Infineon Technologies CY62168EV30LL-45BVXIT
- Part No.:
- CY62168EV30LL-45BVXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62168EV30LL-45BVXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,203
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Product details
Overview
CY62168EV30LL-45BVXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (2M × 8) CMOS static RAM with 45 ns access time, operating across 2.2 V–3.6 V supply, featuring ultra-low standby current (1.5 µA typ), automatic power-down on address inactivity, and high-impedance I/O control during deselect/write. It serves as main working memory in battery-powered portable electronics requiring deterministic timing and low quiescent power.
For engineers reviewing the CY62168EV30LL-45BVXIT datasheet, CY62168EV30LL-45BVXIT pinout, CY62168EV30LL-45BVXIT application, or CY62168EV30LL-45BVXIT equivalent, key selection criteria include guaranteed 45 ns read/write timing at 3.6 V, dual chip enable (CE1/CE2) logic for hierarchical memory mapping, MoBL®-optimized active/standby current trade-offs, and FBGA-48 package compatibility with high-density PCB layouts.
Technical Context
This SRAM implements a synchronous, non-volatile-retentive volatile memory array with full CMOS input/output buffers and dual independent chip enable inputs (CE1 active-low, CE2 active-high) enabling flexible bank selection and automatic power-down when either CE signal places the device in deselected state. Address lines A0–A20 decode 2M locations; I/O0–I/O7 provide bidirectional 8-bit data path with three-state control governed by CE1, CE2, OE, and WE.
Power management relies on hardware-level detection of address bus stability: when no address transition occurs for >1 cycle, internal logic triggers automatic power-down mode reducing ICC to ISB1/ISB2 levels. Data retention is supported down to 1.5 V with ICCDR ≤10 µA, and recovery time tR is fixed at 45 ns after VCC stabilization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2M × 8 bits - supports byte-aligned access without external data masking logic |
| Access Time (tAA) | 45 ns max at VCC = 3.6 V - guarantees deterministic read latency for real-time firmware execution |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with single Li-ion, Li-poly, or regulated 2.5 V/3.3 V rails |
| Standby Current (ISB2) | 12 µA max at VCC = 3.6 V - enables multi-year battery life in always-on sensor nodes |
| Active Current (ICC) | 35 mA max at f = fMAX - defines peak power envelope during burst memory access |
| Data Retention Voltage | 1.5 V min - allows graceful shutdown and resume from brown-out conditions |
| Input Capacitance | 10 pF max - limits capacitive loading on address/control buses in high-speed multiplexed systems |
Pinout & Package
Package: 48-ball Fine-Pitch Ball Grid Array (FBGA), 6 mm × 8 mm, 0.8 mm pitch, RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus decoding 2M locations; TTL/CMOS-compatible thresholds |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tristatable I/O; high-impedance when CE1 HIGH, CE2 LOW, OE HIGH, or WE LOW |
| CE1 | Chip Enable 1 (active low) | Primary enable; device enters standby when HIGH, overriding CE2 state |
| CE2 | Chip Enable 2 (active high) | Secondary enable; complements CE1 for hierarchical memory banking |
| OE | Output Enable (active low) | Controls output drivers only; no effect on internal power state |
| WE | Write Enable (active low) | Initiates write cycle when CE1 LOW and CE2 HIGH; latches data on rising edge of WE |
| VCC | Power Supply | Single 2.2–3.6 V supply; decoupling required per ball placement guidelines |
| VSS | Ground | Two dedicated ground balls (pins B1, E1) reduce simultaneous switching noise |
| NC | No Connect | 12 unconnected balls (G1–H1, A2–H2, A3–H3); must be left floating or grounded per layout rules |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active current to 7 mA typical at 1 MHz and standby to 1.5 µA typical-enables multi-week operation on coin-cell batteries |
| Dual Chip Enable Logic | CE1 (active-low) and CE2 (active-high) allow seamless integration into multi-bank memory maps without external gating logic |
| Automatic Address-Inactivity Power-Down | Hardware-detects stable address bus and cuts dynamic current by >90% without software intervention or clock gating |
| Guaranteed 45 ns Timing Across Voltage Range | Meets tAA spec at 2.2 V, 2.5 V, 3.0 V, and 3.6 V-eliminates voltage-margin derating in wide-input designs |
| High-Reliability Data Retention | Maintains stored data at 1.5 V for indefinite period with ICCDR ≤10 µA-supports safe hibernation in energy-harvesting systems |
Applications
| Portable Medical Sensors | Industrial Telematics Modules |
|---|---|
Use Scenario: Continuous glucose monitor logging raw ADC samples every 5 seconds while powered by CR2032 battery. IC Role / Device Role / Timing Role: Primary working memory buffering sensor data before BLE transmission; requires sub-µA standby and deterministic 45 ns read for firmware ISR handling. Use Value: 1.5 µA typical ISB2 extends battery life beyond 18 months; 45 ns tAA ensures zero-cycle penalty during interrupt-driven sampling. | Use Scenario: GPS/GLONASS tracker in fleet vehicle recording position, speed, and CAN bus diagnostics to local buffer during cellular downtime. IC Role / Device Role / Timing Role: High-speed scratchpad memory for real-time packet assembly; dual CE pins interface directly with microcontroller's external memory bus. Use Value: CE1/CE2 logic eliminates need for address decoder IC; 35 mA ICCmax at fMAX supports 10 MB/s burst writes to flash. |
| Wearables with OLED Displays | Smart Meter Data Loggers |
Use Scenario: Fitness band rendering animated UI frames using double-buffered graphics stored in external RAM. IC Role / Device Role / Timing Role: Frame buffer memory accessed concurrently by ARM Cortex-M core and display controller DMA; requires strict 45 ns timing and low EMI. Use Value: 10 pF CIN minimizes signal integrity degradation on 4-layer flex PCB; FBGA-48 footprint enables compact 12 mm² board area. | Use Scenario: Electricity meter storing 30-day kWh, voltage, and current waveforms at 16 kHz sampling rate for post-fault analysis. IC Role / Device Role / Timing Role: High-reliability temporary storage bridging ADC capture and encrypted flash write; must retain data during AC brownouts. Use Value: 1.5 V VDR and ≤10 µA ICCDR guarantee data integrity during 100 ms grid dips; industrial temp range (–40°C to +85°C) ensures field reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV1288BLL-45NLI | Same 2M × 8 organization, 45 ns speed, but 2.7–3.6 V only; higher ISB2 (25 µA max) | Lacks 2.2 V support and automatic power-down; requires external address-stable detection for low-power modes | Select if system uses fixed 3.3 V rail and prioritizes cost over ultra-low-VCC operation |
| Renesas R1LV0216ASBG-45D1 | Identical 2.2–3.6 V range and 45 ns speed; lower typical ISB2 (0.8 µA) but no CE2 pin-single CE only | Requires redesign of memory controller logic to remove CE2 dependency; no hierarchical bank enable capability | Select when board space permits larger TSOP-II package and CE2 functionality is unused |
Compared with IS62WV1288BLL-45NLI and R1LV0216ASBG-45D1, CY62168EV30LL-45BVXIT uniquely combines 2.2 V operation, dual CE architecture, and hardware-triggered power-down-making it optimal for portable systems where voltage headroom, memory mapping flexibility, and autonomous power gating are jointly critical.
Availability
CY62168EV30LL-45BVXIT is available at Aetrix Electronics and suitable for portable medical sensors, industrial telematics modules, wearables with OLED displays, and smart meter data loggers requiring stable component supply across extended product lifecycles.
Supply support for CY62168EV30LL-45BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, security ICs, and memory solutions.
CY62168EV30LL belongs to Infineon's MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power portable and energy-constrained embedded systems where runtime, voltage flexibility, and deterministic timing are non-negotiable.
FAQ
What is the minimum VCC required to retain data in CY62168EV30LL-45BVXIT?
The device guarantees data retention down to VCC = 1.5 V, with maximum data retention current (ICCDR) of 10 µA under those conditions. This allows safe hibernation during brown-out events without external backup capacitors, provided CE1 and CE2 are held in deselected states and all inputs remain within valid voltage ranges.
Does CY62168EV30LL-45BVXIT support true asynchronous operation?
Yes-it operates asynchronously with no clock input required. All timing is referenced to CE1, CE2, OE, and WE transitions. The 45 ns access time (tAA) is measured from the latest qualifying edge of CE1/CE2/OE to valid data on I/O pins, and write setup/hold times are defined relative to WE and CE edges per the datasheet truth table.
Can NC pins on the 48-ball FBGA be grounded or left floating?
NC pins must be left electrically floating per Infineon's design guidance. Grounding them may cause unintended current paths or violate internal ESD protection structures. The datasheet explicitly states "NC pins are not connected on the die," and recommended PCB layout isolates these balls with non-plated through-holes or keep-out zones.
How does automatic power-down activate, and does it require firmware control?
Automatic power-down activates autonomously when the address bus remains stable for one full cycle-no firmware or external signal needed. Internal circuitry detects lack of address transitions and reduces ICC by >90% within nanoseconds. This feature is always enabled and cannot be disabled; it operates transparently alongside normal read/write operations.
CY62168EV30LL-45BVXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62168EV30LL-45BVXIT FAQ
1.How can I place an order for CY62168EV30LL-45BVXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62168EV30LL-45BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62168EV30LL-45BVXIT reliable?
The price and inventory of CY62168EV30LL-45BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62168EV30LL-45BVXIT is usually 5 days.
3.What payment methods are accepted for CY62168EV30LL-45BVXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62168EV30LL-45BVXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62168EV30LL-45BVXIT?
CY62168EV30LL-45BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62168EV30LL-45BVXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62168EV30LL-45BVXIT?
For technical support, including CY62168EV30LL-45BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62168EV30LL-45BVXIT requirements.
6.How does Aetrix verify that CY62168EV30LL-45BVXIT is sourced from the original manufacturer or authorized distributors?
All CY62168EV30LL-45BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62168EV30LL-45BVXIT meets industry standards.
7.What is the process for return or replacement of CY62168EV30LL-45BVXIT?
All CY62168EV30LL-45BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62168EV30LL-45BVXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62168EV30LL-45BVXIT part is unused and in its original packaging.
Return procedure for CY62168EV30LL-45BVXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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