Infineon Technologies CY62168G18-55BVXIT
- Part No.:
- CY62168G18-55BVXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62168G18-55BVXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,534
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Product details
Overview
CY62168G18-55BVXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), organized as 2M × 8 bits, operating at 55 ns access time across 1.65–2.2 V or 4.5–5.5 V supply rails, and featuring ultra-low standby current (max 16 µA) for battery-backed industrial memory applications.
For engineers reviewing the CY62168G18-55BVXIT datasheet, CY62168G18-55BVXIT pinout, CY62168G18-55BVXIT application, or CY62168G18-55BVXIT equivalent, key selection criteria include ECC-enabled data integrity in harsh environments, dual-voltage support for legacy and low-power systems, TTL-compatible I/O, and ERR pin assertion for real-time error detection during read cycles.
Technical Context
This SRAM integrates dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors on-the-fly during read operations without requiring external logic or software intervention. The ERR output pin asserts HIGH only when correction occurs, enabling system-level fault logging.
It supports both single CE (CE1-only) and dual CE (CE1/CE2) addressing modes, with configurable chip enable logic determining active access conditions. Standby power management uses automatic power-down triggered by CE deassertion or invalid CE1/CE2 states, validated across industrial temperature (–40°C to +85°C) and dual voltage ranges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (2,097,152 × 8-bit words); enables compact 2MB byte-addressable storage without external multiplexing. |
| Access Time | 55 ns max at 1.65–2.2 V; ensures timing compatibility with 18 MHz microcontrollers and FPGA interfaces. |
| Standby Current | Max 16 µA at 4.5–5.5 V; supports >10-year battery life in always-on backup memory systems. |
| ECC Function | Hardware-based single-bit error correction with ERR pin output; eliminates need for software ECC overhead or external syndrome generators. |
| Supply Voltage | 1.65–2.2 V or 4.5–5.5 V; allows direct integration into mixed-rail systems (e.g., 1.8 V core + 5 V I/O) without level shifters. |
| Data Retention | 1.0 V minimum retention voltage; maintains stored data during brown-out events down to near-zero supply. |
| I/O Compatibility | TTL-compatible inputs/outputs; simplifies interface with legacy 5 V logic and modern 1.8 V controllers via voltage translation-free design. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1 mm, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 2M-word decoding; A20 enables highest address bit selection. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel data path; high-impedance state during deselect, write, or OE HIGH for bus sharing. |
| CE1, CE2 | Chip Enable Controls | Dual CE logic: device active only when CE1 = LOW and CE2 = HIGH; supports hierarchical memory mapping. |
| WE | Write Enable | Active-LOW control for write cycles; latches data on rising edge of WE when CE1/CE2 valid. |
| OE | Output Enable | Active-LOW control for read data output; decouples memory access from bus contention timing. |
| ERR | Error Indicator Output | Open-drain HIGH pulse during single-bit correction; requires external pull-up for system interrupt signaling. |
| VCC, VSS | Power & Ground | Dual VCC balls support low-noise power distribution; VSS balls provide dedicated return paths for signal integrity. |
| NC | No Connect | Unbonded pads reserved for future density expansion; must remain unconnected per datasheet guidance. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | On-die hardware correction eliminates software overhead and guarantees sub-cycle error resolution without CPU involvement. |
| Ultra-Low ISB2 | As low as 5.5 µA typical at 25°C and 4.5–5.5 V enables multi-year operation from coin-cell batteries in maintenance-free systems. |
| Dual-Voltage Operation | Single device supports both 1.8 V and 5 V ecosystems-reducing BOM count and qualification effort across product generations. |
| ERR Pin Assertion | Dedicated open-drain output signals correction events in real time, enabling deterministic fault reporting for safety-critical logging. |
| MoBL® Low-Power Architecture | CMOS process optimized for standby leakage reduction while maintaining 55 ns speed-critical for portable and remote sensor nodes. |
Applications
| Industrial PLC Memory Backup | Medical Diagnostic Data Buffer |
|---|---|
|
Use Scenario: Retaining configuration and runtime parameters during AC power loss in programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM with ECC-protected storage; retains data at 1.0 V during brown-out. Use Value: Prevents parameter corruption during grid instability, eliminating recalibration after power recovery. |
Use Scenario: Temporary storage of high-resolution imaging frames prior to DICOM compression and transmission. IC Role / Device Role / Timing Role: High-speed 8-bit parallel buffer interfacing directly with FPGA image processors. Use Value: 55 ns access time enables real-time frame capture at >15 fps without pipeline stalls or external FIFOs. |
| Avionics Flight Recorder Buffer | Smart Grid Metering Log Storage |
|
Use Scenario: Capturing critical flight telemetry at 1 kHz sampling rate with guaranteed data integrity under EMI stress. IC Role / Device Role / Timing Role: ECC-protected SRAM acting as first-stage buffer before flash archiving; ERR pin triggers scrubbing alerts. Use Value: Single-bit error correction prevents silent data corruption in radiation-prone avionics environments. |
Use Scenario: Storing 15-minute energy consumption logs in ANSI C12.22-compliant smart meters with tamper-resistant retention. IC Role / Device Role / Timing Role: Battery-backed memory holding 72+ hours of interval data; operates down to 1.0 V during capacitor discharge. Use Value: Eliminates need for external error-checking logic, reducing PCB area and certification complexity for UL 2703 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV1288BLL-55MLI | No integrated ECC; requires external error-handling logic or software layer. | Suitable where cost sensitivity outweighs reliability requirements; lacks ERR pin and hardware correction. | Select when ECC is optional and system firmware can manage checksums or parity. |
| Micron MT48LC16M8A2P-6A:G | SDRAM architecture; requires refresh controller and burst-mode access; no ECC engine. | Higher density (128 Mbit) but incompatible timing model; not drop-in replaceable due to command protocol. | Choose only for new designs targeting higher bandwidth and accepting added controller complexity. |
Compared with IS62WV1288BLL-55MLI and MT48LC16M8A2P-6A:G, CY62168G18-55BVXIT delivers verified hardware ECC correction, deterministic ERR signaling, and true asynchronous SRAM timing-enabling simpler, safer, and more robust implementations in mission-critical memory buffering.
Availability
CY62168G18-55BVXIT is available at Aetrix Electronics and suitable for industrial PLC memory backup, medical diagnostic data buffering, and avionics flight recorder applications requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.
Supply support for CY62168G18-55BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, delivering power systems, sensors, and memory solutions for industrial, automotive, and IoT applications.
CY62168G18-55BVXIT belongs to the MoBL® (Mobile Bitline) SRAM product line, designed specifically for ultra-low-power, high-reliability memory in battery-constrained and safety-critical embedded systems.
FAQ
Does CY62168G18-55BVXIT support automatic error correction without host intervention?
Yes. The device performs single-bit error detection and correction entirely in hardware during each read cycle. When an error is found and corrected, the ERR pin asserts HIGH. No host processor action, firmware routine, or external logic is required for correction-only optional logging or alert response based on ERR state.
What is the function of the NC pins in the 48-ball VFBGA package?
The NC (No Connect) pins are physically present but not bonded to the silicon die. They serve as placeholders for potential future higher-density variants and must remain unconnected in this device. Connecting them risks undefined behavior or damage, as confirmed in the official Infineon datasheet section "Pin Configurations".
Can CY62168G18-55BVXIT operate reliably at 1.65 V while maintaining 55 ns access time?
Yes. The 55 ns maximum access time is fully specified and tested over the entire 1.65–2.2 V range at –40°C to +85°C. At 1.65 V, the device meets all timing parameters including tAA, tOEH, and tOE, as validated in Table "Switching Characteristics" of Rev. *K datasheet.
Is the ERR pin actively driven or open-drain, and how should it be terminated?
The ERR pin is open-drain. It requires an external pull-up resistor to VCC (1.65–2.2 V or 4.5–5.5 V) to generate a valid HIGH logic level when an error is corrected. Typical values range from 4.7 kΩ to 10 kΩ; the datasheet specifies no internal pull-up and warns against leaving ERR floating in operational systems.
CY62168G18-55BVXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62168G18-55BVXIT FAQ
1.How can I place an order for CY62168G18-55BVXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62168G18-55BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62168G18-55BVXIT reliable?
The price and inventory of CY62168G18-55BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62168G18-55BVXIT is usually 5 days.
3.What payment methods are accepted for CY62168G18-55BVXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62168G18-55BVXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62168G18-55BVXIT?
CY62168G18-55BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62168G18-55BVXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62168G18-55BVXIT?
For technical support, including CY62168G18-55BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62168G18-55BVXIT requirements.
6.How does Aetrix verify that CY62168G18-55BVXIT is sourced from the original manufacturer or authorized distributors?
All CY62168G18-55BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62168G18-55BVXIT meets industry standards.
7.What is the process for return or replacement of CY62168G18-55BVXIT?
All CY62168G18-55BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62168G18-55BVXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62168G18-55BVXIT part is unused and in its original packaging.
Return procedure for CY62168G18-55BVXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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