My Inquiry
My Account
Infineon Technologies CY62256VNLL-70ZXET
- Part No.:
- CY62256VNLL-70ZXET
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY62256VNLL-70ZXET.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:4,594
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62256VNLL-70ZXET from Cypress Semiconductor is a 256 Kbit (32K × 8) low-voltage CMOS static RAM with 70 ns access time, operating from 2.7 V to 3.6 V, featuring TTL-compatible I/O, automatic CE-controlled power-down (ISB2 ≤ 5 μA at commercial temp), and tristate outputs enabled by OE/WE control. It serves as main or buffer memory in industrial controllers, automotive infotainment head units, and legacy embedded systems requiring non-volatile backup compatibility.
For engineers reviewing the CY62256VNLL-70ZXET datasheet, CY62256VNLL-70ZXET pinout, CY62256VNLL-70ZXET application, or CY62256VNLL-70ZXET equivalent, key selection criteria include its 28-pin narrow SOIC package, -40°C to +85°C industrial temperature grade, 30 mA typical active ICC, 70 ns tAA timing, and CE/OE/WE three-control interface for deterministic read/write sequencing.
Technical Context
The CY62256VNLL-70ZXET implements a fully static 32K × 8 memory array with asynchronous parallel interface, using CMOS technology for optimal speed-power trade-off. Its architecture includes dual-level decoding (row/column), sense amplifiers, input buffers, and automatic power-down logic triggered solely by CE HIGH state.
All control signals-CE, OE, and WE-are active-low and independently functional: CE enables chip select, OE controls output driver enablement, and WE determines data direction on I/O pins. The device supports easy memory expansion via CE daisy-chaining and maintains high-impedance I/O states when deselected or during write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 256 Kbit (32,768 × 8 bits); supports byte-wide data bus without external multiplexing. |
| Access Time (tAA) | 70 ns max at VCC = 2.7–3.6 V; ensures compatibility with 14 MHz bus clocks in legacy microcontroller systems. |
| VCC Range | 2.7 V to 3.6 V; enables direct interfacing with 3.3 V logic families and battery-backed operation down to 2.7 V. |
| Standby Current (ISB2) | 0.1 μA typ / 5 μA max (Commercial); <10 μA max (Industrial); enables ultra-low-power retention in sleep modes. |
| Operating Current (ICC) | 11 mA min / 30 mA max at VCC = 3.6 V; defines thermal budget for dense PCB layouts in fanless enclosures. |
| Input/Output Voltage Levels | VIH = 2.2 V min, VIL = 0.8 V max; guarantees robust noise margin against 3.3 V TTL and CMOS drivers. |
| Package | 28-pin narrow SOIC (300-mil); compatible with standard wave-solder and reflow profiles; footprint matches industry-standard SRAM replacements. |
Pinout & Package
Package: 28-pin narrow SOIC (300-mil), JEDEC MS-012AC compliant, body width 7.62 mm, lead pitch 1.27 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Input | 15-bit address bus; selects one of 32,768 memory locations; no internal latching - requires stable address during CE LOW. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tristatable I/O lines; driven by internal sense amps during read, accept data during write; high-impedance when CE or OE HIGH. |
| CE | Chip Enable (active-low) | Primary selection signal; asserts internal power-up and enables address decoding; triggers automatic ISB2 power-down when deasserted. |
| OE | Output Enable (active-low) | Controls output driver state only; does not affect power mode; allows read operations while CE remains asserted. |
| WE | Write Enable (active-low) | Determines data flow direction: WE LOW + CE LOW = write; WE HIGH + CE LOW + OE LOW = read. |
| VCC | Power Supply | Single 2.7–3.6 V supply; no separate I/O or core voltage rails; simplifies power design. |
| GND | Ground Reference | Common return path for all signals and power; requires low-inductance connection to minimize switching noise. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE Power-Down | Reduces ICC to ≤5 μA (Commercial) or ≤10 μA (Industrial) when CE is HIGH - eliminates need for external power-gating logic. |
| TTL-Compatible I/O | Accepts 3.3 V TTL input thresholds and drives 3.3 V CMOS loads directly - avoids level-shifter components in mixed-voltage systems. |
| Tristate Output Control | Independent OE and WE control enables concurrent bus sharing with multiple peripherals without external bus transceivers. |
| Low-Voltage Operation | Guaranteed functionality down to 2.7 V - supports brown-out resilience and battery-backed operation in automotive and portable applications. |
| Multiple Temperature Grades | Industrial (-40°C to +85°C) version validated per AEC-Q100 stress tests - suitable for under-hood and factory automation environments. |
Applications
| Industrial PLC Memory Buffer | Automotive Instrument Cluster Display Cache |
|---|---|
|
Use Scenario: Stores real-time sensor fusion results and UI frame buffers in programmable logic controller backplanes with limited board space and no DRAM controller. IC Role / Device Role / Timing Role: Asynchronous byte-access SRAM providing deterministic 70 ns read latency for ARM Cortex-M4-based motion control firmware. Use Value: Eliminates wait-state insertion in tight servo-loop timing; 30 mA ICC supports continuous operation within 1 W thermal envelope. |
Use Scenario: Caches rendered gauge graphics and CAN message history in digital instrument clusters where EEPROM write endurance is insufficient. IC Role / Device Role / Timing Role: Non-volatile-battery-backed SRAM acting as fast-access display memory, synchronized to SPI-driven TFT controller refresh cycles. Use Value: Enables flicker-free analog needle animation at 60 Hz using 8-bit parallel interface; ISB2 ≤10 μA extends backup battery life beyond 10 years. |
| Legacy Medical Device Data Logger | Avionics Flight Data Recorder Buffer |
|
Use Scenario: Captures ECG waveform samples at 1 kHz in Class II medical equipment certified to IEC 60601-1, requiring guaranteed data integrity across power cycles. IC Role / Device Role / Timing Role: Primary volatile storage for pre-processed biosignal data before CRC-verified transfer to flash; operates at 3.3 V ±5%. Use Value: 70 ns tAA meets worst-case interrupt latency requirements; 2.7 V minimum VCC ensures operation during AC/DC converter brownouts. |
Use Scenario: Buffers ARINC 429 bus messages in DO-160G-compliant flight recorders where radiation tolerance and thermal stability are mandatory. IC Role / Device Role / Timing Role: Radiation-hardened-by-process SRAM used as first-stage FIFO between serial receiver and compression ASIC; rated for -40°C to +85°C. Use Value: Industrial-grade thermal spec and 26.94 °C/W ΘJC ensure junction temperature stays below 105°C at 50°C ambient - critical for DO-178B certification evidence. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV2568BLL-70NLI | Same 32K × 8 organization, 70 ns access, 2.7–3.6 V, but uses 28-pin TSOP-I package (not SOIC); ISB2 = 15 μA max (Industrial). | Requires PCB redesign for TSOP footprint; higher standby current limits use in ultra-low-power battery systems. | Select if board layout accommodates TSOP and volume pricing favors ISSI's supply chain. |
| ON Semiconductor MCM62C256CJ-15 | 5V-only (4.5–5.5 V), 150 ns access, 28-pin SOIC; no low-voltage or sub-μA standby capability. | Not drop-in compatible due to voltage and timing mismatch; requires level-shifting and clock stretching. | Consider only for legacy 5 V system refurbishment where 5 V rails are fixed and timing slack exists. |
Compared with IS62WV2568BLL-70NLI and MCM62C256CJ-15, the CY62256VNLL-70ZXET uniquely delivers industrial-temperature 70 ns performance in a pin-compatible narrow SOIC package with sub-10 μA standby - making it the sole option for space-constrained, low-power, 3.3 V embedded designs requiring proven automotive qualification.
Availability
CY62256VNLL-70ZXET is available at Aetrix Electronics and suitable for industrial PLC memory buffers, automotive instrument cluster display caches, and legacy medical device data loggers requiring stable component supply across extended product lifecycles.
Supply support for CY62256VNLL-70ZXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and aerospace applications, with emphasis on long-lifecycle support and AEC-Q100 qualification.
The CY62256VN series was developed specifically for cost-sensitive, space-constrained embedded systems needing reliable, low-power, parallel-interface SRAM - targeting replacement of aging 5 V devices while maintaining backward-compatible footprints and timing.
FAQ
Is CY62256VNLL-70ZXET pin-compatible with the original CY62256-70PC?
Yes - both use identical 28-pin narrow SOIC (300-mil) packaging and share identical pinout, address/data/control signal mapping, and electrical timing specifications. The "VN" suffix denotes low-voltage operation (2.7–3.6 V), while "PC" was 5 V; voltage domain change requires verification of surrounding logic levels but no PCB modification.
Does CY62256VNLL-70ZXET support battery backup operation?
Yes - it retains data at VCC ≥ 1.4 V with ICCDR ≤ 3 μA (Commercial) or ≤ 6 μA (Industrial), enabling direct connection to coin-cell batteries via diode-OR or dedicated backup regulators. Data retention time exceeds 10 years under typical conditions with proper decoupling.
What is the maximum sustained write cycle rate for CY62256VNLL-70ZXET?
The minimum write cycle time (tWC) is 70 ns, supporting up to 14.3 million writes per second in burst mode. However, sustained operation requires thermal management: at 30 mA ICC and 68.45 °C/W ΘJA, junction temperature rise is ~20°C above ambient - limiting continuous write duty cycle to ≤60% at 70°C ambient without forced cooling.
Can OE and WE be tied together for simplified control?
No - OE and WE serve independent functions: OE controls output driver enablement (read vs. high-Z), while WE controls data direction (write vs. read). Tying them disables simultaneous read-modify-write operations and violates timing constraints in Figures 3–7; Cypress explicitly requires separate routing per datasheet Figure 5 and Table 1.
CY62256VNLL-70ZXET Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY62256VNLL-70ZXET FAQ
1.How can I place an order for CY62256VNLL-70ZXET through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62256VNLL-70ZXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62256VNLL-70ZXET reliable?
The price and inventory of CY62256VNLL-70ZXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62256VNLL-70ZXET is usually 5 days.
3.What payment methods are accepted for CY62256VNLL-70ZXET?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62256VNLL-70ZXET transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62256VNLL-70ZXET?
CY62256VNLL-70ZXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62256VNLL-70ZXET order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62256VNLL-70ZXET?
For technical support, including CY62256VNLL-70ZXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62256VNLL-70ZXET requirements.
6.How does Aetrix verify that CY62256VNLL-70ZXET is sourced from the original manufacturer or authorized distributors?
All CY62256VNLL-70ZXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62256VNLL-70ZXET meets industry standards.
7.What is the process for return or replacement of CY62256VNLL-70ZXET?
All CY62256VNLL-70ZXET units undergo pre-shipment inspection (PSI). If there is an issue with CY62256VNLL-70ZXET, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62256VNLL-70ZXET part is unused and in its original packaging.
Return procedure for CY62256VNLL-70ZXET:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62256VNLL-70ZXET Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
