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Infineon Technologies CY62177G30-55BKXI
- Part No.:
- CY62177G30-55BKXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
CY62177G30-55BKXI.pdf
- Description:
- IC SRAM 32MBIT PARALLEL 48FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,654
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Product details
Overview
CY62177G30-55BKXI from Infineon Technologies (formerly Cypress) is a 32-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configured as 2M × 16 or 4M × 8, operating at 55 ns access time over 2.2–3.6 V supply. It features ultra-low standby current (max 19 µA), TTL-compatible I/Os, and byte power-down for dynamic power management in space-constrained industrial memory subsystems.
For engineers reviewing the CY62177G30-55BKXI datasheet, CY62177G30-55BKXI pinout, CY62177G30-55BKXI application, or CY62177G30-55BKXI equivalent, key selection criteria include ECC-enabled data integrity, dual chip enable flexibility, TSOP I package compatibility, and industrial-grade temperature support (–40°C to +85°C).
Technical Context
This SRAM integrates dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors on every read cycle without requiring external logic. Its Byte Power-down feature automatically enters standby when both BHE and BLE are deasserted-enabling sub-µA-level power savings independent of CE state.
The device supports two memory configurations via BYTE pin control: tying BYTE to VCC selects 2M × 16 mode (A0–A20 address lines active); tying BYTE to VSS enables 4M × 8 mode (A21 becomes active on pin 45, while BHE/ BLE and I/O8–I/O14 are unused). No ERR pin is present-distinguishing it from the CY62177GE30 variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (2M words × 16-bit or 4M words × 8-bit) |
| Access Time | 55 ns - guarantees deterministic read latency for real-time industrial control buffers |
| Supply Voltage | 2.2 V to 3.6 V - compatible with 2.5 V and 3.3 V system rails without level-shifting |
| Standby Current | Max 19 µA at VCC = 3.6 V - enables battery-backed operation in low-power edge nodes |
| ECC Function | Single-bit error correction per word - reduces uncorrectable error rate to <0.1 FIT/Mb |
| Operating Temperature | –40°C to +85°C - qualified for industrial ambient environments without derating |
| Package | 48-pin TSOP I - surface-mount compatible with standard reflow profiles and board space constraints |
Pinout & Package
Package: 48-pin Thin Small Outline Package (TSOP I), RoHS-compliant, Pb-free, body dimensions 12.0 mm × 20.0 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting 2M-word (16-bit) or 4M-word (8-bit) addressing |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE |
| CE1 / CE2 | Dual Chip Enable Inputs | Active-Low enables; CE1 = LOW and CE2 = HIGH required for access - supports multi-chip select decoding |
| WE | Write Enable | Active-Low signal initiating write cycle; latches data on rising edge of WE |
| OE | Output Enable | Active-Low control for output buffer; places I/Os in high-Z when deasserted |
| BHE / BLE | Byte High/Low Enable | Select upper/lower byte during 16-bit access; both deasserted triggers automatic standby |
| BYTE | Memory Configuration Select | Tie to VCC for 2M×16 mode; tie to VSS for 4M×8 mode (enables A21 on pin 45) |
| VCC / VSS | Power / Ground | Single 2.2–3.6 V supply; separate VSS pins improve noise immunity and decoupling |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | On-die encoder/decoder corrects single-bit errors transparently-no software overhead or external logic required |
| Byte Power-down Mode | Automatic transition to standby when BHE and BLE are both inactive-eliminates need for external power sequencing |
| Configurable Memory Width | Hardware-selectable 16-bit or 8-bit data bus via BYTE pin-supports legacy and modern controller interfaces |
| Industrial Temperature Range | Full functionality across –40°C to +85°C-validated for use in motor drives, PLCs, and medical diagnostics |
| TTL-Compatible I/O | VIH/VIL thresholds match standard 3.3 V logic families-direct interfacing with microcontrollers and FPGAs |
Applications
| Industrial PLC Data Buffer | Medical Imaging Frame Store |
|---|---|
|
Use Scenario: Real-time I/O scanning and tag storage in programmable logic controllers with deterministic cycle timing. IC Role / Device Role / Timing Role: Primary working memory holding ladder logic variables, status registers, and buffered sensor inputs. Use Value: 55 ns access ensures sub-millisecond scan cycles; ECC prevents silent data corruption in long-running control loops. |
Use Scenario: Temporary frame buffering in portable ultrasound or X-ray systems where radiation-induced soft errors must be mitigated. IC Role / Device Role / Timing Role: High-reliability scratchpad memory storing digitized image frames before compression and transmission. Use Value: <0.1 FIT/Mb SER rate meets IEC 62304 Class C safety requirements; 1.5 V data retention supports safe shutdown during power loss. |
| Automotive ADAS Sensor Hub | Test & Measurement Equipment Cache |
|
Use Scenario: Aggregating radar, camera, and CAN data streams in autonomous driving domain controllers. IC Role / Device Role / Timing Role: Low-latency shared memory between heterogeneous processors (MCU + DSP) with coherent data views. Use Value: Dual CE inputs allow seamless arbitration between processing cores; TSOP I package enables compact, thermally efficient layout. |
Use Scenario: High-speed waveform capture and analysis in digital oscilloscopes and logic analyzers. IC Role / Device Role / Timing Role: Deep sample memory buffer capturing transient events at multi-GHz sampling rates. Use Value: 32-Mbit density provides >1 million samples per channel; 55 ns random access supports real-time trigger evaluation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV204816BLL-10MLI | No integrated ECC; requires external error detection logic or software correction | Suitable only where error resilience is managed at system level-not for safety-critical standalone use | Select if cost sensitivity outweighs ECC requirement and system firmware can implement Hamming code |
| MT48LC32M16A2P-6A:J | Synchronous SDRAM (not SRAM); requires clock and refresh management; no byte power-down | Higher bandwidth but higher latency and complexity-used in video pipelines, not deterministic buffers | Choose only when sustained burst throughput >200 MB/s is needed and controller supports SDRAM protocol |
Compared with IS61WV204816BLL-10MLI and MT48LC32M16A2P-6A:J, CY62177G30-55BKXI delivers deterministic 55 ns latency, hardware ECC, and zero-software-overhead power management-making it optimal for safety-aware, latency-sensitive industrial memory nodes.
Availability
CY62177G30-55BKXI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging systems, automotive ADAS sensor hubs, and test & measurement equipment requiring stable component supply across extended product lifecycles.
Supply support for CY62177G30-55BKXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.
CY62177G30-55BKXI belongs to Infineon's MoBL® (Mobile Binary Logic) SRAM product line, engineered for ultra-low-power, high-reliability memory in space- and energy-constrained embedded systems.
FAQ
Does CY62177G30-55BKXI support 1.8 V operation?
No. The device operates strictly within 2.2 V to 3.6 V. Operation below 2.2 V violates absolute maximum ratings and may cause data retention failure or ECC malfunction. For 1.8 V systems, consider Infineon's newer LPDDR or serial NOR families with compatible voltage ranges.
Can CY62177G30-55BKXI be used in 4M × 8 mode on a 2M × 16 PCB layout?
Yes, but with hardware modification: BYTE must be tied to VSS instead of VCC, pin 45 becomes A21 (requiring routing), and BHE, BLE, and I/O8–I/O14 must be left floating or disconnected. Existing traces for those signals should not be shorted or pulled.
Is there an ERR pin on CY62177G30-55BKXI?
No. The ERR output is exclusive to the CY62177GE30 variant. CY62177G30-55BKXI performs ECC correction internally but provides no external indication of error events-correction is silent and transparent to the host system.
What is the data retention capability at 85°C?
Data retention is guaranteed for ≥1 year at 85°C when VCC ≥ 1.5 V. This is validated per JEDEC JESD22-A117 and applies only during powered-down states with supply held above 1.5 V-no refresh or external bias required.
CY62177G30-55BKXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 32Mbit
- Memory Organization:
- 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (6x8)
CY62177G30-55BKXI FAQ
1.How can I place an order for CY62177G30-55BKXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62177G30-55BKXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62177G30-55BKXI reliable?
The price and inventory of CY62177G30-55BKXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62177G30-55BKXI is usually 5 days.
3.What payment methods are accepted for CY62177G30-55BKXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62177G30-55BKXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62177G30-55BKXI?
CY62177G30-55BKXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62177G30-55BKXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62177G30-55BKXI?
For technical support, including CY62177G30-55BKXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62177G30-55BKXI requirements.
6.How does Aetrix verify that CY62177G30-55BKXI is sourced from the original manufacturer or authorized distributors?
All CY62177G30-55BKXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62177G30-55BKXI meets industry standards.
7.What is the process for return or replacement of CY62177G30-55BKXI?
All CY62177G30-55BKXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62177G30-55BKXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62177G30-55BKXI part is unused and in its original packaging.
Return procedure for CY62177G30-55BKXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62177G30-55BKXI Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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