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Infineon Technologies CY62168DV30LL-55BVIT

Part No.:
CY62168DV30LL-55BVIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62168DV30LL-55BVIT.pdf
Description:
IC SRAM 16MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,198

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Product details

Overview

CY62168DV30LL-55BVIT from Cypress Semiconductor is a 16-Mbit (2 M × 8) MoBL® CMOS static RAM with 55 ns access time, operating across 2.2 V–3.6 V supply, delivering ultra-low active current (15 mA at fMax) and standby current as low as 2.5 µA. It supports automatic power-down on chip deselect and is designed for battery-sensitive portable systems including cellular handsets and handheld instrumentation.

For engineers reviewing the CY62168DV30LL-55BVIT datasheet, CY62168DV30LL-55BVIT pinout, CY62168DV30LL-55BVIT application, or CY62168DV30LL-55BVIT equivalent, key selection criteria include its dual chip enable (CE1/CE2) interface, VFBGA-48 package compatibility, 20-bit address bus (A0–A20), and guaranteed 55 ns read/write cycle timing under industrial temperature range (–40 °C to +85 °C).

Technical Context

This SRAM implements a 2048K × 8 asynchronous memory array using complementary metal oxide semiconductor (CMOS) process technology optimized for speed/power trade-off. Its dual chip enable architecture (CE1 active-low, CE2 active-high) enables flexible memory expansion and hierarchical decoding in multi-bank systems.

The device features three distinct power states: active (ICC = 15 mA max at 55 ns), automatic CE-based standby (ISB2 = 22 µA max), and data retention mode (ICCDR ≤ 10 µA at VDR ≥ 1.5 V). I/O pins enter high-impedance state during deselect, OE HIGH, or write cycles-ensuring clean bus sharing without external isolation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (2,097,152 × 8 bits); supports 2 MB byte-addressable storage without interleaving.
Access Time 55 ns max; guarantees deterministic read latency for real-time firmware execution and buffer access.
Supply Voltage 2.2 V–3.6 V; compatible with single-supply 2.5 V or 3.3 V system rails and mixed-voltage SoC interfaces.
Active Current 15 mA max at fMax; enables sustained burst reads/writes in portable devices without thermal throttling.
Standby Current 2.5 µA typical / 22 µA max; reduces quiescent power by >99% when deselected via CE1 HIGH or CE2 LOW.
Data Retention Voltage 1.5 V min; maintains stored data during brown-out or backup-battery operation down to 1.5 V.
Operating Temperature –40 °C to +85 °C; qualified for industrial-grade embedded control and mobile communications equipment.

Pinout & Package

Package: 48-ball very fine ball grid array (VFBGA), 6 mm × 8 mm footprint, 0.5 mm pitch, JEDEC MO-255 compliant. Thermal resistance θJA = 55 °C/W (2-layer PCB).

Pin/Terminal Circuit Role Design Meaning
A0–A20 Address inputs 21-bit address bus supporting full 2 M-word addressing; A0 least significant bit.
I/O0–I/O7 Bidirectional data bus 8-bit parallel interface; high-impedance during deselect, OE HIGH, or WE LOW.
CE1 Chip Enable 1 (active-low) Primary enable; device selected only when CE1 = LOW AND CE2 = HIGH.
CE2 Chip Enable 2 (active-high) Secondary enable; complements CE1 for hierarchical decode and bank selection.
OE Output Enable (active-low) Controls output drivers; HIGH forces I/O pins into high-Z regardless of CE state.
WE Write Enable (active-low) Initiates write cycle when CE1 = LOW, CE2 = HIGH, and WE = LOW.
VCC Power supply Two dedicated VCC balls (pins B1 and G6); decoupling required per ball for noise immunity.
VSS Ground Three dedicated VSS balls (pins C1, E6, H1); low-inductance return path for I/O and core logic.
DNU Do Not Use 10 pins marked DNU must be left floating or tied to VSS; no internal connection or function.

Key Features

Feature Design Value
MoBL® Ultra-Low Power Architecture Reduces active current by 75% vs. legacy 3.3 V SRAMs; extends battery life in always-on subsystems.
Dual Chip Enable Interface Enables seamless 4-way memory expansion without external logic; CE1/CE2 act as independent bank selects.
Automatic Power-Down on Deselect Enters sub-µA standby within 55 ns of CE1 HIGH or CE2 LOW assertion-no software or timing overhead.
High-Impedance Output Control I/O pins go high-Z on any of three conditions: CE inactive, OE HIGH, or WE LOW-prevents bus contention.
Industrial Temperature Range Support Guaranteed 55 ns timing and 2.5 µA standby across –40 °C to +85 °C-no derating required for harsh environments.

Applications

Cellular Baseband Subsystem Portable Medical Monitor Buffer

Use Scenario: Stores real-time sensor acquisition buffers and protocol stack packet queues in GSM/UMTS modems.

IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state data buffering between baseband processor and RF transceiver.

Use Value: 55 ns access ensures uninterrupted 3G packet processing at 20+ Mbps; 2.5 µA standby preserves battery during idle paging intervals.

Use Scenario: Holds waveform samples from ECG/SpO₂ front-end ADCs before compression and wireless transmission.

IC Role / Device Role / Timing Role: Low-voltage, low-power memory buffer interfacing directly with 2.5 V microcontroller GPIOs.

Use Value: 2.2 V minimum VCC allows direct connection to medical SoC's regulated 2.5 V rail; DNU-pin-safe layout simplifies FDA-compliant PCB routing.

Industrial PLC Data Logger Wearable Fitness Tracker Memory

Use Scenario: Captures timestamped I/O status changes and analog channel readings during factory automation cycles.

IC Role / Device Role / Timing Role: Nonvolatile-cached SRAM holding last 10,000 events; backed by supercapacitor during AC loss.

Use Value: 1.5 V data retention threshold enables reliable holdover for >10 seconds on 2.2 V backup; VFBGA-48 fits compact DIN-rail controller modules.

Use Scenario: Stores motion sensor fusion results and activity classification history between BLE sync intervals.

IC Role / Device Role / Timing Role: Primary working memory for ARM Cortex-M0+ application core running continuous sensor algorithms.

Use Value: 15 mA active current at 55 ns supports 1 kHz sensor sampling without exceeding 30 mW thermal budget; 6 × 8 mm footprint matches wearable form factor constraints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS62WV20488BLL-55NLI Same density (2 M × 8), 55 ns speed, but 2.7 V–3.6 V VCC range; no 2.2 V support. Lacks ultra-low-voltage capability; unsuitable for 2.5 V-only or battery-discharge scenarios below 2.7 V. Select when system uses stable 3.3 V rail and requires second-source availability with identical pinout.
ON Semiconductor NVSRAM NB16LV20488B-55Z Nonvolatile SRAM with integrated EEPROM backup; higher standby current (100 µA) and larger 64-pin TSSOP package. Provides automatic data retention on power loss but consumes 40× more standby power and occupies 3× board area. Select only if true nonvolatility is required; otherwise, CY62168DV30LL-55BVIT offers superior power efficiency and footprint.

Compared with IS62WV20488BLL-55NLI and NB16LV20488B-55Z, the CY62168DV30LL-55BVIT uniquely delivers 2.2 V operation and sub-3 µA standby in a space-constrained VFBGA-making it optimal for battery-powered edge nodes where voltage headroom and quiescent power are critical.

Availability

CY62168DV30LL-55BVIT is available at Aetrix Electronics and suitable for cellular modem design, portable medical instrumentation, industrial data loggers, and wearable fitness trackers requiring stable component supply and long-term lifecycle assurance.

Supply support for CY62168DV30LL-55BVIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power memory and programmable solutions for embedded systems, automotive, and industrial markets.

The MoBL® (More Battery Life) SRAM product line targets portable and energy-constrained applications requiring fast, deterministic access with minimal active and standby current-optimized for battery runtime extension without sacrificing performance.

FAQ

What is the minimum VCC required to retain data in CY62168DV30LL-55BVIT?

The device guarantees data retention down to 1.5 V (VDR ≥ 1.5 V), as specified in the Data Retention Characteristics table. At this voltage, ICCDR remains ≤ 10 µA, enabling operation during brown-out or supercapacitor holdover. This is verified across the full industrial temperature range and does not require external refresh or backup circuitry.

How does the dual chip enable (CE1/CE2) interface improve memory expansion?

CE1 (active-low) and CE2 (active-high) allow hierarchical decoding: CE2 can serve as a bank select signal while CE1 acts as row enable, eliminating need for external logic gates in 4-bank configurations. Truth table confirms valid access only when CE1 = LOW AND CE2 = HIGH-enabling clean partitioning of address space across multiple devices.

Can DNU pins be tied to VCC or left unconnected?

No-DNU (Do Not Use) pins must be left floating or tied to VSS (ground) per datasheet Note 2. Connecting them to VCC may cause undefined behavior or increased leakage. All 10 DNU pins (e.g., pins A2, A3, D1, D2, etc.) are electrically isolated and have no internal connection; grounding ensures predictable noise immunity and avoids floating-node oscillation.

Is CY62168DV30LL-55BVIT RoHS-compliant and Pb-free?

No-the "-55BVIT" suffix indicates a non-Pb-free (lead-containing) 48-ball VFBGA package, as explicitly stated in the Features section ("Available in non Pb-free 48-ball VFBGA"). For Pb-free alternatives, refer to Cypress' "-55BVXI" or "-55BV2I" ordering codes, which use lead-free solder spheres and comply with RoHS Directive 2011/65/EU.

CY62168DV30LL-55BVIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (8x9.5)

CY62168DV30LL-55BVIT FAQ

1.How can I place an order for CY62168DV30LL-55BVIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62168DV30LL-55BVIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62168DV30LL-55BVIT reliable?

The price and inventory of CY62168DV30LL-55BVIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62168DV30LL-55BVIT is usually 5 days.

3.What payment methods are accepted for CY62168DV30LL-55BVIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62168DV30LL-55BVIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62168DV30LL-55BVIT?

CY62168DV30LL-55BVIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62168DV30LL-55BVIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62168DV30LL-55BVIT?

For technical support, including CY62168DV30LL-55BVIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62168DV30LL-55BVIT requirements.

6.How does Aetrix verify that CY62168DV30LL-55BVIT is sourced from the original manufacturer or authorized distributors?

All CY62168DV30LL-55BVIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62168DV30LL-55BVIT meets industry standards.

7.What is the process for return or replacement of CY62168DV30LL-55BVIT?

All CY62168DV30LL-55BVIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62168DV30LL-55BVIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62168DV30LL-55BVIT part is unused and in its original packaging.

Return procedure for CY62168DV30LL-55BVIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY62168DV30LL-55BVIT Tags

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