My Inquiry
My Account
Infineon Technologies CY62256VLL-70ZC
- Part No.:
- CY62256VLL-70ZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY62256VLL-70ZC.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:2,749
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62256VLL-70ZC from Cypress Semiconductor is a 256 Kbit (32K × 8) high-speed CMOS static RAM with 70 ns access time, TTL-compatible I/O, and automatic CE-controlled power-down. It operates across 2.7–3.6 V and supports commercial (0°C to 70°C) and industrial (–40°C to +85°C) temperature ranges. Used in embedded controllers and legacy industrial systems requiring non-volatile SRAM interface compatibility.
For engineers reviewing the CY62256VLL-70ZC datasheet, CY62256VLL-70ZC pinout, CY62256VLL-70ZC application, or CY62256VLL-70ZC equivalent, key selection criteria include guaranteed 70 ns read cycle time, ≤5 µA standby current (ISB2) at 3.6 V, Tri-state I/O control via OE/CE/WE, and narrow SOIC-28 packaging for space-constrained PCB layouts.
Technical Context
The CY62256VLL-70ZC implements a fully static 32K × 8 memory array with asynchronous parallel interface logic. Its dual active-Low enable architecture-CE for chip select and OE for output gating-enables seamless memory expansion without external address latching. Write operations are controlled exclusively by WE timing relative to CE.
Power management relies on automatic CE-driven power-down: when CE is HIGH, ICC drops to ≤5 µA (ISB2, commercial), reducing consumption by >99% versus active mode. All inputs tolerate –0.5 V to VCC + 0.5 V, and outputs drive ±2.1 mA while maintaining VOH ≥2.4 V and VOL ≤0.4 V at VCC = 2.7 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 256 Kbit (32,768 × 8 bits); supports byte-wide data bus without multiplexing. |
| Access Time (tAA) | 70 ns max; guarantees deterministic read latency under worst-case VCC = 2.7 V and TA = 70°C. |
| VCC Range | 2.7 V to 3.6 V; compatible with 3.3 V logic systems and tolerant of brown-out conditions down to 2.7 V. |
| Standby Current (ISB2) | 0.1 µA typ. / 5 µA max (commercial); enables ultra-low-power retention in battery-backed systems. |
| Operating Current (ICC) | 11 mA typ. / 30 mA max at f = 1/tRC; defines thermal budget for continuous read/write cycling. |
| Input/Output Voltage Levels | TTL-compatible: VIH ≥2.2 V, VIL ≤0.8 V; VOH ≥2.4 V @ –1 mA, VOL ≤0.4 V @ 2.1 mA. |
| Package | 28-pin narrow SOIC (ZC suffix); 300 mil body width, standard footprint for legacy PCB rework. |
Pinout & Package
Package: 28-pin narrow SOIC (300 mil), RoHS-compliant, surface-mountable with standard reflow profile.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit unidirectional address bus; selects one of 32,768 memory locations. |
| I/O0–I/O7 | Bidirectional Data Bus | Tri-state I/O lines shared for read data output and write data input; high-impedance when OE or CE is HIGH. |
| CE | Chip Enable (active LOW) | Primary device select; forces automatic power-down and disables all outputs when HIGH. |
| OE | Output Enable (active LOW) | Controls I/O direction: LOW enables output drivers; HIGH places I/O pins in high-Z input state. |
| WE | Write Enable (active LOW) | Initiates write cycle when CE is also LOW; no internal latching-timing referenced to rising edge of terminating signal. |
| VCC | Power Supply | Single 2.7–3.6 V supply; powers core logic and I/O buffers; decoupling required per datasheet layout guidelines. |
| GND | Ground Reference | Signal and power return path; must be low-inductance connection to minimize noise coupling into address/data lines. |
Key Features
| Feature | Design Value |
|---|---|
| 70 ns access time with full voltage/temperature coverage | Guaranteed tAA ≤70 ns across 2.7–3.6 V and 0°C to 70°C, enabling real-time deterministic memory access in control loops. |
| Automatic CE power-down | Reduces ICC to ≤5 µA (ISB2) without external control logic-critical for battery-backed data retention. |
| TTL-compatible interface | Eliminates level-shifting components when interfacing with legacy microcontrollers (e.g., 8051, Z80, 68K families). |
| Tri-state I/O with independent OE/CE control | Supports multi-drop bus architectures and clean memory expansion without bus contention during deselect. |
| CMOS process with low dynamic power | Optimizes speed/power trade-off: 30 mA max ICC at 70 ns vs. typical 11 mA, minimizing thermal load in dense layouts. |
Applications
| Industrial PLC Memory Buffer | Medical Device Data Logger |
|---|---|
|
Use Scenario: Stores real-time sensor readings and configuration parameters in programmable logic controllers with no refresh overhead. IC Role / Device Role / Timing Role: Asynchronous parallel SRAM providing zero-wait-state access for microcontroller firmware executing cyclic scan logic. Use Value: 70 ns tAA ensures sub-100 ns memory response within tight 1 ms PLC scan cycles; ISB2 ≤5 µA extends backup battery life beyond 10 years. |
Use Scenario: Captures ECG waveform samples and patient metadata in portable diagnostic equipment during power-loss events. IC Role / Device Role / Timing Role: Non-refreshing data buffer retaining critical diagnostics when main power fails and backup capacitor sustains VCC ≥2.7 V. Use Value: Data retention at VCC = 1.4 V with ICCDR ≤3 µA enables reliable storage during brown-out; narrow SOIC fits compact handheld form factor. |
| Legacy Avionics Interface Module | Automotive Body Control Unit |
|
Use Scenario: Interfaces MIL-STD-1553B host processors with discrete I/O peripherals using standardized 8-bit parallel handshake protocol. IC Role / Device Role / Timing Role: Static RAM acting as command/response FIFO between flight computer and actuator driver ASICs. Use Value: TTL-compatible I/O eliminates level translators; tHZOE ≤25 ns ensures fast bus release for deterministic multi-master arbitration. |
Use Scenario: Holds door lock status, window position, and lighting configuration in BCM modules operating across –40°C to +125°C ambient. IC Role / Device Role / Timing Role: Industrial-grade SRAM supporting extended temperature operation with guaranteed ISB2 ≤10 µA at +85°C. Use Value: Dual temp range qualification (–40°C to +85°C) and robust ESD tolerance (>2001 V) meet automotive EMC requirements without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C256AL-70QLI | Same 32K × 8 organization, 70 ns speed, but uses 2.7–5.5 V supply and has higher ISB2 (10 µA max). | Broader VCC range suits mixed-voltage designs; higher standby current limits battery-backed runtime. | Select if system requires 5 V tolerance and can accommodate 2× standby leakage. |
| ON Semiconductor MC68HC11E9CP | Not a drop-in replacement: integrated MCU with on-chip 512 B RAM; no external parallel interface. | Replaces discrete SRAM only in new designs where firmware consolidation justifies architectural change. | Choose only for greenfield projects migrating from external memory to SoC-based control. |
Compared with IS62C256AL-70QLI, CY62256VLL-70ZC offers lower standby current and tighter 2.7–3.6 V regulation-ideal for 3.3 V-only systems. Unlike MC68HC11E9CP, it preserves hardware modularity and avoids firmware re-architecture.
Availability
CY62256VLL-70ZC is available at Aetrix Electronics and suitable for industrial PLCs, medical data loggers, legacy avionics interfaces, and automotive body control units requiring stable component supply and long-term obsolescence support.
Supply support for CY62256VLL-70ZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
The CY62256V series was designed specifically for cost-sensitive, high-reliability embedded systems needing pin-compatible SRAM upgrades to replace aging 28-pin NMOS or HMOS memories in legacy designs.
FAQ
Is CY62256VLL-70ZC compatible with 5 V TTL systems?
No. CY62256VLL-70ZC operates strictly at 2.7–3.6 V and is not 5 V tolerant. Its inputs accept VIH ≥2.2 V and VIL ≤0.8 V, matching 3.3 V LVTTL levels-not 5 V TTL. Direct connection to 5 V buses risks overvoltage damage unless level translation is used.
What is the minimum VCC required to retain data?
Data retention is guaranteed down to VDR = 1.4 V, with ICCDR ≤3 µA (commercial) at that voltage. This allows use with supercapacitor or lithium coin-cell backup circuits sustaining VCC ≥1.4 V during main power loss.
Does CY62256VLL-70ZC require an external clock or refresh circuitry?
No. It is a fully static CMOS SRAM with no clock input and zero refresh requirement. Data remains valid indefinitely as long as VCC stays within specification and CE remains HIGH during retention mode.
Can OE and CE both be tied LOW permanently for simplified interface?
Yes, but only if the system does not share the data bus with other devices. Tying OE and CE LOW continuously enables read/write operations without external control logic, though it disables automatic power-down and increases standby current from µA to mA range.
CY62256VLL-70ZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY62256VLL-70ZC FAQ
1.How can I place an order for CY62256VLL-70ZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62256VLL-70ZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62256VLL-70ZC reliable?
The price and inventory of CY62256VLL-70ZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62256VLL-70ZC is usually 5 days.
3.What payment methods are accepted for CY62256VLL-70ZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62256VLL-70ZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62256VLL-70ZC?
CY62256VLL-70ZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62256VLL-70ZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62256VLL-70ZC?
For technical support, including CY62256VLL-70ZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62256VLL-70ZC requirements.
6.How does Aetrix verify that CY62256VLL-70ZC is sourced from the original manufacturer or authorized distributors?
All CY62256VLL-70ZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62256VLL-70ZC meets industry standards.
7.What is the process for return or replacement of CY62256VLL-70ZC?
All CY62256VLL-70ZC units undergo pre-shipment inspection (PSI). If there is an issue with CY62256VLL-70ZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62256VLL-70ZC part is unused and in its original packaging.
Return procedure for CY62256VLL-70ZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62256VLL-70ZC Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
