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Infineon Technologies CY62177ESL-55ZXIT
- Part No.:
- CY62177ESL-55ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62177ESL-55ZXIT.pdf
- Description:
- IC SRAM 32MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:2,416
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Product details
Overview
CY62177ESL-55ZXIT from Infineon Technologies (formerly Cypress) is a 32-Mbit MoBL® CMOS static RAM organized as 2M × 16 or 4M × 8, operating at 55 ns access time with dual voltage support (2.2–3.6 V and 4.5–5.5 V), ultra-low standby current (3 µA typ), and automatic power-down for portable battery-powered systems.
For engineers reviewing the CY62177ESL-55ZXIT datasheet, CY62177ESL-55ZXIT pinout, CY62177ESL-55ZXIT application, or CY62177ESL-55ZXIT equivalent, this SRAM delivers verified low-power operation in industrial temperature range (–40 °C to +85 °C), configurable byte-width interface, and TSOP I package compatibility for space-constrained embedded memory expansion.
Technical Context
The CY62177ESL-55ZXIT implements dual-bank byte-select architecture with independent BHE/ BLE controls enabling simultaneous high/low byte access, and supports automatic power-down when CE1 is HIGH, CE2 is LOW, or both BHE and BLE are HIGH - reducing active-to-standby transition time to ≤55 ns. Its CMOS design ensures TTL-compatible logic thresholds across both voltage ranges.
Memory organization is dynamically selectable via BYTE pin: tied to VCC for 2M × 16 mode (A0–A20 address space), or to VSS for 4M × 8 mode (A0–A21, with A21 on pin 45). Data retention is guaranteed down to 1.5 V with ICCDR ≤17 µA, supporting brown-out recovery in portable systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacity | 32 Mbit (2M × 16 or 4M × 8), enabling flexible data bus width selection per system architecture |
| Access Time | 55 ns max - guarantees deterministic read/write timing for real-time microcontroller interfaces |
| Voltage Range | 2.2–3.6 V and 4.5–5.5 V - supports dual-supply legacy and low-voltage modern designs without level-shifting |
| Standby Current | 3 µA typical / 25 µA max - enables multi-year battery life in always-on IoT endpoints |
| Operating Current | 4.5 mA typical at 1 MHz - balances performance and power for burst-mode applications |
| Data Retention Voltage | 1.5 V min - maintains memory state during deep sleep or supply sag without external backup |
| Temperature Range | –40 °C to +85 °C industrial grade - validated for automotive infotainment and industrial HMI use |
Pinout & Package
48-pin Thin Small Outline Package I (TSOP I), RoHS-compliant, 12 mm × 20 mm footprint, 0.5 mm pitch. Pin 1 marked by beveled corner; BYTE pin configures memory width (VCC = 2M×16, VSS = 4M×8).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus; A21 used only in 4M×8 mode (pin 45) |
| I/O0–I/O7 | Data inputs/outputs (low byte) | Active when BLE = LOW; tri-stated when BLE = HIGH or device deselected |
| I/O8–I/O15 | Data inputs/outputs (high byte) | Active when BHE = LOW; tri-stated when BHE = HIGH or device deselected |
| CE1, CE2 | Chip enable controls | CE1 LOW + CE2 HIGH enables device; CE1 HIGH or CE2 LOW forces standby |
| OE | Output enable | LOW enables read data output; HIGH places I/O pins in high-Z state |
| WE | Write enable | LOW initiates write; must be synchronized with CE and byte enables |
| BHE, BLE | Byte high/low enable | Independent control of upper/lower 8-bit data lanes; both HIGH disables all I/O |
| BYTE | Memory width configuration | Tied to VCC for 2M×16 (A0–A20); tied to VSS for 4M×8 (A0–A21, pin 45 = A21) |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces standby current to 3 µA typical - extends battery runtime in handheld medical devices |
| Automatic Power-Down | 99% power reduction when addresses idle - eliminates need for external sleep controllers |
| Dual-Voltage Operation | Single part supports both 2.5 V and 5 V system rails - simplifies BOM across product generations |
| Configurable Bus Width | Hardware-selectable 16-bit or 8-bit interface via BYTE pin - adapts to MCU data bus constraints |
| Industrial Temperature Grade | Validated from –40 °C to +85 °C - suitable for under-hood telematics and factory automation |
Applications
| Portable Medical Monitors | Industrial PLC Data Buffers |
|---|---|
|
Use Scenario: Continuous ECG waveform capture and local buffering before wireless transmission. IC Role / Device Role / Timing Role: High-reliability, low-power SRAM storing real-time sensor samples between MCU processing cycles. Use Value: 3 µA standby current enables >5-year battery life in sealed wearable units without maintenance. |
Use Scenario: Temporary storage of I/O status and ladder logic variables during scan cycle execution. IC Role / Device Role / Timing Role: Fast-access scratchpad memory interfaced to ARM Cortex-M7 PLC controller over 16-bit bus. Use Value: 55 ns access time ensures deterministic response within 100 µs scan cycles, meeting IEC 61131-3 timing requirements. |
| Automotive Infotainment Head Units | Smart Meter Firmware Caching |
|
Use Scenario: Storing decoded audio frames and UI assets during navigation and media playback. IC Role / Device Role / Timing Role: Secondary memory bank expanding main SoC DDR capacity for low-latency GUI rendering. Use Value: Dual-voltage support (2.2–3.6 V) allows direct integration with 3.3 V power domain, avoiding LDO overhead. |
Use Scenario: Caching firmware update packets and tariff tables prior to flash programming. IC Role / Device Role / Timing Role: Non-volatile buffer holding encrypted OTA payloads during power-fail-safe write sequences. Use Value: Data retention down to 1.5 V ensures payload integrity during brown-out events common in grid-edge deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density, low-power SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV204816BLL-55NLI | Same 2M×16 organization, 55 ns speed, but single 2.7–3.6 V supply; no 4.5–5.5 V support | Limited to 3.3 V systems; lacks dual-voltage flexibility for mixed-rail designs | Select when only 3.3 V operation is required and cost sensitivity outweighs voltage versatility |
| Renesas R1LV25616AS-5SI#S0 | 256 K × 16 (4 Mbit), not 32 Mbit; faster 45 ns access but lower density and no automatic power-down | Insufficient capacity for full-frame buffering; requires external power management circuitry | Choose only for legacy 4 Mbit upgrades where board space prevents larger SRAM placement |
Compared with IS62WV204816BLL-55NLI and R1LV25616AS-5SI#S0, the CY62177ESL-55ZXIT uniquely combines 32 Mbit density, dual-voltage operation, sub-µA standby, and hardware-configurable bus width - making it the sole option for next-generation portable and industrial systems requiring scalable, low-power memory expansion.
Availability
CY62177ESL-55ZXIT is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC data buffers, and automotive infotainment head units requiring stable component supply across extended product lifecycles.
Supply support for CY62177ESL-55ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, delivering reliable, low-power semiconductor solutions for industrial, automotive, and consumer markets.
The CY62177ESL belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for energy-constrained portable and embedded systems requiring long-term data retention and rapid wake-from-standby capability.
FAQ
What is the function of the BYTE pin on CY62177ESL-55ZXIT?
The BYTE pin selects memory organization: tied to VCC configures the device as 2M × 16 (A0–A20), while tied to VSS enables 4M × 8 mode (A0–A21, with A21 on pin 45). In 4M × 8 mode, BHE, BLE, and I/O8–I/O14 are unused. This hardware-selectable feature eliminates need for external configuration logic.
Does CY62177ESL-55ZXIT support true 5 V operation?
Yes - the device is fully specified for 4.5 V to 5.5 V operation, including VOH ≥2.4 V at IOH = –1.0 mA and VOL ≤0.4 V at IOL = 2.1 mA. It meets TTL-compatible thresholds in this range and supports mixed-voltage systems alongside legacy 5 V peripherals without level shifters.
How does automatic power-down reduce power consumption?
When CE1 is HIGH, CE2 is LOW, or both BHE and BLE are HIGH, the device enters automatic power-down mode, reducing ICC to ≤25 µA. This 99% reduction versus active current occurs without software intervention and is triggered by stable address/bus conditions - ideal for intermittent data logging.
Can CY62177ESL-55ZXIT retain data below 2.2 V?
Yes - data retention is guaranteed down to VDR = 1.5 V, with ICCDR ≤17 µA. At this voltage, the SRAM maintains stored contents during brown-out or battery sag, enabling safe state preservation before controlled shutdown in portable equipment.
CY62177ESL-55ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.2V ~ 3.6V, 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY62177ESL-55ZXIT FAQ
1.How can I place an order for CY62177ESL-55ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62177ESL-55ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62177ESL-55ZXIT reliable?
The price and inventory of CY62177ESL-55ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62177ESL-55ZXIT is usually 5 days.
3.What payment methods are accepted for CY62177ESL-55ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62177ESL-55ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62177ESL-55ZXIT?
CY62177ESL-55ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62177ESL-55ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62177ESL-55ZXIT?
For technical support, including CY62177ESL-55ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62177ESL-55ZXIT requirements.
6.How does Aetrix verify that CY62177ESL-55ZXIT is sourced from the original manufacturer or authorized distributors?
All CY62177ESL-55ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62177ESL-55ZXIT meets industry standards.
7.What is the process for return or replacement of CY62177ESL-55ZXIT?
All CY62177ESL-55ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62177ESL-55ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62177ESL-55ZXIT part is unused and in its original packaging.
Return procedure for CY62177ESL-55ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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