My Inquiry
My Account
Infineon Technologies CY62256VNLL-70ZRXET
- Part No.:
- CY62256VNLL-70ZRXET
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY62256VNLL-70ZRXET.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:1,686
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62256VNLL-70ZRXET from Cypress Semiconductor is a 256K-bit (32K × 8) low-voltage CMOS static RAM with 70 ns access time, operating from 2.7V to 3.6V, featuring TTL-compatible I/O, automatic CE-controlled power-down (<5 µA standby for commercial grade), and tristate outputs. It serves as main or buffer memory in embedded controllers, industrial HMIs, and legacy data acquisition systems requiring nonvolatile backup support.
For engineers reviewing the CY62256VNLL-70ZRXET datasheet, CY62256VNLL-70ZRXET pinout, CY62256VNLL-70ZRXET application, or CY62256VNLL-70ZRXET equivalent, key selection criteria include its 28-pin narrow SOIC package, -40°C to +85°C industrial temperature rating (per ZRXET suffix), 30 mA typical active ICC, and compatibility with 3.3V-only or mixed 3.3V/5V interface designs via level-shifting.
Technical Context
The CY62256VNLL-70ZRXET implements a full CMOS 32K × 8 SRAM array with independent address decoding, tristate bidirectional I/O drivers, and dual-control write enable (WE) and chip enable (CE) logic. Its automatic power-down mode activates when CE is HIGH, reducing ISB2 to 10 µA at VCC = 3.6V under industrial conditions.
Timing is defined by overlapping CE and WE control signals: read operations require CE and OE LOW with WE HIGH; writes require CE and WE both LOW. Address setup (tAW = 60 ns) and data hold (tHD = 0 ns) are optimized for synchronous bus interfacing with microcontrollers such as ARM7TDMI or 8051 derivatives.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 256 Kbit (32K × 8) - supports byte-wide data buses without external multiplexing |
| Access Time | 70 ns - enables direct interface with 14 MHz system clocks or slower microcontroller buses |
| VCC Range | 2.7V to 3.6V - compatible with 3.3V LDO-regulated supplies; no 5V tolerance |
| Standby Current (ISB2) | 10 µA (industrial temp) - allows battery-backed operation for >1 year on coin cell |
| Active Current (ICC) | 30 mA typical at VCC = 3.6V - fits within 100 mA rail budget of compact industrial PCBs |
| Input/Output Voltage Levels | TTL-compatible VIH = 2.2V, VIL = 0.8V - interoperable with legacy 5V logic using pull-up resistors or simple translators |
| Data Retention Voltage | 1.4V minimum - sustains memory state during brown-out or controlled power-down sequences |
Pinout & Package
Package: 28-pin narrow SOIC (300-mil width), RoHS-compliant, surface-mountable with standard reflow profile.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus supporting full 32K-word addressing; no internal multiplexing required |
| I/O0–I/O7 | Bidirectional Data Bus | Tristate-enabled I/O lines; direction controlled by OE and WE states - eliminates need for external transceivers |
| CE | Chip Enable (active LOW) | Primary device select; triggers automatic power-down when deasserted - critical for multi-chip memory banks |
| OE | Output Enable (active LOW) | Controls output driver enable; HIGH places I/O pins in high-impedance - enables shared bus arbitration |
| WE | Write Enable (active LOW) | Controls R/W direction; LOW with CE LOW initiates write - supports asynchronous CPU write strobes |
| VCC | Power Supply | Single 2.7–3.6V supply; decoupling capacitor (100 nF) required adjacent to Pin 28 |
| GND | Ground Reference | Common return for all signals; must be connected to low-impedance ground plane per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE Power-Down | Reduces ISB2 to 10 µA (industrial) - extends battery life in portable instrumentation without firmware intervention |
| Tristate I/O with OE Control | Eliminates need for external bus transceivers in multi-peripheral systems - simplifies BOM and routing |
| 70 ns Access Time at 3.3V | Meets timing margins for 14 MHz bus interfaces - avoids wait-state insertion in Cortex-M3/M4 MCU designs |
| 2.7–3.6V Operation | Direct compatibility with modern 3.3V LDOs (e.g., TPS73633) - removes need for voltage translation circuitry |
| Industrial Temperature Range | Rated –40°C to +85°C (ZRXET suffix) - qualified for use in factory automation PLC modules and motor drives |
Applications
| Industrial HMI Memory Buffer | Legacy Data Logger RAM |
|---|---|
|
Use Scenario: Stores real-time sensor readings and UI state in panel-mounted HMIs with ARM9-based controllers. IC Role / Device Role / Timing Role: Byte-accessible scratchpad memory interfaced directly to 8-bit data bus; operates at 70 ns to match controller's EBI timing. Use Value: Enables deterministic response under interrupt-driven sampling (≤100 µs latency) while maintaining <10 µA sleep current during display idle periods. |
Use Scenario: Holds uncommitted measurement records in battery-powered environmental loggers deployed outdoors for 6+ months. IC Role / Device Role / Timing Role: Primary volatile storage with data retention down to 1.4V - paired with supercapacitor backup. Use Value: Guarantees data integrity during grid outages; 10 µA ISB2 at –40°C ensures >18-month backup runtime on 0.22F/5.5V supercap. |
| Automated Test Equipment (ATE) FIFO | Medical Device Parameter Cache |
|
Use Scenario: Buffers high-speed analog capture data between ADC and FPGA in benchtop ATE systems. IC Role / Device Role / Timing Role: Synchronous write buffer synchronized to 10 MHz sample clock; CE toggled per burst frame. Use Value: Absorbs jitter in FPGA-to-memory handshaking; 70 ns tAA prevents pipeline stalls during 10 MS/s streaming. |
Use Scenario: Caches calibration coefficients and patient-specific settings in portable ultrasound probes. IC Role / Device Role / Timing Role: Nonvolatile-configurable RAM accessed during probe warm-up; retains values across hot-swap cycles. Use Value: Supports FDA-required configuration persistence without EEPROM wear-out; 30 mA ICC stays within probe's 500 mW thermal envelope. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C256AL-70QLI | Same 32K × 8 organization, 70 ns speed, but 4.5–5.5V only; higher ISB (100 µA) | Requires 5V supply rail; not suitable for 3.3V-only systems | Select only if existing 5V infrastructure prohibits redesign; verify board-level voltage margin for VIH/VIL |
| ON Semiconductor MCM62C256EJ-70 | Discontinued; last-time-buy availability; identical pinout but higher ICC (35 mA typ) and no automotive qualification | Lacks industrial temp validation; no long-term supply assurance | Acceptable for legacy repair only; not recommended for new designs due to obsolescence risk and thermal derating gap |
Compared with IS62C256AL-70QLI and MCM62C256EJ-70, the CY62256VNLL-70ZRXET provides verified 3.3V operation, lower standby power, and guaranteed industrial temperature support - making it the sole viable option for new 3.3V embedded designs requiring long-term component continuity.
Availability
CY62256VNLL-70ZRXET is available at Aetrix Electronics and suitable for industrial HMIs, battery-powered data loggers, and automated test equipment requiring stable component supply, extended temperature operation, and RoHS-compliant packaging.
Supply support for CY62256VNLL-70ZRXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable logic solutions for industrial, automotive, and consumer markets.
The CY62256VN series was designed specifically for low-power, high-reliability SRAM applications in space-constrained embedded systems where 3.3V compatibility and industrial temperature resilience are mandatory.
FAQ
What is the maximum clock frequency supported by CY62256VNLL-70ZRXET?
The CY62256VNLL-70ZRXET does not use a clock signal; it is an asynchronous SRAM. Its 70 ns access time supports reliable operation with microcontrollers or FPGAs running bus cycles up to ~14 MHz (tRC = 70 ns). Timing compliance depends on proper setup/hold margins for CE, OE, WE, and address signals-not clock frequency.
Can CY62256VNLL-70ZRXET interface directly with a 5V microcontroller?
No - its inputs are TTL-compatible but not 5V-tolerant. VIH max is VCC + 0.3V (≤3.9V), and absolute maximum input voltage is VCC + 0.5V. Direct connection to 5V logic risks damage. Use resistor-divider networks or single-supply level translators like TXB0108 for safe interfacing.
Does CY62256VNLL-70ZRXET support battery backup operation?
Yes - it retains data down to VCC = 1.4V (VDR) with ISB2 ≤10 µA at –40°C to +85°C. When paired with a supercapacitor or lithium coin cell and a diode-OR power path, it maintains memory contents during main supply loss without external controllers.
Is the ZRXET suffix indicative of lead-free packaging?
Yes - the "Z" denotes RoHS-compliant, lead-free termination; "R" indicates tape-and-reel packaging; "XET" specifies industrial temperature range (–40°C to +85°C) and narrow SOIC package. This matches Cypress' standard suffix coding per Document #001-06512 Rev. *B.
CY62256VNLL-70ZRXET Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY62256VNLL-70ZRXET FAQ
1.How can I place an order for CY62256VNLL-70ZRXET through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62256VNLL-70ZRXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62256VNLL-70ZRXET reliable?
The price and inventory of CY62256VNLL-70ZRXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62256VNLL-70ZRXET is usually 5 days.
3.What payment methods are accepted for CY62256VNLL-70ZRXET?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62256VNLL-70ZRXET transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62256VNLL-70ZRXET?
CY62256VNLL-70ZRXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62256VNLL-70ZRXET order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62256VNLL-70ZRXET?
For technical support, including CY62256VNLL-70ZRXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62256VNLL-70ZRXET requirements.
6.How does Aetrix verify that CY62256VNLL-70ZRXET is sourced from the original manufacturer or authorized distributors?
All CY62256VNLL-70ZRXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62256VNLL-70ZRXET meets industry standards.
7.What is the process for return or replacement of CY62256VNLL-70ZRXET?
All CY62256VNLL-70ZRXET units undergo pre-shipment inspection (PSI). If there is an issue with CY62256VNLL-70ZRXET, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62256VNLL-70ZRXET part is unused and in its original packaging.
Return procedure for CY62256VNLL-70ZRXET:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62256VNLL-70ZRXET Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
