Infineon Technologies CY62177G30-55ZXI

Overview

CY62177G30-55ZXI from Infineon Technologies (formerly Cypress) is a 32-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configured as 2M × 16 or 4M × 8, operating at 55 ns access time over 2.2–3.6 V supply. It features ultra-low standby current (max 19 µA), TTL-compatible I/Os, and Byte Power-down mode for dynamic power savings. Used in industrial control modules requiring data integrity and low-power retention.

For engineers reviewing the CY62177G30-55ZXI datasheet, CY62177G30-55ZXI pinout, CY62177G30-55ZXI application, or CY62177G30-55ZXI equivalent, key selection criteria include ECC-enabled reliability, dual chip enable flexibility, TSOP I package compatibility, 55 ns timing compliance, and industrial-grade temperature support (–40°C to +85°C).

Technical Context

This SRAM integrates dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors on every read cycle without external logic. Its Byte Power-down feature activates automatically when both BHE and BLE are deasserted-enabling sub-19 µA standby regardless of CE state.

The device supports two memory configurations via BYTE pin control: 2M × 16 (BYTE = VCC) or 4M × 8 (BYTE = VSS), with A21 exposed only in the latter mode. Dual CE inputs (CE1/CE2) provide hierarchical chip select for multi-device systems, while TTL-compatible voltage thresholds ensure interoperability with legacy controllers.

Key Specifications

Pinout & Package

Package: 48-pin Thin Small Outline Package (TSOP I), RoHS-compliant, Pb-free, body size 12 mm × 20 mm × 1.2 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Compared with IS61WV204816BLL-10MLI and AS6C4008-55ZIN, CY62177G30-55ZXI uniquely delivers hardware ECC, industrial temperature support, and configurable memory width in a single 48-pin TSOP I package-reducing BOM count and validation effort for safety-aware industrial designs.

Availability

CY62177G30-55ZXI is available at Aetrix Electronics and suitable for programmable logic controllers, industrial HMI terminals, and motor drive control boards requiring stable component supply, long-term lifecycle assurance, and guaranteed ECC functionality.

Supply support for CY62177G30-55ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with strong industrial and automotive qualifications.

CY62177G30 belongs to Infineon's MoBL® (Mobile Bitline) SRAM product line, engineered for ultra-low-power, high-reliability embedded systems where data integrity and extended battery life are critical design requirements.

FAQ

Does CY62177G30-55ZXI support automatic error correction without external logic?

Yes. The device integrates dedicated ECC encoder/decoder circuitry that performs single-bit error detection and correction transparently on every read cycle. No external logic, firmware, or memory controller support is required-the corrected data appears directly on the I/O bus within the 55 ns access window.

Can CY62177G30-55ZXI operate in 4M × 8 mode on a 2M × 16 PCB layout?

No. In 4M × 8 mode, pin 45 becomes address line A21, and pins BHE, BLE, and I/O8–I/O14 are unused and must be left floating. A 2M × 16 layout lacks routing for A21 and does not isolate the unused I/O pins, risking signal contention or undefined behavior.

What is the role of the BYTE pin, and how must it be terminated?

The BYTE pin configures memory organization: tie to VCC for 2M × 16 mode (default), or to VSS for 4M × 8 mode. It must be hard-wired-not left floating-as an undefined state may cause initialization failure or inconsistent addressing behavior across power cycles.

Is the 19 µA max standby current valid across the full industrial temperature range?

Yes. The ISB2 specification (max 19 µA) is guaranteed over –40°C to +85°C at VCC = 3.6 V. This value represents the worst-case leakage under automatic Byte Power-down activation and is validated by design-not just tested at 25°C-ensuring predictable battery life in uncontrolled thermal environments.