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Infineon Technologies CY62177G30-55BAXI

Part No.:
CY62177G30-55BAXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixCY62177G30-55BAXI.pdf
Description:
IC SRAM 32MBIT PARALLEL 48FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,457

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Product details

Overview

CY62177G30-55BAXI from Infineon Technologies (formerly Cypress) is a 32-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configured as 2M × 16 or 4M × 8, operating at 55 ns access time over 2.2–3.6 V supply. It features ultra-low standby current (max 19 µA), TTL-compatible I/Os, and Byte Power-down mode for dynamic power savings. Used in industrial control systems requiring data integrity and low-power retention.

For engineers reviewing the CY62177G30-55BAXI datasheet, CY62177G30-55BAXI pinout, CY62177G30-55BAXI application, or CY62177G30-55BAXI equivalent, key selection criteria include ECC-enabled reliability, dual chip enable support, TSOP I package compatibility, 55 ns timing margin, and industrial-grade temperature operation (–40 °C to +85 °C).

Technical Context

This SRAM integrates dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors on every read cycle without external logic. The Byte Power-down feature activates automatically when both BHE and BLE are deasserted, enabling sub-19 µA standby regardless of CE state.

It supports two memory configurations via BYTE pin control: 2M × 16 (BYTE = VCC) or 4M × 8 (BYTE = VSS), with A21 exposed only in the latter mode. Dual CE inputs (CE1/CE2) provide hierarchical chip select for multi-device systems, while TTL-compatible signaling ensures direct interfacing with legacy microcontrollers.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32 Mbit (2M × 16 or 4M × 8 configuration)
Access Time 55 ns - guarantees deterministic read latency for real-time industrial firmware execution
Supply Voltage 2.2 V to 3.6 V - supports wide-input LDOs and battery-backed operation down to 2.2 V
Standby Current Max 19 µA - enables >1-year data retention on coin-cell backup without refresh
ECC Function Single-bit error correction per 16-bit word - reduces uncorrectable error rate to <0.1 FIT/Mb
Operating Temperature –40 °C to +85 °C - qualified for industrial control, PLC, and motor drive environments
Package 48-pin TSOP I - surface-mount compatible with standard reflow profiles and automated assembly

Pinout & Package

Package: 48-pin Thin Small Outline Package (TSOP I), RoHS-compliant, Pb-free, body size 12 mm × 20 mm × 1.2 mm.

Pin/Terminal Circuit Role Design Meaning
A0–A20 Address Inputs 21-bit address bus; A21 available only in 4M × 8 mode (pin 45)
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; byte-selectable via BHE/ BLE
CE1 / CE2 Dual Chip Enable Inputs Active-Low hierarchical selection: CE1=LOW & CE2=HIGH enables device
WE Write Enable Active-Low control for synchronous write cycles
OE Output Enable Active-Low control for read data output; high-Z when disabled
BHE / BLE Byte High/Low Enable Select upper (I/O8–I/O15) or lower (I/O0–I/O7) byte during access
BYTE Memory Width Configuration Tie to VCC for 2M × 16; tie to VSS for 4M × 8 (enables A21)
VCC / VSS Power / Ground Single 2.2–3.6 V supply; dual VSS pins for noise isolation

Key Features

Feature Design Value
Embedded ECC Hardware-accelerated single-bit error correction per 16-bit word, eliminating need for software ECC overhead
Byte Power-down Mode Automatic transition to ultra-low-power standby (<19 µA) when both BHE and BLE are inactive
Configurable Memory Width Runtime-selectable 2M × 16 or 4M × 8 organization via external BYTE pin bias
TTL-Compatible I/O Direct interface with legacy MCUs and FPGAs without level-shifting circuitry
Industrial Temperature Range Guaranteed functionality from –40 °C to +85 °C, validated across full voltage and timing margins

Applications

Programmable Logic Controllers (PLCs) Industrial Human-Machine Interfaces (HMIs)

Use Scenario: Storing runtime configuration, ladder logic variables, and I/O mapping tables in DIN-rail mounted controllers.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM with ECC protection for critical control state data.

Use Value: Prevents silent data corruption in long-duration deployments where memory bit flips could cause unsafe actuator behavior.

Use Scenario: Buffering graphics frame buffers and touch event queues in panel-mounted HMIs with ARM Cortex-M7 processors.

IC Role / Device Role / Timing Role: High-speed parallel SRAM co-processor memory with deterministic 55 ns read latency.

Use Value: Enables smooth 60 Hz UI rendering without CPU polling delays or DMA stalls due to memory errors.

Motor Drive Control Boards Railway Signaling Modules

Use Scenario: Holding real-time PWM duty-cycle lookup tables and fault history logs in servo amplifier boards.

IC Role / Device Role / Timing Role: Low-power, ECC-protected working memory for safety-critical motion control algorithms.

Use Value: Maintains functional safety integrity (IEC 61508 SIL-2) by correcting memory errors before they propagate to gate drivers.

Use Scenario: Storing interlocking logic state and train position tracking data in EN 5012x-certified signaling hardware.

IC Role / Device Role / Timing Role: Radiation-tolerant SRAM with SER <0.1 FIT/Mb for fail-safe railway infrastructure.

Use Value: Meets CENELEC requirements for unrecoverable failure rate in mission-critical rail control systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV204816BLL-10MLI No integrated ECC; requires external error detection logic or software correction Lacks hardware-level single-bit correction; increases firmware complexity and latency Choose only if system already implements ECC in software and cost sensitivity outweighs reliability risk
AS6C4008-55ZIN 4-Mbit density (256K × 16); no ECC; 55 ns speed; 3.3 V only Insufficient capacity for 32-Mbit buffer needs; no error resilience for safety-critical use Acceptable only for non-safety, low-density buffering where ECC is not mandated

Compared with IS61WV204816BLL-10MLI and AS6C4008-55ZIN, CY62177G30-55BAXI uniquely delivers 32-Mbit density with on-die ECC correction, enabling certified safety operation without software overhead or external ICs-critical for industrial control and rail signaling.

Availability

CY62177G30-55BAXI is available at Aetrix Electronics and suitable for programmable logic controllers, industrial HMIs, motor drive control boards, and railway signaling modules requiring stable component supply, long-term lifecycle assurance, and guaranteed ECC functionality.

Supply support for CY62177G30-55BAXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.

CY62177G30 belongs to Infineon's MoBL® (Mobile Bitline) SRAM product line, engineered for ultra-low-power, high-reliability embedded systems where data integrity and extended battery life are mandatory design constraints.

FAQ

Does CY62177G30-55BAXI support automatic error correction during read operations?

Yes. The device performs single-bit error detection and correction transparently on every read cycle using on-die ECC circuitry. No external logic or software intervention is required-the corrected data appears on the I/O bus, and no ERR pin assertion occurs (unlike CY62177GE30). This ensures silent, deterministic data integrity.

What is the function of the BYTE pin on CY62177G30-55BAXI?

The BYTE pin configures memory organization: tied to VCC, it operates as a 2M × 16 SRAM; tied to VSS, it becomes a 4M × 8 device with A21 enabled on pin 45. In 4M × 8 mode, BHE, BLE, and I/O8–I/O14 are unused and may be left floating-no pull-up/down required.

Can CY62177G30-55BAXI operate reliably at 2.2 V?

Yes. It is fully specified across 2.2 V to 3.6 V, including 55 ns access time, 19 µA max standby current, and ECC functionality at minimum VCC. DC and AC parameters are guaranteed over the full industrial temperature range (–40 °C to +85 °C) at 2.2 V.

Is the 48-pin TSOP I package RoHS-compliant and lead-free?

Yes. CY62177G30-55BAXI uses a Pb-free 48-pin TSOP I package compliant with RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3). The package marking "BAXI" denotes this Pb-free, industrial-grade variant.

CY62177G30-55BAXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
48-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
32Mbit
Memory Organization:
4M x 8, 2M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-FBGA (8x9.5)

CY62177G30-55BAXI FAQ

1.How can I place an order for CY62177G30-55BAXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62177G30-55BAXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62177G30-55BAXI reliable?

The price and inventory of CY62177G30-55BAXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62177G30-55BAXI is usually 5 days.

3.What payment methods are accepted for CY62177G30-55BAXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62177G30-55BAXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62177G30-55BAXI?

CY62177G30-55BAXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62177G30-55BAXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62177G30-55BAXI?

For technical support, including CY62177G30-55BAXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62177G30-55BAXI requirements.

6.How does Aetrix verify that CY62177G30-55BAXI is sourced from the original manufacturer or authorized distributors?

All CY62177G30-55BAXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62177G30-55BAXI meets industry standards.

7.What is the process for return or replacement of CY62177G30-55BAXI?

All CY62177G30-55BAXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62177G30-55BAXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62177G30-55BAXI part is unused and in its original packaging.

Return procedure for CY62177G30-55BAXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY62177G30-55BAXI Tags

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