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Infineon Technologies CY62256VLL-70ZXC
- Part No.:
- CY62256VLL-70ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY62256VLL-70ZXC.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:1,876
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Product details
Overview
CY62256VLL-70ZXC from Cypress Semiconductor is a 256 Kbit (32K × 8) CMOS static RAM with 70 ns access time, operating across 2.7–3.6 V supply and supporting commercial/industrial temperature ranges (0°C to +85°C). It features active-low CE/OE/WE controls, TTL-compatible I/Os, automatic power-down (<5 µA standby), and is packaged in Pb-free 28-pin narrow SOIC. Used in embedded controllers requiring non-volatile SRAM buffering with fast read/write cycles.
For engineers reviewing the CY62256VLL-70ZXC datasheet, CY62256VLL-70ZXC pinout, CY62256VLL-70ZXC application, or CY62256VLL-70ZXC equivalent, key selection criteria include 70 ns tAA timing, 32K × 8 organization, CE/OE/WE control logic, low-voltage operation (2.7–3.6 V), and industrial-grade thermal performance up to +85°C.
Technical Context
The CY62256VLL-70ZXC implements a fully static 32K × 8 memory array with dual-decode architecture (row/column), tri-state I/O drivers, and automatic CE-controlled power-down mode reducing ICC to ≤5 µA. Its control interface uses asynchronous active-low CE, OE, and WE signals with defined setup/hold and transition timing (e.g., tSD = 30 ns, tHZOE = 25 ns).
It supports three distinct operational modes: read (CE & OE LOW, WE HIGH), write (CE & WE LOW), and standby (CE HIGH), with output impedance controlled by OE state and data retention guaranteed down to VCC = 1.4 V. Input leakage remains ≤±1 µA over full temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 256 Kbit organized as 32,768 × 8 - supports byte-wide data bus interfacing without external demultiplexing |
| Access Time (tAA) | 70 ns max - enables direct connection to microcontrollers with ≤14 MHz bus clocks without wait states |
| VCC Range | 2.7 V to 3.6 V - compatible with 3.3 V systems and tolerant of rail droop during transient load |
| Standby Current (ISB2) | 0.1 µA typ. / 5 µA max at +70°C - allows battery-backed operation for >10 years on coin cell |
| Operating Temperature | 0°C to +85°C - qualified for industrial control panels and factory automation hardware |
| Output Drive | IOH = −1.0 mA / IOL = 2.1 mA at VCC = 2.7 V - sufficient to drive 10 TTL loads or 20 CMOS inputs |
| Input Leakage | ±1 µA max - ensures reliable address/data sampling under ESD-prone board conditions |
Pinout & Package
Package: 28-pin narrow SOIC (0.300" width), RoHS-compliant, Pb-free, JEDEC MS-012AC compliant.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus accepting 0x0000–0x7FFF; no internal latching - requires stable address during CE assertion |
| I/O0–I/O7 | Bidirectional Data Bus | Tri-state CMOS I/Os; direction controlled by OE/WE states - eliminates need for external transceivers |
| CE | Chip Enable (active LOW) | Primary device select; enables automatic power-down when HIGH - critical for multi-SRAM bank management |
| OE | Output Enable (active LOW) | Controls I/O driver enable; HIGH places pins in high-Z - allows shared bus arbitration with other peripherals |
| WE | Write Enable (active LOW) | Determines R/W mode when CE is active; LOW initiates write, HIGH enables read - supports asynchronous burst writes |
| VCC | Power Supply | 2.7–3.6 V core supply; decoupling capacitor required within 10 mm of Pin 28 per layout guidelines |
| GND | Ground Reference | Single ground plane connection point; must be tied directly to system ground with low-inductance path |
Key Features
| Feature | Design Value |
|---|---|
| 70 ns access time with 3.3 V supply | Enables zero-wait-state interfacing with ARM7/ARM9 and legacy 8051-based controllers |
| Automatic CE-controlled power-down | Reduces ICC from 30 mA active to ≤5 µA standby - cuts system-level quiescent power by >99% |
| TTL-compatible input thresholds | VIH = 2.2 V min / VIL = 0.8 V max - interoperable with 5 V logic families using level-shifting resistors only |
| Low-voltage operation (2.7–3.6 V) | Supports direct integration into battery-powered IoT edge nodes without LDO overhead |
| Data retention at 1.4 V | Maintains stored contents during brown-out events lasting seconds - simplifies backup power design |
Applications
| Industrial PLC I/O Buffering | Medical Device Data Logging |
|---|---|
|
Use Scenario: Real-time acquisition of analog sensor readings (e.g., ECG, SpO₂) sampled at 1 kHz and buffered before SD card write. IC Role / Device Role / Timing Role: High-speed, low-power SRAM acting as first-stage FIFO buffer between ADC controller and host processor. Use Value: 70 ns tAA ensures sub-microsecond write latency; 5 µA ISB2 extends battery life in portable monitors beyond 72 hours. |
Use Scenario: Temporary storage of diagnostic imaging metadata and calibration coefficients during power-up sequence. IC Role / Device Role / Timing Role: Non-volatile configuration memory holding boot parameters and sensor calibration tables. Use Value: Data retention at 1.4 V guarantees parameter integrity during cold-start voltage ramp; 32K × 8 capacity holds >200 unique calibration sets. |
| Automotive Body Control Module | Networked Building Controller |
|
Use Scenario: Storing door lock status, window position, and mirror angle settings across ignition cycles. IC Role / Device Role / Timing Role: Persistent RAM node in CAN-connected BCM, updated via SPI-to-SRAM bridge IC. Use Value: Industrial temp rating (−40°C to +85°C) ensures reliability in engine bay proximity; CE-driven power-down minimizes parasitic drain. |
Use Scenario: Caching occupancy sensor fusion outputs and HVAC setpoint history for predictive control algorithms. IC Role / Device Role / Timing Role: Local SRAM cache co-located with MCU to reduce Ethernet stack latency during real-time scheduling. Use Value: Tri-state I/Os allow dynamic bus sharing with RS-485 transceivers; 28-pin SOIC fits compact DIN-rail mount PCB layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV2568BLL-70NLI | Same 32K × 8 organization, 70 ns speed, but rated –40°C to +85°C only; ISB2 = 10 µA max | Lacks automotive qualification; not validated for >85°C ambient use | Preferred for cost-sensitive industrial designs where extended temperature margin is unnecessary |
| ON Semiconductor MC68HC11E9CP | Integrated MCU with 512 B on-chip RAM - no external SRAM interface; lacks 32K × 8 capacity | Not a drop-in replacement; requires firmware and PCB redesign | Only viable if migrating from discrete SRAM to integrated solution with tight BOM constraints |
Compared with IS62WV2568BLL-70NLI, CY62256VLL-70ZXC offers lower standby current and broader temperature support; versus MC68HC11E9CP, it provides scalable external memory without compromising MCU choice or real-time determinism.
Availability
CY62256VLL-70ZXC is available at Aetrix Electronics and suitable for industrial PLC I/O buffering, medical device data logging, and automotive body control modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY62256VLL-70ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications infrastructure markets.
The CY62256V series targets cost-sensitive, low-power embedded systems needing fast, pin-compatible SRAM with robust industrial qualification and long-term supply assurance.
FAQ
What is the minimum VCC required to retain data in CY62256VLL-70ZXC?
Data retention is guaranteed down to VCC = 1.4 V, as specified in the Data Retention Characteristics table (Page 4). At this voltage, ICCDR remains ≤3 µA in commercial grade, enabling operation during brown-out conditions without data loss. The device enters retention mode automatically when CE is deasserted and VCC drops below normal operating range.
Can CY62256VLL-70ZXC interface directly with a 5 V microcontroller?
Yes - its TTL-compatible inputs accept VIH ≥ 2.2 V and VIL ≤ 0.8 V, allowing safe connection to 5 V logic outputs without level shifters. However, outputs are limited to VCC (max 3.6 V), so external clamping or resistor dividers are required if driving 5 V inputs to avoid overstress.
Does CY62256VLL-70ZXC require an external clock signal?
No - it is a fully static RAM with no clock input. All operations are controlled asynchronously by CE, OE, and WE signal edges. Address and data setup/hold times (e.g., tSA = 0 ns, tHD = 0 ns) are referenced to these control transitions, not a clock domain.
What package variants are offered for CY62256VLL-70ZXC?
The "ZXC" suffix denotes the Pb-free 28-pin narrow SOIC package (JEDEC MS-012AC, 0.300" width). Other variants include TSOP-I (CY62256VLL-70SXI) and reverse TSOP-I (CY62256VLL-70SXI), but ZXC is the only SOIC option and is footprint-compatible with legacy CY62256N devices.
CY62256VLL-70ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY62256VLL-70ZXC FAQ
1.How can I place an order for CY62256VLL-70ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62256VLL-70ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62256VLL-70ZXC reliable?
The price and inventory of CY62256VLL-70ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62256VLL-70ZXC is usually 5 days.
3.What payment methods are accepted for CY62256VLL-70ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62256VLL-70ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62256VLL-70ZXC?
CY62256VLL-70ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62256VLL-70ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62256VLL-70ZXC?
For technical support, including CY62256VLL-70ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62256VLL-70ZXC requirements.
6.How does Aetrix verify that CY62256VLL-70ZXC is sourced from the original manufacturer or authorized distributors?
All CY62256VLL-70ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62256VLL-70ZXC meets industry standards.
7.What is the process for return or replacement of CY62256VLL-70ZXC?
All CY62256VLL-70ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY62256VLL-70ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62256VLL-70ZXC part is unused and in its original packaging.
Return procedure for CY62256VLL-70ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62256VLL-70ZXC Tags
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M24C02-WMN6TP
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