My Inquiry
My Account
Infineon Technologies CY62256NLL-55ZXE
- Part No.:
- CY62256NLL-55ZXE
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY62256NLL-55ZXE.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:4,993
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62256NLL-55ZXE from Infineon Technologies (formerly Cypress) is a 256-Kbit (32 K × 8) CMOS static RAM with 55 ns access time, 4.5–5.5 V operation, and industrial temperature range (–40 °C to +85 °C). It features TTL-compatible I/O, automatic CE-controlled power-down (82.5 µW max standby), and tristate outputs for memory expansion in embedded controllers and instrumentation systems.
For engineers reviewing the CY62256NLL-55ZXE datasheet, CY62256NLL-55ZXE pinout, CY62256NLL-55ZXE application, or CY62256NLL-55ZXE equivalent, key selection criteria include guaranteed 55 ns read cycle time, low 0.1 µA CMOS standby current (ISB2), dual active-low CE/OE control, and 28-pin TSOP I package compatibility with legacy board layouts.
Technical Context
The CY62256NLL-55ZXE implements a full CMOS 32K × 8 SRAM array with synchronous address decoding, sense amplifiers, and tristate I/O buffers. Its architecture supports seamless memory expansion via dedicated CE, OE, and WE control lines, enabling multi-chip configurations without external logic.
It delivers deterministic timing: tRC = 55 ns, tAA = 55 ns, tDOE = 25 ns, and tPD = 55 ns - all specified over –40 °C to +85 °C at VCC = 4.5–5.5 V. Power-down activation requires only CE ≥ VIH with CMOS-level inputs, achieving ISB2 ≤ 10 µA in industrial grade.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 256 Kbit (32 K × 8) - supports byte-wide data bus interfaces without multiplexing |
| Access time | 55 ns - enables direct interface with 12–15 MHz microcontrollers without wait states |
| Voltage range | 4.5 V to 5.5 V - compatible with standard 5 V TTL/CMOS system rails |
| Standby current | 0.1 µA typical / 10 µA max (ISB2, CMOS inputs) - enables battery-backed retention in low-power modes |
| Operating temp | –40 °C to +85 °C - qualified for industrial control, motor drives, and factory automation |
| Package | 28-pin TSOP I (0.400" wide) - surface-mount footprint with 0.050" lead pitch, JEDEC MO-141 compliant |
| Power dissipation | 275 mW max active (ICC = 50 mA @ 5.5 V) - thermally manageable on standard 4-layer PCBs |
Pinout & Package
Package: 28-pin TSOP I (Thin Small Outline Package), 0.400" body width, 0.050" lead pitch, JEDEC MO-141 compliant. Pin 1 marked by notch or dot; leads on two sides, gull-wing profile.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address input | 15-bit address bus (32 K locations); driven by MCU address lines A0–A14 |
| I/O0–I/O7 | Bidirectional data bus | 8-bit tristate I/O; functions as input during write, output during read, high-Z when deselected |
| CE | Chip enable (active LOW) | Primary chip select; enables internal circuitry and determines power-down state |
| OE | Output enable (active LOW) | Controls I/O direction: LOW → outputs enabled; HIGH → I/O tristated (input mode) |
| WE | Write enable (active LOW) | Controls R/W direction: LOW + CE LOW → write; HIGH + CE LOW → read |
| VCC | Power supply | +4.5 V to +5.5 V; decoupling capacitor required at pin 28 per layout guidelines |
| GND | Ground reference | Signal and power ground return; connected to PCB ground plane at pin 14 |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE power-down | Reduces ICC to ≤10 µA when CE is HIGH, eliminating need for external sleep control logic |
| TTL-compatible I/O | VIH = 2.2 V min, VIL = 0.8 V max - interoperable with legacy 5 V microcontrollers and FPGAs |
| Tristate output drivers | Guaranteed high-Z state (IOZ ≤ ±0.5 µA) when OE or CE is HIGH - prevents bus contention in multi-SRAM systems |
| Low capacitance I/O | CIN = 6 pF, COUT = 8 pF - minimizes signal loading and timing skew on shared data/address buses |
| Pb-free and RoHS-compliant | Meets EU Directive 2011/65/EU; available in both Pb-free and standard SnPb finish options |
Applications
| Industrial PLC I/O Modules | Automotive Engine Control Units |
|---|---|
|
Use Scenario: Buffering sensor data and actuator command history in real-time programmable logic controller modules. IC Role / Device Role / Timing Role: Byte-accessible scratchpad memory for cyclic data logging and firmware variable storage. Use Value: 55 ns access ensures deterministic response within 10 ms scan cycles; low ISB2 enables safe retention during brown-out events. |
Use Scenario: Storing runtime calibration tables and fault-code history in engine management ECUs operating under hood temperatures. IC Role / Device Role / Timing Role: Non-volatile shadow RAM for fast read/write of adaptive parameters during engine run time. Use Value: –40 °C to +85 °C rating matches AEC-Q100 Grade 2 requirements; 0.1 µA ISB2 reduces parasitic drain on vehicle battery. |
| Medical Diagnostic Equipment | Test & Measurement Instruments |
|
Use Scenario: Temporary waveform capture buffer in portable ECG and ultrasound devices requiring deterministic latency. IC Role / Device Role / Timing Role: High-speed data acquisition memory interfaced directly to ADC/DAC controllers. Use Value: 55 ns tAA and 25 ns tDOE support 12+ MSPS sampling without FIFO bottlenecks; low CIN/COUT preserves signal integrity. |
Use Scenario: Configuration storage and measurement result buffering in benchtop oscilloscopes and spectrum analyzers. IC Role / Device Role / Timing Role: Local memory for FPGA-based front-end processing and display refresh buffers. Use Value: Tristate I/O and CE/OE separation allow clean integration with Xilinx Spartan-6 or Intel MAX 10 FPGA I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C256AL-55QLI | Same 32K × 8 organization, 55 ns speed, but 2.7–5.5 V VCC range and 100 µA ISB2 (max) | Supports mixed-voltage systems (3.3 V/5 V), but higher standby current limits battery-backed use | Select when dual-voltage operation or wider VCC tolerance is required; verify OE/WE timing margins |
| ON Semiconductor MC68HC11E9CP | Not a drop-in replacement: integrated MCU with 512 B on-chip RAM; no external 256 Kbit SRAM function | Replaces discrete SRAM + controller in simple embedded systems, not memory expansion | Only consider for complete architecture redesign - not a functional substitute for CY62256NLL-55ZXE |
Compared with IS62C256AL-55QLI, CY62256NLL-55ZXE offers lower standby power (10 µA vs. 100 µA) and tighter industrial temp qualification; versus MC68HC11E9CP, it provides dedicated, expandable memory bandwidth without CPU overhead or architectural constraints.
Availability
CY62256NLL-55ZXE is available at Aetrix Electronics and suitable for industrial PLC I/O modules, automotive engine control units, and medical diagnostic equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY62256NLL-55ZXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions acquired through its 2020 acquisition of Cypress Semiconductor.
CY62256NLL-55ZXE belongs to Infineon's legacy Cypress SRAM product line, designed specifically for industrial and automotive applications demanding reliable, low-power, pin-compatible memory expansion in space-constrained 5 V systems.
FAQ
Is CY62256NLL-55ZXE pin-compatible with CY62256NLL-70ZXE?
Yes - both share identical 28-pin TSOP I pinout, address/data/control signal mapping, and DC electrical characteristics. The only difference is guaranteed access time: 55 ns vs. 70 ns. Systems designed for 55 ns will operate reliably with the -70 variant, but not vice versa in timing-critical paths.
Does CY62256NLL-55ZXE support battery backup operation?
Yes - with VCC reduced to 2.0 V (minimum data retention voltage), the device retains data while drawing ≤5 µA (ISB2 max) in CE-high power-down mode. External diode-or circuitry is required to switch between main supply and backup battery without backfeed.
What is the maximum clock frequency this SRAM can interface with?
It does not use a clock - CY62256NLL-55ZXE is asynchronous. Its 55 ns read cycle time supports direct connection to microcontrollers running up to ~12 MHz bus frequency (e.g., 8051, HC11, or early ARM7 derivatives) without wait-state insertion.
Can CY62256NLL-55ZXE be used in new designs given Cypress's integration into Infineon?
Yes - Infineon explicitly confirms continuity of ordering part numbers and technical documentation. CY62256NLL-55ZXE remains an active, supported product with published lifetime buy guidance and no announced obsolescence date as of Q2 2024.
CY62256NLL-55ZXE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY62256NLL-55ZXE FAQ
1.How can I place an order for CY62256NLL-55ZXE through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62256NLL-55ZXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62256NLL-55ZXE reliable?
The price and inventory of CY62256NLL-55ZXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62256NLL-55ZXE is usually 5 days.
3.What payment methods are accepted for CY62256NLL-55ZXE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62256NLL-55ZXE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62256NLL-55ZXE?
CY62256NLL-55ZXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62256NLL-55ZXE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62256NLL-55ZXE?
For technical support, including CY62256NLL-55ZXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62256NLL-55ZXE requirements.
6.How does Aetrix verify that CY62256NLL-55ZXE is sourced from the original manufacturer or authorized distributors?
All CY62256NLL-55ZXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62256NLL-55ZXE meets industry standards.
7.What is the process for return or replacement of CY62256NLL-55ZXE?
All CY62256NLL-55ZXE units undergo pre-shipment inspection (PSI). If there is an issue with CY62256NLL-55ZXE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62256NLL-55ZXE part is unused and in its original packaging.
Return procedure for CY62256NLL-55ZXE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62256NLL-55ZXE Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
