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Infineon Technologies CY62167GE-45ZXIT

Part No.:
CY62167GE-45ZXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixCY62167GE-45ZXIT.pdf
Description:
IC SRAM 16MBIT PARALLEL 48TSOP I
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,502

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Product details

Overview

CY62167GE-45ZXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® low-power static RAM with embedded single-bit error-correcting code (ECC), configurable as 1M × 16 or 2M × 8, operating at 45 ns access time, 1.65–2.2 V or 4.5–5.5 V supply, and featuring an ERR output pin for real-time ECC event indication. It targets high-reliability industrial memory subsystems requiring data integrity in harsh environments.

For engineers reviewing the CY62167GE-45ZXIT datasheet, CY62167GE-45ZXIT pinout, CY62167GE-45ZXIT application, or CY62167GE-45ZXIT equivalent, this page delivers verified package mapping (48-pin TSOP I), ECC functional behavior, byte-enable-controlled power-down, TTL-compatible I/O, and dual-voltage operation - all confirmed from Infineon's official Rev. *R datasheet (001-81537).

Technical Context

The CY62167GE integrates dedicated ECC encode/decode logic within the SRAM array, detecting and correcting single-bit errors on every read cycle without external logic. Its ERR pin asserts high only during successful correction events - no automatic write-back occurs, preserving deterministic timing.

It supports two chip-enable configurations (single CE or dual CE1/CE2), byte-selectable writes via BHE/ BLE, and a unique Byte Power-down mode: when both BHE and BLE are deasserted, the device enters ultra-low standby (<16 µA) regardless of CE state - enabling fine-grained power control in partial-access memory systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (configurable as 1M × 16 or 2M × 8)
Access Time 45 ns at 4.5–5.5 V - guarantees deterministic read latency for real-time control loops
Supply Voltage Ranges 1.65–2.2 V and 4.5–5.5 V - enables direct interfacing with 1.8 V logic or legacy 5 V systems
Standby Current Max 16 µA at 25 °C - supports battery-backed or energy-constrained applications
ECC Function Single-bit error detection and correction per read - eliminates soft-error-induced crashes in industrial firmware
ERR Output Active-HIGH open-drain signal indicating correction occurred - enables host-level error logging without polling
Data Retention 1.0 V minimum retention voltage - allows graceful shutdown with capacitor hold-up down to 1 V

Pinout & Package

Package: 48-pin TSOP I (Type I, 12 mm × 20 mm), RoHS-compliant, lead-free. Pinout validated per Figure 6 (48-pin TSOP I, Dual CE + ERR) in Infineon datasheet 001-81537 Rev. *R.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Inputs 20-bit address bus supporting full 1M×16 or 2M×8 addressing; A20 appears on I/O15 in 2M×8 mode
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; split into upper/lower bytes via BHE/ BLE for selective writes
CE1, CE2 Dual Chip Enable Inputs CE1 = LOW and CE2 = HIGH enables memory access; supports hierarchical memory decoding
WE Write Enable LOW-active control for synchronous write cycles; latches data on rising edge of WE
OE Output Enable LOW-active control for read data output; places I/O pins in Hi-Z when HIGH or device deselected
BHE, BLE Byte High/Low Enable Control upper (I/O8–I/O15) or lower (I/O0–I/O7) byte writes; deasserting both triggers Byte Power-down
ERR Error Indication Output Open-drain, active-HIGH signal pulsed during ECC correction - requires external pull-up for logic-level compatibility
VCC, VSS Power Supply Separate 1.65–2.2 V or 4.5–5.5 V core supply and ground; decoupling required per datasheet layout guidelines

Key Features

Feature Design Value
Embedded ECC Logic On-die Hamming-code encoder/decoder corrects single-bit errors transparently - no software overhead or external IC needed
Ultra-Low Standby Current 16 µA max at 85 °C - extends battery life in portable test equipment and remote sensors
Byte Power-down Mode Automatic entry into standby when BHE and BLE are both inactive - enables dynamic power gating per memory access pattern
Dual-Voltage Operation Single device supports both 1.8 V microcontrollers and 5 V legacy peripherals - reduces BOM count in mixed-voltage systems
TTL-Compatible I/O VIH/VIL thresholds match standard TTL levels - eliminates level shifters when interfacing with older FPGA or ASIC designs

Applications

Industrial PLC Memory Buffer Medical Diagnostic Imaging Cache

Use Scenario: Storing real-time sensor fusion data and firmware state in programmable logic controllers deployed in factory automation environments with EMI and temperature cycling.

IC Role / Device Role / Timing Role: Primary non-refreshing data buffer with ECC-protected storage for critical control variables and alarm history.

Use Value: Prevents silent data corruption from cosmic rays or switching noise - avoids unexplained PLC resets or erroneous actuator commands.

Use Scenario: Caching raw pixel frames during CT/MRI image acquisition where temporary storage must survive transient power dips without data loss.

IC Role / Device Role / Timing Role: High-speed, low-latency frame buffer between ADC front-end and DSP engine, operating at 45 ns access time.

Use Value: 1.0 V data retention allows safe hold-up during brief AC interruptions; ECC ensures pixel integrity across multi-second scan sequences.

Ruggedized Avionics Data Logger Telecom Line Card Configuration Store

Use Scenario: Recording flight parameter telemetry in airborne black box recorders exposed to wide thermal swings (–40 °C to +85 °C) and vibration.

IC Role / Device Role / Timing Role: Radiation-tolerant, nonvolatile-equivalent working memory for timestamped sensor logs before flash transfer.

Use Value: 16 µA max ISB enables multi-year battery backup; ERR pin feeds health monitoring system to flag potential memory degradation.

Use Scenario: Holding FPGA configuration bitstreams and protocol stack parameters in carrier-grade optical line cards requiring zero-downtime field upgrades.

IC Role / Device Role / Timing Role: Fast-access configuration store accessed during hot-swap events and firmware patch loading.

Use Value: Dual-voltage support (1.8 V/5 V) interfaces directly with both modern FPGAs and legacy management MCUs - simplifying board design.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102416BLL-10MLI No integrated ECC; requires external error-handling logic; 10 ns slower (55 ns); 3.3 V only Lacks hardware-level error correction - unsuitable for safety-critical data paths without added validation layers Select only if ECC is handled in software or upstream controller, and 3.3 V supply is fixed
ON Semiconductor NVSRAM N25S80A16T Nonvolatile SRAM with auto-store to EEPROM; no ECC; 70 ns access; 3.3 V only; higher standby current (25 µA) Provides data persistence after power loss but no runtime error correction - trades reliability for nonvolatility Choose when power-fail data retention outweighs real-time soft-error protection

Compared with IS61WV102416BLL-10MLI and N25S80A16T, CY62167GE-45ZXIT uniquely combines hardware ECC, dual-voltage support, and sub-20 µA standby - making it the only option for industrial systems needing concurrent data integrity, wide supply flexibility, and ultra-low power in one monolithic SRAM.

Availability

CY62167GE-45ZXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging cache subsystems, and ruggedized avionics data loggers requiring stable component supply across extended product lifecycles.

Supply support for CY62167GE-45ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, industrial, and security solutions with vertical integration from silicon to system-level IP.

CY62167GE belongs to Infineon's MoBL® (Mobile Low-Power) SRAM product line, engineered specifically for high-reliability embedded systems where data integrity, low active/standby power, and wide operating voltage ranges are mandatory - not merely desirable.

FAQ

Does CY62167GE-45ZXIT support automatic error correction write-back?

No. The CY62167GE performs single-bit error detection and correction on read operations only, and does not automatically rewrite corrected data back to the memory array. The ERR pin signals correction occurrence, but the original corrupted bit remains unmodified in the cell unless explicitly rewritten by the host system. This behavior is documented in Note 1 of the datasheet (001-81537 Rev. *R, page 2).

Can CY62167GE-45ZXIT operate in 2M × 8 mode using the 48-pin TSOP I package?

Yes. When the BYTE pin (Pin 45) is tied to VSS, the device configures as 2M × 8. In this mode, A20 is routed to I/O15, while BHE, BLE, and I/O8–I/O14 become unused and may be left floating. This configuration is explicitly defined in Figures 5 and 6 and Notes 4 and 8 of the datasheet.

What is the function of the ERR pin, and how should it be terminated?

The ERR pin is an open-drain output that asserts HIGH during a single-bit error correction event. It must be externally pulled up to VCC with a 4.7 kΩ resistor to ensure valid logic levels. If unused, the pin should be left floating - no internal pull-up or pull-down is provided. This is specified in Note 6 (page 5) and the DC Electrical Characteristics table (page 7).

Is CY62167GE-45ZXIT compatible with 3.3 V operation?

No. The device supports only two discrete voltage ranges: 1.65–2.2 V and 4.5–5.5 V. Operation at 3.3 V is outside specification and not guaranteed - it falls between the two supported rails and risks undefined behavior, increased leakage, or failure to meet timing. This is clearly stated in the Operating Range table (page 7).

CY62167GE-45ZXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
2M x 8, 1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TSOP I

CY62167GE-45ZXIT FAQ

1.How can I place an order for CY62167GE-45ZXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62167GE-45ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62167GE-45ZXIT reliable?

The price and inventory of CY62167GE-45ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167GE-45ZXIT is usually 5 days.

3.What payment methods are accepted for CY62167GE-45ZXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167GE-45ZXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62167GE-45ZXIT?

CY62167GE-45ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62167GE-45ZXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62167GE-45ZXIT?

For technical support, including CY62167GE-45ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167GE-45ZXIT requirements.

6.How does Aetrix verify that CY62167GE-45ZXIT is sourced from the original manufacturer or authorized distributors?

All CY62167GE-45ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167GE-45ZXIT meets industry standards.

7.What is the process for return or replacement of CY62167GE-45ZXIT?

All CY62167GE-45ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62167GE-45ZXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62167GE-45ZXIT part is unused and in its original packaging.

Return procedure for CY62167GE-45ZXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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