Infineon Technologies CY62256LL-70SNXCT
- Part No.:
- CY62256LL-70SNXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
CY62256LL-70SNXCT.pdf
- Description:
- IC SRAM 256KBIT PARALLEL 28SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,437
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Product details
Overview
CY62256LL-70SNXCT from Cypress Semiconductor is a 256K-bit (32K × 8) CMOS static RAM with 70 ns access time, 4.5–5.5 V operation, and industrial temperature range (–40°C to +85°C). It features TTL-compatible I/Os, automatic CE-controlled power-down (28 µW max standby), and three-state outputs for bus sharing-used in legacy industrial controllers, embedded instrumentation, and memory expansion modules where low-power SRAM persistence is required.
For engineers reviewing the CY62256LL-70SNXCT datasheet, CY62256LL-70SNXCT pinout, CY62256LL-70SNXCT application, or CY62256LL-70SNXCT equivalent, key selection criteria include verified 70 ns read cycle timing, 28-lead narrow SOIC package compatibility, industrial-grade thermal performance, and direct replacement feasibility in 32K × 8 memory subsystems without logic-level translation.
Technical Context
The CY62256LL-70SNXCT implements a full CMOS 512 × 512 memory array with dual decoding (row/column), sense amplifiers, and input buffers enabling deterministic 70 ns tAA and tRC timing. Its CE/OE/WE control architecture supports asynchronous read/write with strict setup/hold requirements (e.g., tSD = 25–30 ns, tHA = 0 ns).
Power management relies on automatic CE-driven transition to ultra-low-isolation mode (ISB2 ≤ 5 µA at VCC = 5.5 V), while TTL-compatible VIH/VIL thresholds (2.2 V / 0.8 V) ensure interoperability with legacy 5 V microcontrollers and address latches without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32K words × 8 bits - matches standard 8-bit data bus width without byte masking logic |
| Access Time (tAA) | 70 ns max - guarantees timing margin for 14.3 MHz bus clocking in synchronous systems |
| VCC Operating Range | 4.5 V to 5.5 V - compatible with unregulated 5 V rails and tolerates ±10% supply variation |
| Standby Current (ISB2) | 5 µA max at VCC = 5.5 V - enables >1-year battery-backed retention in low-power monitoring nodes |
| Output Drive | IOL = 2.1 mA, IOH = −1.0 mA - directly drives 74LS TTL inputs with 0.4 V VOL and 2.4 V VOH margins |
| Input Capacitance | 6 pF max - minimizes address/data bus loading for multi-device parallel memory configurations |
| Package | 28-pin narrow SOIC (450-mil width) - fits legacy PCB footprints and supports automated reflow assembly |
Pinout & Package
Package: 28-pin narrow SOIC (450-mil body width, 300-mil nominal width), RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Input | 15-bit address bus accepting 0–32767 to select one of 32K memory locations |
| I/O0–I/O7 | Bidirectional Data Bus | Three-state CMOS I/O pins shared for read data output and write data input; high-impedance when OE or CE inactive |
| CE | Chip Enable (active LOW) | Primary device select; triggers automatic 99.9% power-down when HIGH, isolating VCC current path |
| OE | Output Enable (active LOW) | Controls I/O direction: LOW enables output drivers; HIGH places pins in high-Z for bus arbitration |
| WE | Write Enable (active LOW) | Asserted with CE LOW to initiate write; deasserted to enable read; no internal latching |
| VCC | Power Supply | +4.5 V to +5.5 V supply input; decoupling capacitor required within 10 mm of pin 28 |
| GND | Ground Reference | Signal and power ground return; must be connected to system ground plane with low-inductance path |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE Power-Down | Reduces ISB2 to ≤5 µA without external control logic-eliminates need for sleep-mode firmware overhead |
| TTL-Compatible I/O | VIH = 2.2 V min, VOL = 0.4 V max ensures direct interface with 74LS/74ALS families without level translators |
| 70 ns Read Cycle (tRC) | Guaranteed timing across –40°C to +85°C enables use in fanless industrial enclosures without derating |
| Three-State Output Control | Independent OE and CE assertion allows dynamic bus sharing with multiple peripherals on same data lines |
| Low Active Power | ICC = 50 mA max at 70 ns operation-supports sustained burst reads in thermally constrained embedded systems |
Applications
| Industrial PLC Memory Buffer | Legacy Medical Instrument Data Cache |
|---|---|
Use Scenario: Stores real-time sensor acquisition buffers and configuration registers in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding I/O mapping tables during firmware updates; accessed via 8-bit ISA-style bus at ≤10 MHz. Use Value: 70 ns tAA ensures deterministic response to interrupt-driven I/O scans; 28 µW standby preserves data during brown-out events lasting minutes. |
Use Scenario: Holds waveform sample history and calibration coefficients in portable ECG analyzers with battery backup. IC Role / Device Role / Timing Role: Battery-backed SRAM retaining critical patient data during AC power loss; interfaced to MSP430 MCU via GPIO-banged control signals. Use Value: ISB2 ≤ 5 µA extends CR2032 backup life beyond 2 years; industrial temp rating supports operation inside sealed medical enclosures. |
| Automotive Diagnostic Module RAM | Test Equipment Firmware Storage |
Use Scenario: Stores OBD-II protocol translation tables and fault-code logs in vehicle diagnostic adapters operating under engine bay thermal stress. IC Role / Device Role / Timing Role: Fast-access scratchpad for CAN message parsing; selected by microcontroller's external memory interface with CE/OE strobing. Use Value: –40°C to +85°C rating meets AEC-Q100 Grade 2 requirements; 55/70 ns speed bin supports both legacy and upgraded tool firmware. |
Use Scenario: Provides nonvolatile storage for calibration constants and self-test vectors in benchtop oscilloscopes and signal generators. IC Role / Device Role / Timing Role: Static RAM mapped into FPGA's memory space for fast lookup of ADC correction coefficients during real-time acquisition. Use Value: 6 pF CIN minimizes signal integrity impact on high-speed address bus routing; narrow SOIC footprint simplifies rework on dense test PCBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32K × 8 SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C256AL-70QLI | Same 32K × 8 organization, 70 ns speed, but 2.7–5.5 V VCC range and 10 µA ISB2 (vs. 5 µA) | Supports single-supply 3.3 V systems; not qualified for industrial temp without derating | Choose for mixed-voltage designs needing wider VCC tolerance; verify thermal margin at +85°C |
| Renesas R1LV256AS-70SI | Identical 70 ns timing and 4.5–5.5 V range, but 28-pin TSOP-I package only (no SOIC option) | Requires PCB redesign for surface-mount density; lacks narrow SOIC footprint compatibility | Prefer when board space is constrained and TSOP layout already exists; avoid if SOIC footprint reuse is mandatory |
Compared with IS62C256AL-70QLI and R1LV256AS-70SI, the CY62256LL-70SNXCT uniquely combines industrial temperature qualification, narrow SOIC packaging, and sub-5 µA standby in a single 5 V-only part-making it optimal for drop-in replacement in legacy 5 V industrial hardware where footprint and thermal compliance are non-negotiable.
Availability
CY62256LL-70SNXCT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, legacy medical instrument data caches, and automotive diagnostic module RAM requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY62256LL-70SNXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
The CY62256 family was designed specifically for cost-sensitive, high-reliability 5 V embedded systems requiring pin-compatible SRAM upgrades with guaranteed industrial temperature operation and minimal board-level redesign.
FAQ
Is CY62256LL-70SNXCT compatible with 3.3 V systems?
No. The CY62256LL-70SNXCT requires 4.5–5.5 V VCC and is not 3.3 V tolerant. Its VIH minimum is 2.2 V, but internal circuitry is optimized for 5 V operation. Applying 3.3 V may result in undefined behavior, failed writes, or excessive ICC. Use ISSI IS62C256AL-70QLI for true 3.3 V compatibility.
Does this part retain data during power loss?
Yes-when VCC drops below 2.0 V while CE remains asserted HIGH, the device enters data retention mode with ICCDR ≤ 5 µA at 3.0 V. This enables battery-backed operation; however, external circuitry (e.g., diode-OR + coin cell) must maintain VCC ≥ 2.0 V during main power interruption to prevent data loss.
What is the maximum clock frequency supported for burst reads?
The CY62256LL-70SNXCT does not use a clock; it is asynchronous. Maximum effective throughput is determined by tRC = 70 ns, yielding a theoretical limit of ~14.3 million reads per second. Real-world bus arbitration, address setup, and controller overhead reduce practical rates to ≤8–10 MHz sustained.
Can OE and WE be tied together for simplified control?
No. OE controls output driver enable/disable; WE controls read/write direction. Tying them violates timing requirements: OE must go LOW before WE for valid reads, and WE must go LOW before OE for writes. Independent control is mandatory per the switching waveforms in the datasheet (Pages 5–8).
CY62256LL-70SNXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 28-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOIC
CY62256LL-70SNXCT FAQ
1.How can I place an order for CY62256LL-70SNXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62256LL-70SNXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62256LL-70SNXCT reliable?
The price and inventory of CY62256LL-70SNXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62256LL-70SNXCT is usually 5 days.
3.What payment methods are accepted for CY62256LL-70SNXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62256LL-70SNXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62256LL-70SNXCT?
CY62256LL-70SNXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62256LL-70SNXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62256LL-70SNXCT?
For technical support, including CY62256LL-70SNXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62256LL-70SNXCT requirements.
6.How does Aetrix verify that CY62256LL-70SNXCT is sourced from the original manufacturer or authorized distributors?
All CY62256LL-70SNXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62256LL-70SNXCT meets industry standards.
7.What is the process for return or replacement of CY62256LL-70SNXCT?
All CY62256LL-70SNXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY62256LL-70SNXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62256LL-70SNXCT part is unused and in its original packaging.
Return procedure for CY62256LL-70SNXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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