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Infineon Technologies CY62167GN30-45BVXI
- Part No.:
- CY62167GN30-45BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62167GN30-45BVXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,160
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Product details
Overview
CY62167GN30-45BVXI from Cypress Semiconductor is a 16-Mbit MoBL® CMOS static RAM organized as 1M × 16 or 2M × 8, operating at 45 ns access time with ultra-low standby current (1.5 µA typical), wide 2.2–3.6 V supply range, and industrial temperature support (–40 °C to +85 °C). It serves as main memory or buffer in portable battery-powered systems requiring fast, low-power volatile storage.
For engineers reviewing the CY62167GN30-45BVXI datasheet, CY62167GN30-45BVXI pinout, CY62167GN30-45BVXI application, or CY62167GN30-45BVXI equivalent, key selection criteria include configurable data width (16-bit/8-bit), automatic power-down behavior, TSOP I / VFBGA package compatibility, and byte-enable-controlled write granularity.
Technical Context
The device implements dual chip enable (CE1/CE2) and independent byte enables (BHE/BLE) to support flexible memory expansion and partial-word writes. Its automatic power-down circuit reduces current by >99% when deselected-triggered by CE1 HIGH, CE2 LOW, or both BHE and BLE HIGH-enabling deep sleep in host systems.
It supports two distinct configurations: 1M × 16 mode (BYTE tied to VCC) and 2M × 8 mode (BYTE tied to VSS), with A20 exposed only in 2M × 8 mode on Pin 45 of TSOP I. All I/O pins enter high-impedance state during deselect, OE HIGH, write cycles, or simultaneous BHE/BLE HIGH.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 or 2M × 8 configuration) |
| Access Time | 45 ns - guarantees deterministic read latency for real-time embedded control loops |
| Standby Current | 1.5 µA typical - extends battery life in always-on portable devices |
| Supply Voltage | 2.2 V to 3.6 V - compatible with Li-ion, Li-poly, and regulated 3.3 V rails |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial-grade deployment |
| Data Retention Voltage | ≥1.0 V - maintains stored data during brown-out or backup-battery operation |
| Output Drive Strength | 2.1 mA at 3.6 V - sufficient for direct connection to 50 Ω trace loads without external termination |
Pinout & Package
Package: 48-ball VFBGA (ball pitch 0.5 mm) and 48-pin TSOP I (Type I, 12.0 × 20.0 mm). Both packages support identical logic interface and pin mapping except for BYTE pin function and A20 availability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word (16-bit) or 2M-word (8-bit) addressing |
| I/O0–I/O7 | Lower Byte Data I/O | Bi-directional 8-bit data path enabled only when BLE = LOW |
| I/O8–I/O15 | Upper Byte Data I/O | Bi-directional 8-bit data path enabled only when BHE = LOW |
| CE1, CE2 | Chip Enable Inputs | Active-LOW CE1 and active-HIGH CE2 provide dual-signal chip select for daisy-chained memory banks |
| OE | Output Enable | Controls output drivers only; does not affect internal power state or address latching |
| WE | Write Enable | Active-LOW signal initiating write cycle; timing-critical for setup/hold compliance |
| BHE, BLE | Byte High/Low Enable | Independent gating of upper/lower data bytes-enables 8-bit writes in 16-bit bus systems |
| BYTE | Configuration Select | Tied to VCC for 1M × 16 mode; tied to VSS for 2M × 8 mode (exposes A20 on TSOP I Pin 45) |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low standby current | 1.5 µA typical - enables multi-year battery life in IoT endpoint sensors |
| Configurable organization | Hardware-selectable 1M × 16 or 2M × 8 via BYTE pin - eliminates need for external multiplexing logic |
| Automatic power-down | Self-activates on CE1 HIGH / CE2 LOW / BHE+BLE HIGH - no software or external control required |
| CMOS-compatible interface | VIH/VIL thresholds scale with VCC - ensures robust noise margin across full 2.2–3.6 V supply range |
| High-speed 45 ns access | Meets timing requirements of ARM Cortex-M4/M7 microcontrollers running at ≥100 MHz |
Applications
| Portable Medical Monitors | Industrial PLC Data Buffers |
|---|---|
|
Use Scenario: Continuous ECG waveform acquisition and local buffering before wireless transmission. IC Role / Device Role / Timing Role: Volatile frame buffer storing 2–4 seconds of 16-bit sampled data at 1 kHz. Use Value: 45 ns access enables real-time overlay of digital filters; 1.5 µA standby preserves battery during idle periods between patient checks. |
Use Scenario: Storing I/O scan history and diagnostic logs in modular automation controllers. IC Role / Device Role / Timing Role: Non-critical SRAM for transient process data mirroring between FPGA and ARM host. Use Value: Dual CE inputs allow seamless integration into multi-bank memory maps; industrial temp rating ensures reliability in cabinet-mounted enclosures. |
| Wireless Sensor Gateways | Automotive Infotainment UI Caches |
|
Use Scenario: Aggregating and preprocessing sensor payloads from Zigbee/Z-Wave subnets before Ethernet upload. IC Role / Device Role / Timing Role: Intermediate packet buffer enabling burst-mode RF transmission scheduling. Use Value: Configurable 8/16-bit width matches common MCU bus widths; low ICCDR supports retention during 3.3 V rail brown-out events. |
Use Scenario: Caching navigation map tiles and UI assets in head-unit systems with limited DRAM bandwidth. IC Role / Device Role / Timing Role: Low-latency scratchpad memory for GPU texture prefetching and menu rendering. Use Value: 45 ns tAA meets display controller timing budgets; TSOP I package supports reflow-compatible PCB layout in space-constrained dashboards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-power SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV102416BLL-45NLI | Same density and speed; 2.5–3.6 V supply only; no BYTE pin; fixed 1M × 16 organization | Lacks 2M × 8 mode and automatic power-down - requires external logic for partial-word writes | Choose if system uses only 16-bit bus and operates strictly above 2.5 V |
| Renesas R1LV1616RSA-45PB | 45 ns access; 2.2–3.6 V; 1M × 16 only; standby current 3 µA typical (2× higher than CY62167) | No byte-enable flexibility; no automatic power-down - relies on host-controlled CE toggling | Choose if footprint compatibility with Renesas legacy designs is prioritized over lowest power |
Compared with IS62WV102416BLL-45NLI and R1LV1616RSA-45PB, CY62167GN30-45BVXI uniquely delivers hardware-configurable width, automatic power-down, and lowest standby current-making it optimal for battery-sensitive, multi-bus-width applications where firmware overhead must be minimized.
Availability
CY62167GN30-45BVXI is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC data buffers, wireless sensor gateways, and automotive infotainment UI caches requiring stable component supply across extended product lifecycles.
Supply support for CY62167GN30-45BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power memory and programmable solutions for embedded systems, with global R&D and manufacturing infrastructure.
CY62167GN30 belongs to the MoBL® (More Battery Life™) SRAM product line, engineered specifically for portable and energy-constrained applications where nanowatt-level standby and sub-50 ns access must coexist.
FAQ
What is the function of the BYTE pin on CY62167GN30-45BVXI?
The BYTE pin selects memory organization: tie to VCC for 1M × 16 mode (standard 16-bit bus), or tie to VSS for 2M × 8 mode (exposing A20 on TSOP I Pin 45). In 2M × 8 mode, BHE, BLE, and I/O8–I/O14 are unused. This hardware-selectable configuration eliminates external logic and simplifies board design across multiple platform variants.
How does automatic power-down work without software intervention?
Automatic power-down activates when CE1 is HIGH, CE2 is LOW, or both BHE and BLE are HIGH-placing the device in ultra-low-current standby (≤8 µA). No clock, command, or register write is needed. The internal circuit monitors these control signals continuously and transitions autonomously, reducing power by >99% versus active mode without host CPU involvement.
Can CY62167GN30-45BVXI operate reliably at 2.2 V?
Yes-CY62167GN30-45BVXI is fully specified from 2.2 V to 3.6 V. At 2.2 V, tRC remains 45 ns, ISB2 is ≤3 µA at 25 °C, and VIH/VIL thresholds scale proportionally (VIH = 1.8 V min, VIL = 0.6 V max). All AC and DC parameters are guaranteed across this range per the datasheet's Operating Range table.
Is the 48-ball VFBGA package pin-to-pin compatible with the 48-pin TSOP I package?
No-while both packages share identical signal names and logical functions, their physical pinouts differ significantly. The VFBGA uses a grid array (e.g., A1 = VCC, H6 = NC), whereas TSOP I uses linear numbering (Pin 1 = A15, Pin 48 = CE1). Board redesign is required when switching packages; however, firmware and schematic logic remain identical due to functional equivalence.
CY62167GN30-45BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62167GN30-45BVXI FAQ
1.How can I place an order for CY62167GN30-45BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167GN30-45BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167GN30-45BVXI reliable?
The price and inventory of CY62167GN30-45BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167GN30-45BVXI is usually 5 days.
3.What payment methods are accepted for CY62167GN30-45BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167GN30-45BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167GN30-45BVXI?
CY62167GN30-45BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167GN30-45BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167GN30-45BVXI?
For technical support, including CY62167GN30-45BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167GN30-45BVXI requirements.
6.How does Aetrix verify that CY62167GN30-45BVXI is sourced from the original manufacturer or authorized distributors?
All CY62167GN30-45BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167GN30-45BVXI meets industry standards.
7.What is the process for return or replacement of CY62167GN30-45BVXI?
All CY62167GN30-45BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62167GN30-45BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167GN30-45BVXI part is unused and in its original packaging.
Return procedure for CY62167GN30-45BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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