE30-45ZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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