Infineon Technologies CY6264-55SNXIT
- Part No.:
- CY6264-55SNXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
CY6264-55SNXIT.pdf
- Description:
- IC SRAM 64KBIT PARALLEL 28SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:3,821
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY6264-55SNXIT from Cypress Semiconductor is an 8K × 8 CMOS static RAM organized as 8192 words by 8 bits, featuring 55 ns access time, TTL-compatible I/O, and dual chip enable (CE1 active LOW, CE2 active HIGH) for flexible memory expansion in embedded controllers and industrial data loggers.
For engineers reviewing the CY6264-55SNXIT datasheet, CY6264-55SNXIT pinout, CY6264-55SNXIT application, or CY6264-55SNXIT equivalent, key selection criteria include automatic CE1 power-down current (15 mA max commercial), SOIC-28 package compatibility, read/write timing margins under 55 ns, and industrial-grade voltage tolerance (5 V ±10%).
Technical Context
The CY6264-55SNXIT implements a fully static 8K × 8 memory array with three-state bidirectional I/O drivers, row/column decoding, and sense amplifiers. Its dual CE architecture enables hierarchical memory mapping without external logic, while CE1-driven automatic power-down reduces standby current to 15 mA at VCC = 5 V.
Read operations require CE1 = LOW, CE2 = HIGH, OE = LOW, and WE = HIGH; write operations require CE1 = LOW, CE2 = HIGH, and WE = LOW. Address setup/hold and data setup/hold times are zero for writes, simplifying timing-critical control interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 8192 × 8 bits - supports byte-wide data bus interfacing without bit-slicing logic |
| Access Time (tAA) | 55 ns max - meets timing requirements for 12 MHz Z80 or 8051-based systems with no wait states |
| VCC Operating Range | 5 V ±10% - compatible with standard TTL/CMOS logic rails and legacy industrial power supplies |
| Standby Current (ISB2) | 15 mA max (commercial) - enables low-power sleep modes in battery-backed data acquisition nodes |
| Input/Output Voltage Levels | VIH ≥ 2.2 V, VOL ≤ 0.4 V - ensures robust noise margin against 0.8 V logic thresholds and 400 mV ground bounce |
| Package Type | 28-pin SOIC (300-mil body, SN28) - surface-mount compatible with standard reflow profiles and IPC-7351B land patterns |
Pinout & Package
Package: 28-pin narrow-body SOIC (SN28), 300-mil width, JEDEC MS-012AC compliant, lead-free (RoHS-compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Inputs | 13-bit address bus supporting full 8K-word addressing; A0 is LSB, A12 is MSB |
| I/O0–I/O7 | Bidirectional Data Bus | Three-state CMOS I/O pins shared for read and write; high-impedance when deselected or OE inactive |
| CE1 | Active-LOW Chip Enable | Primary selection signal; enables automatic power-down when HIGH (reducing ICC by >70%) |
| CE2 | Active-HIGH Chip Enable | Secondary enable for multi-chip decode; must be HIGH during valid read/write cycles |
| OE | Active-LOW Output Enable | Controls output driver state independently of CE; allows data latching without deselecting chip |
| WE | Active-LOW Write Enable | Directly controls write operation; LOW initiates write, HIGH enables read or high-Z state |
| VCC, GND | Power Supply | Single 5 V supply; decoupling required within 10 mm of pins 14 (VCC) and 15 (GND) |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable Architecture | CE1 (active LOW) + CE2 (active HIGH) enables hierarchical memory banking and eliminates need for external address decoder logic |
| Automatic Power-Down | CE1 HIGH reduces ICC to ≤15 mA (commercial) without requiring external control signals or sleep mode firmware |
| TTL-Compatible I/O | VIH min = 2.2 V, VOL max = 0.4 V - interoperable with legacy 5 V microcontrollers and FPGAs without level shifters |
| Zero Hold Time Requirements | tHA = 0 ns, tHD = 0 ns - simplifies timing closure in FPGA-based memory controllers and eliminates hold-time violation risks |
Applications
| Industrial PLC Data Buffer | Legacy Microcontroller Memory Expansion |
|---|---|
Use Scenario: Storing real-time sensor history and configuration registers in DIN-rail mounted programmable logic controllers operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Nonvolatile SRAM buffer interfaced directly to 80C51 derivatives via parallel bus; provides deterministic 55 ns read latency for cyclic scan execution. Use Value: Eliminates external wait-state generators and supports hot-swappable I/O module firmware updates without memory corruption. | Use Scenario: Adding external RAM to Z80-based medical diagnostic instruments where board space limits use of larger packages. IC Role / Device Role / Timing Role: Byte-addressable scratchpad memory mapped into I/O space; synchronized to CPU clock using CE2 gating for cycle-stretching. Use Value: Enables 64 KB address space extension using only two address lines (A13/A14) for bank switching, reducing PCB layer count. |
| Automotive ECU Bootloader Cache | Point-of-Sale Terminal Transaction Log |
Use Scenario: Caching firmware update payloads during over-the-air (OTA) reprogramming in engine control units with ISO 16750-2 electrical compliance. IC Role / Device Role / Timing Role: Temporary storage for decrypted binary segments prior to flash programming; accessed via DMA with burst reads. Use Value: Reduces OTA update time by 38% versus serial EEPROM due to 55 ns random access and concurrent address/data bus operation. | Use Scenario: Maintaining atomic transaction logs in retail terminals powered by intermittent AC adapters and backup capacitors. IC Role / Device Role / Timing Role: Battery-backed SRAM holding last 200 sales records; retains data for >72 hours during main power loss. Use Value: Guarantees ACID-compliant logging without supercapacitor charging circuitry or complex wear-leveling firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS62C256AL-55QLI | 32K × 8 organization, 55 ns access, 28-pin SOIC, but lacks CE2 input and uses single CE | Requires external address decoding for memory banking; not drop-in for CY6264's dual-CE layout | Select when higher density is needed and board redesign accommodates simplified CE logic |
| AS6C4008-55PCN | 512K × 8, 55 ns, 32-pin SOP; higher VCC range (4.5–5.5 V), lower ISB (5 µA) | Pinout incompatible; requires PCB revision and new footprint; superior standby efficiency but larger package | Choose for ultra-low-power battery-operated devices where memory size and leakage dominate over layout reuse |
Compared with IS62C256AL-55QLI and AS6C4008-55PCN, the CY6264-55SNXIT uniquely balances 8K density, dual-CE expandability, and SOIC-28 footprint-making it optimal for legacy system upgrades where pin compatibility and minimal BOM change are critical.
Availability
CY6264-55SNXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, legacy microcontroller memory expansion, and automotive ECU bootloader caching requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY6264-55SNXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable logic solutions for industrial, automotive, and communications infrastructure markets.
The CY6264 belongs to Cypress's legacy parallel SRAM product line, engineered specifically for pin-compatible replacement of obsolete HM6264 and MK6264 devices in cost-sensitive, long-lifecycle embedded systems.
FAQ
Is CY6264-55SNXIT RoHS-compliant and lead-free?
Yes. The "X" suffix in CY6264-55SNXIT explicitly denotes lead-free (Pb-free) construction per JEDEC J-STD-609A, with matte tin plating and halogen-free molding compound. It meets RoHS Directive 2011/65/EU Annex II maximum concentration values for all six restricted substances.
Can CY6264-55SNXIT operate reliably at 4.5 V VCC?
No. The device is specified only for 5 V ±10% (4.5–5.5 V) in industrial grade, but the CY6264-55SNXIT variant is commercial-grade (0°C to +70°C) and guaranteed only down to 4.75 V. At 4.5 V, tAA may exceed 55 ns and ISB may rise unpredictably; use CY6264-55SNI for full 4.5 V operation.
What is the function of the NC pin on CY6264-55SNXIT?
Pin 16 is marked "NC" (No Connect) in the official pinout diagram and must remain unconnected. It corresponds to an internal test structure not bonded out; routing traces or applying voltage to this pin violates Cypress's reliability guidelines and may cause latent parametric shifts or accelerated wear-out.
Does CY6264-55SNXIT support asynchronous burst reads?
No. The CY6264-55SNXIT is a purely asynchronous static RAM with no internal address counter or burst logic. Sequential reads require external address incrementing on A0–A12; each access is independent and incurs full 55 ns tAA delay regardless of address adjacency.
CY6264-55SNXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 28-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 64Kbit
- Memory Organization:
- 8K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOIC
CY6264-55SNXIT FAQ
1.How can I place an order for CY6264-55SNXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY6264-55SNXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY6264-55SNXIT reliable?
The price and inventory of CY6264-55SNXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY6264-55SNXIT is usually 5 days.
3.What payment methods are accepted for CY6264-55SNXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY6264-55SNXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY6264-55SNXIT?
CY6264-55SNXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY6264-55SNXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY6264-55SNXIT?
For technical support, including CY6264-55SNXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY6264-55SNXIT requirements.
6.How does Aetrix verify that CY6264-55SNXIT is sourced from the original manufacturer or authorized distributors?
All CY6264-55SNXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY6264-55SNXIT meets industry standards.
7.What is the process for return or replacement of CY6264-55SNXIT?
All CY6264-55SNXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY6264-55SNXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY6264-55SNXIT part is unused and in its original packaging.
Return procedure for CY6264-55SNXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY6264-55SNXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

