Infineon Technologies CY62256VNLL-70SNXC
- Part No.:
- CY62256VNLL-70SNXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
CY62256VNLL-70SNXC.pdf
- Description:
- IC SRAM 256KBIT PARALLEL 28SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,222
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62256VNLL-70SNXC from Cypress Semiconductor is a 256 Kbit (32K × 8) low-voltage CMOS static RAM with 70 ns access time, operating across 2.7–3.6 V and supporting commercial temperature range (0°C to +70°C). It features active-low CE/OE/WE controls, tristate I/Os, automatic power-down (<5 µA standby), and TTL-compatible signaling - deployed in embedded controllers, industrial HMIs, and legacy microprocessor systems requiring nonvolatile SRAM backup.
For engineers reviewing the CY62256VNLL-70SNXC datasheet, CY62256VNLL-70SNXC pinout, CY62256VNLL-70SNXC application, or CY62256VNLL-70SNXC equivalent, key selection criteria include 28-pin narrow SOIC package compatibility, 70 ns read/write timing compliance, low-voltage 2.7–3.6 V operation, and automatic CE-controlled power-down behavior for battery-backed memory subsystems.
Technical Context
The CY62256VNLL-70SNXC implements a fully static 32K × 8 memory array with asynchronous parallel interface logic. Its address decoding uses 15-bit addressing (A0–A14), and data I/O lines (I/O0–I/O7) operate bidirectionally under control of CE, OE, and WE signals - all active-low with defined setup/hold and propagation delays.
Power management relies on CE-driven automatic power-down mode, reducing ICC to ≤5 µA (typical) when CE is HIGH. The device supports three distinct operational states: write (CE & WE LOW), read (CE & OE LOW, WE HIGH), and high-impedance standby (CE HIGH or OE HIGH), with guaranteed tHZOE ≤25 ns and tHZCE ≤25 ns for fast bus release.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 256 Kbit (32,768 × 8 bits) - supports byte-wide data buses without external multiplexing. |
| Access Time | 70 ns - meets timing requirements for 14 MHz Z80, 80C51, and 68000-based systems with no wait states. |
| VCC Range | 2.7 V to 3.6 V - compatible with 3.3 V logic domains and mixed-voltage board designs. |
| Standby Current | ≤5 µA (typical) at VCC = 3.6 V - enables >1-year battery life in SRAM + coin-cell retention configurations. |
| Operating Temp | 0°C to +70°C - qualified for commercial-grade industrial control panels and test equipment. |
| Package | 28-pin narrow SOIC (300-mil) - surface-mount compatible with standard reflow profiles and IPC-7351B land patterns. |
| tHZOE / tHZCE | ≤25 ns - ensures rapid bus release for multi-drop memory arbitration and shared-data-bus architectures. |
Pinout & Package
Package: 28-pin narrow SOIC (300-mil), RoHS-compliant, body width 7.62 mm, lead pitch 1.27 mm.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1–10, 21, 23–26 | A0–A14 | 15-bit address inputs - fully decode 32K locations; no internal latching required. |
| 11–13, 15–19 | I/O0–I/O7 | Bidirectional data bus - tristated when OE HIGH or CE HIGH; no external transceivers needed. |
| 27 | WE | Write Enable - LOW initiates write; HIGH enables read; controls direction of I/O pins during access. |
| 20 | CE | Chip Enable - LOW selects device; HIGH forces automatic power-down and high-impedance I/Os. |
| 22 | OE | Output Enable - LOW enables output drivers; HIGH disables outputs and allows input data capture. |
| 14 | GND | Signal ground reference - must be connected to system ground plane with low-inductance path. |
| 28 | VCC | Power supply - requires local 100 nF ceramic decoupling capacitor within 5 mm of pin. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE Power-Down | Reduces ICC to ≤5 µA (typ) when CE is HIGH - eliminates need for external power-gating circuitry. |
| TTL-Compatible I/O Levels | VIH = 2.2 V min, VOL = 0.4 V max at 2.1 mA - interoperable with 5 V-tolerant 3.3 V microcontrollers. |
| Tristate Output Control | Independent OE and CE control enables flexible bus sharing - no contention during multi-SRAM arbitration. |
| Low-Voltage Operation | Functional down to 2.7 V - supports brown-out tolerant systems and battery-powered memory retention. |
| 70 ns Read/Write Timing | tAA = tWC = 70 ns - satisfies cycle timing for legacy 8/16-bit CPUs without wait-state insertion. |
Applications
| Industrial HMI Memory Buffer | Legacy Microcontroller Data RAM |
|---|---|
Use Scenario: Touchscreen-based PLC operator interface storing real-time process variables and alarm logs. IC Role / Device Role / Timing Role: Byte-accessible SRAM buffer between ARM9 host and display controller; accessed via 8-bit parallel bus at ≤10 MHz. Use Value: 70 ns access enables zero-wait-state reads/writes; 5 µA standby extends backup battery life beyond 18 months. |
Use Scenario: External RAM expansion for 8051-based motor drive firmware with dynamic variable storage. IC Role / Device Role / Timing Role: Asynchronous parallel memory mapped at 0x8000–0xFFFF; controlled by MOVX instructions with external RD/WR strobes. Use Value: CE/OE/WE logic matches 8051 timing envelopes; 2.7–3.6 V range aligns with 3.3 V system rail and LDO tolerance. |
| Test Equipment Configuration Storage | Embedded Data Logger Buffer |
Use Scenario: Calibration parameter storage in handheld multimeters and oscilloscope probes. IC Role / Device Role / Timing Role: Nonvolatile SRAM paired with DS1302 RTC and lithium coin cell; retains settings during main power loss. Use Value: VDR = 1.4 V minimum enables reliable retention at 2.0 V backup voltage; ISB2 ≤5 µA minimizes cell drain. |
Use Scenario: High-speed sensor data buffering in environmental monitoring nodes sampling at 1 kHz. IC Role / Device Role / Timing Role: Circular buffer for ADC samples before SPI flash write; accessed via DMA with burst enable. Use Value: Tristate I/Os prevent bus contention during DMA transfers; tLZOE ≤5 ns ensures clean signal handoff to peripheral controller. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV2568BLL-70NLI | Same 32K × 8 organization, 70 ns speed, but rated –40°C to +85°C industrial temp; higher ISB2 (15 µA typ). | Preferred for extended-temperature industrial deployments where ambient exceeds 70°C. | Select if thermal margin >70°C is required; verify PCB layout accommodates same 28-pin SOIC footprint. |
| ON Semiconductor MCM62C256B-70 | Discontinued; last-time-buy availability only; identical pinout and AC specs but higher ICC (35 mA max vs. 30 mA). | Suitable only for legacy BOM refresh with existing design validation; no new design recommendation. | Use only for direct replacement in field-repair scenarios; confirm supply chain continuity before procurement. |
Compared with IS62WV2568BLL-70NLI and MCM62C256B-70, the CY62256VNLL-70SNXC offers lower standby current (5 µA vs. 15 µA/-) and guaranteed commercial-temp qualification - making it optimal for cost-sensitive, battery-constrained, and thermally benign embedded systems.
Availability
CY62256VNLL-70SNXC is available at Aetrix Electronics and suitable for industrial HMI systems, legacy microcontroller upgrades, and portable test equipment requiring stable component supply, long-lifecycle support, and RoHS-compliant narrow SOIC packaging.
Supply support for CY62256VNLL-70SNXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and embedded markets.
The CY62256VN series targets cost-effective, low-power parallel SRAM replacement in legacy and upgrade designs - emphasizing pin compatibility, wide voltage operation, and minimal external support circuitry.
FAQ
Is CY62256VNLL-70SNXC compatible with 5 V logic systems?
No - it is strictly a 2.7–3.6 V device. Inputs tolerate up to VCC + 0.3 V (max 3.9 V), and VIH minimum is 2.2 V. Direct interfacing with 5 V microcontrollers requires level-shifting or 5 V-tolerant I/O buffers; it is not 5 V input-tolerant by default.
Does this SRAM retain data when VCC drops below 2.7 V?
Yes - data retention is guaranteed down to VDR = 1.4 V, provided CE remains HIGH and VIN stays within safe limits. At 1.4 V, ISB2 remains ≤5 µA (typ), enabling multi-year retention with coin-cell backup, though full functionality resumes only above 2.7 V.
What is the maximum clock frequency supported for read/write cycles?
The device has no internal clock - it is asynchronous. Maximum effective throughput is determined by tRC = 70 ns, yielding up to ~14.3 MHz sustained random access. Burst or sequential access may achieve higher average bandwidth depending on address transition timing and bus protocol.
Can CE and OE both be tied LOW permanently for simplified interface?
Yes - tying CE and OE LOW enables continuous read mode (with WE HIGH) or write mode (with WE LOW), eliminating external control logic. However, this disables automatic power-down and increases ICC to 11–30 mA; use only in mains-powered systems with adequate thermal design.
CY62256VNLL-70SNXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 28-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOIC
CY62256VNLL-70SNXC FAQ
1.How can I place an order for CY62256VNLL-70SNXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62256VNLL-70SNXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62256VNLL-70SNXC reliable?
The price and inventory of CY62256VNLL-70SNXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62256VNLL-70SNXC is usually 5 days.
3.What payment methods are accepted for CY62256VNLL-70SNXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62256VNLL-70SNXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62256VNLL-70SNXC?
CY62256VNLL-70SNXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62256VNLL-70SNXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62256VNLL-70SNXC?
For technical support, including CY62256VNLL-70SNXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62256VNLL-70SNXC requirements.
6.How does Aetrix verify that CY62256VNLL-70SNXC is sourced from the original manufacturer or authorized distributors?
All CY62256VNLL-70SNXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62256VNLL-70SNXC meets industry standards.
7.What is the process for return or replacement of CY62256VNLL-70SNXC?
All CY62256VNLL-70SNXC units undergo pre-shipment inspection (PSI). If there is an issue with CY62256VNLL-70SNXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62256VNLL-70SNXC part is unused and in its original packaging.
Return procedure for CY62256VNLL-70SNXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62256VNLL-70SNXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

