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Infineon Technologies CY62256LL-70SNXI
- Part No.:
- CY62256LL-70SNXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
CY62256LL-70SNXI.pdf
- Description:
- IC SRAM 256KBIT PARALLEL 28SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,481
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Product details
Overview
CY62256LL-70SNXI from Cypress Semiconductor is a 256K-bit (32K × 8) CMOS static RAM with 70 ns access time, 4.5–5.5 V operation, industrial temperature range (–40°C to +85°C), and ultra-low standby power (28 µW max). It serves as non-volatile data buffer or working memory in legacy industrial controllers, instrumentation front-ends, and embedded systems requiring deterministic timing and zero-refresh operation.
For engineers reviewing the CY62256LL-70SNXI datasheet, CY62256LL-70SNXI pinout, CY62256LL-70SNXI application, or CY62256LL-70SNXI equivalent, key selection criteria include TTL-compatible I/O drive, automatic CE-controlled power-down, three-state output enable, and narrow SOIC-28 packaging for space-constrained PCB layouts.
Technical Context
The CY62256LL-70SNXI implements a fully static 32K × 8 memory array with separate active-low chip enable (CE), output enable (OE), and write enable (WE) controls - enabling seamless memory expansion without external address latching. Its CMOS architecture delivers deterministic read/write timing with no refresh cycles required.
All address (A0–A14) and data (I/O0–I/O7) signals are TTL-compatible, and the device enters automatic power-down mode when CE is HIGH, reducing ICC to ≤0.5 µA under CMOS input conditions. Output drivers support high-impedance tri-state control via OE, allowing direct bus sharing with other peripherals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32K words × 8 bits = 256 Kbit; supports byte-wide parallel data access without multiplexing. |
| Access Time | 70 ns max; guarantees worst-case read latency for synchronous system timing budgets. |
| VCC Range | 4.5 V to 5.5 V; compatible with standard 5 V TTL logic rails and tolerant of ±10% supply variation. |
| Standby Current (ISB2) | 5 µA max at VCC = 5.5 V, TA = 85°C; enables low-power sleep modes in battery-backed systems. |
| Operating Current (ICC) | 50 mA max at fMAX = 14.3 MHz; defines peak dynamic power draw during continuous read/write cycling. |
| Input/Output Compatibility | TTL-level VIH/VIL thresholds (2.2 V / 0.8 V); ensures interoperability with legacy 5 V microcontrollers and FPGAs. |
| Package | 28-pin narrow SOIC (450-mil width, 300-mil body); surface-mount footprint with industry-standard pin pitch (1.27 mm). |
Pinout & Package
Package: 28-pin narrow SOIC (JEDEC MS-012AC), 450-mil width, 300-mil body, gull-wing leads, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Input | 15-bit address bus; selects one of 32,768 memory locations for read/write access. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit shared data path; functions as input during write, output during read, high-Z when OE or CE inactive. |
| CE | Chip Enable (active LOW) | Global select signal; disables all internal circuitry and triggers automatic power-down when HIGH. |
| OE | Output Enable (active LOW) | Controls I/O driver direction; enables output drivers only when CE is LOW and OE is LOW. |
| WE | Write Enable (active LOW) | Determines operation mode: LOW = write, HIGH = read; must be coordinated with CE and OE timing. |
| VCC | Power Supply | +5 V supply pin; decoupling capacitor required within 10 mm for stable 70 ns switching. |
| GND | Ground Reference | Signal and power return; must be connected to low-impedance ground plane to minimize noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE Power-down | Reduces ISB2 to ≤5 µA when CE is deasserted, eliminating need for external power-gating logic. |
| Three-State Output Control | OE-driven high-impedance outputs allow direct connection to shared data buses without external bus transceivers. |
| TTL-Compatible I/O | Guaranteed VIH ≥ 2.2 V and VIL ≤ 0.8 V at VCC = 4.5 V; interfaces directly with 5 V MCUs and PLDs. |
| Zero-Refresh Static Architecture | Eliminates DRAM refresh overhead and timing constraints; suitable for real-time deterministic systems. |
| Industrial Temperature Support | Rated for –40°C to +85°C operation; validated across full VCC range and AC timing specs at temperature extremes. |
Applications
| Industrial PLC I/O Module | Legacy Medical Instrumentation |
|---|---|
|
Use Scenario: Buffering sensor acquisition data in a DIN-rail mounted programmable logic controller with isolated analog inputs and RS-485 backplane. IC Role / Device Role / Timing Role: Primary working RAM for firmware execution and real-time register mapping; accessed synchronously by 8051-based controller at 14 MHz. Use Value: 70 ns access time ensures single-cycle reads/writes; low standby current extends uptime during watchdog-triggered sleep intervals. |
Use Scenario: Storing calibration coefficients and waveform buffers in portable ECG analyzers with battery backup and LCD display interface. IC Role / Device Role / Timing Role: Non-refresh volatile memory for fast-access parameter storage; retains data during brief power interruptions via supercapacitor hold-up. Use Value: 28 µW max standby power minimizes quiescent drain on coin-cell backup; narrow SOIC fits tight board area near ADC front-end. |
| Avionics Test Equipment | Point-of-Sale Terminal Controller |
|
Use Scenario: Capturing transient fault logs and configuration snapshots in airborne maintenance diagnostic units operating in extended thermal environments. IC Role / Device Role / Timing Role: Dedicated scratchpad memory for flight-critical status registers; accessed under DO-254 deterministic timing constraints. Use Value: Industrial-grade –40°C to +85°C rating ensures reliability across cabin-to-avionics bay temperature gradients; CE power-down reduces thermal load. |
Use Scenario: Supporting multi-tasking firmware in embedded POS terminals with thermal printers, barcode scanners, and secure payment modules. IC Role / Device Role / Timing Role: Shared memory resource for inter-process communication between ARM9 host and peripheral co-processor. Use Value: TTL-compatible I/O eliminates level-shifting components; three-state outputs prevent bus contention during peripheral arbitration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C256AL-70QLI | Same 32K × 8 organization and 70 ns speed, but uses 2.7–5.5 V supply and has higher ISB (10 µA max). | Broader VCC range suits mixed-voltage designs; less suitable for strict 5 V-only legacy systems. | Select if migrating to wider supply tolerance or dual-voltage boards; verify OE/WE timing compatibility. |
| ON Semiconductor MCM62C256EJ-70 | Identical pinout and 5 V operation, but rated only for commercial temperature (0°C to 70°C) and higher ICC (65 mA max). | Lacks industrial temp support; unsuitable for extended ambient or thermally unregulated enclosures. | Acceptable only for cost-sensitive commercial equipment with controlled lab environments. |
Compared with IS62C256AL-70QLI and MCM62C256EJ-70, the CY62256LL-70SNXI offers superior industrial temperature compliance, lower standby power, and tighter ICC specification - making it the preferred choice for mission-critical embedded systems where thermal resilience and power predictability are design requirements.
Availability
CY62256LL-70SNXI is available at Aetrix Electronics and suitable for industrial PLCs, medical instrumentation, avionics test gear, and point-of-sale terminals requiring stable component supply across extended product lifecycles.
Supply support for CY62256LL-70SNXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
The CY62256 family was designed specifically for legacy 5 V embedded systems needing reliable, pin-compatible SRAM replacements with guaranteed industrial temperature performance and minimal board redesign effort.
FAQ
Is CY62256LL-70SNXI compatible with older CY62256-70PC versions?
Yes - CY62256LL-70SNXI shares identical pinout, timing, and electrical specifications with CY62256-70PC, except for its industrial temperature rating (–40°C to +85°C vs. 0°C to +70°C) and lower standby current (5 µA vs. 2 mA). No PCB or firmware changes are required for drop-in replacement in thermally demanding environments.
What is the maximum clock frequency supported for burst read/write operations?
The CY62256LL-70SNXI does not use a clock; it is asynchronous. Its maximum operational frequency is determined by tRC = 70 ns, supporting up to 14.3 MHz sustained random access. For back-to-back reads, minimum cycle time is strictly governed by tRC, tACE, and tDOE parameters - no external clock signal is involved.
Can this SRAM retain data during brief power loss using a capacitor hold-up circuit?
Yes - with VCC held above 2.0 V (VDR), the device maintains data retention with ICCDR ≤ 5 µA. A 100 µF tantalum capacitor charged to 5 V can sustain VCC > 2.0 V for ~1.2 seconds under worst-case ISB2 loading, sufficient for graceful shutdown or battery switchover in most embedded applications.
Does the narrow SOIC package support reflow soldering per JEDEC J-STD-020?
Yes - the CY62256LL-70SNXI in narrow SOIC-28 (SN) package is qualified for lead-free reflow per JEDEC J-STD-020D, with peak temperature rating of 260°C for 30 seconds. Recommended profile includes ramp rate ≤3°C/s, soak at 150–200°C for 60–120 s, and time above liquidus (217°C) of 60–90 s.
CY62256LL-70SNXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 28-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOIC
CY62256LL-70SNXI FAQ
1.How can I place an order for CY62256LL-70SNXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62256LL-70SNXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62256LL-70SNXI reliable?
The price and inventory of CY62256LL-70SNXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62256LL-70SNXI is usually 5 days.
3.What payment methods are accepted for CY62256LL-70SNXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62256LL-70SNXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62256LL-70SNXI?
CY62256LL-70SNXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62256LL-70SNXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62256LL-70SNXI?
For technical support, including CY62256LL-70SNXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62256LL-70SNXI requirements.
6.How does Aetrix verify that CY62256LL-70SNXI is sourced from the original manufacturer or authorized distributors?
All CY62256LL-70SNXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62256LL-70SNXI meets industry standards.
7.What is the process for return or replacement of CY62256LL-70SNXI?
All CY62256LL-70SNXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62256LL-70SNXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62256LL-70SNXI part is unused and in its original packaging.
Return procedure for CY62256LL-70SNXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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