Infineon Technologies CY62177G30-55ZXIT

Overview

CY62177G30-55ZXIT from Infineon Technologies (formerly Cypress) is a 32-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configured as 2M × 16 or 4M × 8, operating at 55 ns access time over 2.2–3.6 V supply. It features ultra-low standby current (max 19 µA), TTL-compatible I/Os, and Byte Power-down mode for dynamic power savings in battery-backed systems.

For engineers reviewing the CY62177G30-55ZXIT datasheet, CY62177G30-55ZXIT pinout, CY62177G30-55ZXIT application, or CY62177G30-55ZXIT equivalent, key selection criteria include ECC-enabled data integrity, dual chip enable flexibility, TSOP I package compatibility, and industrial-grade temperature support (–40°C to +85°C).

Technical Context

This SRAM integrates dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors on every read cycle without requiring external logic or software intervention. The Byte Power-down feature activates automatically when both BHE and BLE are deasserted, enabling sub-19 µA standby independent of CE state.

It supports two memory configurations via BYTE pin control: tying BYTE to VCC selects 2M × 16 mode (A0–A20 address space); tying BYTE to VSS enables 4M × 8 mode with A21 available on pin 45. Dual CE inputs (CE1/CE2) allow hierarchical memory mapping in multi-chip systems.

Key Specifications

Pinout & Package

Package: 48-pin TSOP I (Type I, 12 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Compared with IS61WV204816BLL-10MLI and AS6C4008-55ZIN, CY62177G30-55ZXIT delivers hardware ECC, 32-Mbit capacity, and automatic Byte Power-down - enabling higher data integrity, longer battery life, and reduced firmware complexity in safety-critical embedded systems.

Availability

CY62177G30-55ZXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical imaging cache, avionics flight data recording, and railway signaling controller applications requiring stable component supply and long-term lifecycle assurance.

Supply support for CY62177G30-55ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with strong industrial and safety-critical focus.

CY62177G30-55ZXIT belongs to Infineon's MoBL® (Mobile Binary Logic) SRAM product line, engineered for ultra-low-power, high-reliability embedded systems where data integrity and energy efficiency are co-prioritized.

FAQ

Does CY62177G30-55ZXIT support automatic error correction without external logic?

Yes. It contains fully integrated ECC encoder/decoder circuitry that performs single-bit error detection and correction transparently on every read cycle. No external logic, software routines, or additional memory cycles are required - correction occurs within the 55 ns access window and outputs corrected data directly on I/O lines.

What is the function of the BYTE pin, and how does it affect memory organization?

The BYTE pin configures memory width: tied to VCC enables 2M × 16 mode (A0–A20 used); tied to VSS enables 4M × 8 mode, repurposing pin 45 as A21 while disabling BHE, BLE, and I/O8–I/O14. This pin-strapping eliminates external address demultiplexing and simplifies PCB layout for either bus width.

Can CY62177G30-55ZXIT operate reliably at 2.2 V supply?

Yes. Its full DC and AC specifications - including 55 ns access time, 19 µA max standby current, and TTL-compatible I/O thresholds - are guaranteed across 2.2 V to 3.6 V. At 2.2 V, ICC remains ≤45 mA at f_max, and ISB2 stays ≤19 µA, making it suitable for wide-input-range industrial power supplies.

Is the 48-pin TSOP I package pin-compatible with CY62177GE30 variants?

No. CY62177G30-55ZXIT lacks the ERR pin present on CY62177GE30. In the 48-pin TSOP I package, pin 35 is NC on CY62177G30 but functions as ERR output on CY62177GE30. Board designs must route ERR separately if upgrading to GE30; G30 layouts leave pin 35 unconnected.