Infineon Technologies CY62168G18-55BVXI

Overview

CY62168G18-55BVXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (2M × 8) MoBL® low-power CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 55 ns access time, supporting dual voltage ranges (1.65–2.2 V and 4.5–5.5 V), and featuring an ERR output pin for real-time ECC event indication in industrial applications.

For engineers reviewing the CY62168G18-55BVXI datasheet, CY62168G18-55BVXI pinout, CY62168G18-55BVXI application, or CY62168G18-55BVXI equivalent, key selection criteria include ECC-enabled data integrity in memory subsystems, ultra-low standby current (≤16 µA), TTL-compatible I/O, and Pb-free 48-ball VFBGA packaging for space-constrained embedded designs.

Technical Context

This SRAM integrates dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors during read cycles without requiring external logic. The ERR pin asserts HIGH only when correction occurs, enabling system-level fault logging without interrupt overhead.

It supports two chip-enable architectures: single CE (CE1 only) or dual CE (CE1/CE2), allowing flexible memory mapping in multi-bank systems. Address decoding covers A0–A20 (21 bits), fully accessing the 2M-word array, while I/O0–I/O7 provide byte-wide bidirectional data transfer with high-impedance control via OE and CE states.

Key Specifications

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1 mm, Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Compared with IS62WV1288BLL-55MLI and R1EX24128ASAS0I, CY62168G18-55BVXI uniquely delivers hardware ECC, 16 Mbit density, parallel TTL interface, and ultra-low standby power in a single 48-ball VFBGA - making it irreplaceable for high-integrity, high-throughput embedded memory subsystems.

Availability

CY62168G18-55BVXI is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical imaging cache, avionics flight log storage, and smart grid metering modules requiring stable component supply across extended product lifecycles.

Supply support for CY62168G18-55BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with strong industrial and aerospace certifications.

CY62168G18-55BVXI belongs to Infineon's MoBL® (Mobile Binary Logic) SRAM product line, engineered for ultra-low-power, high-reliability embedded memory in space-constrained, mission-critical systems operating across extended temperature and voltage ranges.

FAQ

Does CY62168G18-55BVXI support automatic error correction without host intervention?

Yes. The device performs single-bit error detection and correction entirely in hardware during every read cycle. No firmware or external logic is needed - corrected data appears on I/O pins, and the ERR pin asserts HIGH to signal the event. It does not perform automatic write-back; corrected data remains in the array only until next write.

Can the ERR pin be left unconnected if ECC status monitoring is not required?

Yes. The ERR pin is open-drain and inactive (high-impedance) when no correction occurs. If unused, it must be left floating - do not tie to VCC or ground. Pull-up resistors are unnecessary unless interfacing with an external interrupt controller requiring active-HIGH signaling.

What is the maximum operating frequency supported by CY62168G18-55BVXI at 1.8 V?

At 1.65–2.2 V supply, the device is rated for 55 ns access time, corresponding to a maximum sustained read/write clock rate of 18.18 MHz. This assumes proper setup/hold timing for CE, OE, WE, and address signals per the datasheet's AC switching characteristics table.

Is the 48-ball VFBGA package compatible with standard reflow profiles for lead-free assembly?

Yes. The Pb-free VFBGA package is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260 °C. Thermal resistance values (θJA = 31.5 °C/W, θJC = 15.75 °C/W) are specified for soldering on a 4-layer PCB per JEDEC standards.