Infineon Technologies CY62167GN30-45ZXIT

Overview

CY62167GN30-45ZXIT from Cypress Semiconductor is a 16-Mbit MoBL® CMOS static RAM organized as 1M × 16 or 2M × 8, operating at 45 ns access time with ultra-low standby current (1.5 µA typical), wide 2.2–3.6 V supply range, and industrial temperature support (–40 °C to +85 °C). It enables battery-sensitive portable systems including cellular handsets and handheld instrumentation via automatic power-down and CMOS efficiency.

For engineers reviewing the CY62167GN30-45ZXIT datasheet, CY62167GN30-45ZXIT pinout, CY62167GN30-45ZXIT application, or CY62167GN30-45ZXIT equivalent, key selection criteria include configurable data width (16-bit/8-bit), TSOP I and VFBGA package compatibility, byte-enable control (BHE/ BLE), low-voltage operation, and guaranteed 45 ns read/write timing under industrial conditions.

Technical Context

The CY62167GN30-45ZXIT implements dual-mode memory organization (1M × 16 or 2M × 8) controlled by the BYTE pin in TSOP I or ball H6 in VFBGA. Its automatic power-down circuit reduces ICC to ≤8 µA when CE1 is HIGH, CE2 is LOW, or both BHE and BLE are HIGH - independent of address toggling.

Read and write operations use separate enable logic: reads require CE1 LOW, CE2 HIGH, OE LOW, and WE HIGH; writes require CE1 LOW, CE2 HIGH, WE LOW, and active BHE or BLE. Output impedance transitions (tLZOE = 5 ns, tHZOE = 18 ns) ensure clean bus sharing in multi-SRAM systems.

Key Specifications

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), RoHS-compliant, 6 mm × 8 mm footprint, 0.5 mm pitch, bottom-side thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed, low-power SRAM applications.

Compared with IS62WV102416BLL-45NLI and R1LV0216R-45P-E, the CY62167GN30-45ZXIT uniquely delivers industrial temperature support, sub-2 µA standby, and hardware-configurable data width in both VFBGA and TSOP I - critical for next-gen portable and automotive designs requiring long-term supply stability.

Availability

CY62167GN30-45ZXIT is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC data buffers, wireless sensor nodes, and automotive infotainment HMIs requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for CY62167GN30-45ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and IoT applications, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.

The CY62167GN30 belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power, high-speed data buffering in portable and energy-constrained embedded systems.

FAQ

What is the function of the BYTE pin on CY62167GN30-45ZXIT?

The BYTE pin determines memory organization: tied to VCC in TSOP I packages selects 1M × 16 mode; tied to VSS enables 2M × 8 mode, repurposing pin 45 as A20. In VFBGA packages, ball H6 serves the same function and supports future 32M density upgrades. This pin is not present in all variants but is active and required for configuration in this part number.

Can CY62167GN30-45ZXIT operate reliably at 2.2 V?

Yes - it is fully specified from 2.2 V to 3.6 V across the industrial temperature range. At 2.2 V, tRC remains 45 ns (guaranteed), ISB2 is ≤3 µA at 25 °C, and VIH/VIL thresholds scale proportionally. All AC and DC parameters in the datasheet include 2.2 V test conditions, and the device passes qualification per JEDEC JESD47.

How does automatic power-down work without external control signals?

Automatic power-down activates when any of these conditions occur: CE1 HIGH, CE2 LOW, or both BHE and BLE HIGH. No clock or software command is needed - internal logic detects static address/data bus states and gates VCC current to ≤8 µA. The feature is inherent to the silicon design and requires no initialization or register writes.

Is the 48-ball VFBGA package lead-free and RoHS-compliant?

Yes - the CY62167GN30-45ZXIT uses a Pb-free, RoHS-compliant 48-ball VFBGA package with matte tin surface finish and NiPdAu under-bump metallurgy. It meets JEDEC J-STD-020D moisture sensitivity level 3 (MSL3), and reflow profile compliance is documented in Cypress PCN193805.