Infineon Technologies CY6264-70SNXC
- Part No.:
- CY6264-70SNXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
CY6264-70SNXC.pdf
- Description:
- IC SRAM 64KBIT PARALLEL 28SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY6264-70SNXC from Cypress Semiconductor is an 8K × 8 (64 Kbit) CMOS static RAM with 70 ns access time, TTL-compatible I/O, and dual chip enable (CE1 active-low, CE2 active-high) for flexible memory expansion in embedded systems. It operates at 5V ±10%, supports commercial temperature range (0°C to +70°C), and features automatic power-down via CE1, reducing standby current to 15 mA.
For engineers reviewing the CY6264-70SNXC datasheet, CY6264-70SNXC pinout, CY6264-70SNXC application, or CY6264-70SNXC equivalent, key selection criteria include access timing consistency across address transitions, three-state I/O control under OE/WE/CE coordination, low-power deselected operation, and Pb-free SOIC-28 packaging for legacy industrial PCB compatibility.
Technical Context
The CY6264-70SNXC implements a 256 × 32 × 8 memory array with separate row/column decoding, sense amplifiers, and input/output buffers. Its read cycle is controlled by coordinated CE1 (active-low), CE2 (active-high), and OE (active-low) signals, while write operations require CE1 low, CE2 high, and WE low - enabling precise bus arbitration in multi-chip memory systems.
Power management relies on CE1-driven automatic power-down: when CE1 is high, ICC drops to ≤15 mA (commercial), independent of OE or WE state. The device uses a die coat for alpha particle immunity and meets MIL-STD-883 Class 1A ESD rating (>2001 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 8192 words × 8 bits (64 Kbit); enables byte-wide data bus interfacing without external demultiplexing |
| Access Time | 70 ns max; guarantees valid data on I/O pins within 70 ns after address stabilization and CE1/OE assertion |
| VCC Supply | 5.0 V ±10%; compatible with standard TTL logic rails and legacy 5V microcontroller buses |
| Standby Current | 15 mA max (ISB2, commercial); achieved when CE1 > VCC – 0.3 V, enabling low-power hold mode during CPU wait states |
| Operating Temperature | 0°C to +70°C; validated for commercial-grade instrumentation, POS terminals, and industrial HMI panels |
| Package | 28-pin SOIC (300-mil body, SN28); RoHS-compliant Pb-free lead finish per ordering suffix "X" |
| Input/Output Voltage | VIH = 2.2 V min, VIL = 0.8 V max; ensures reliable logic-level recognition across voltage drift and noise margins |
Pinout & Package
Package: 28-pin Small Outline Integrated Circuit (SOIC), 300-mil body width, surface-mount, Pb-free finish (SN28 footprint).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Inputs | 13-bit address bus (8192 locations); A0 LSB, A12 MSB; latched internally on CE1/CE2/OE transition |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit TTL-compatible I/O; high-impedance when CE1 high, OE high, or WE low during write setup |
| CE1 | Active-Low Chip Enable | Primary selection signal; drives automatic power-down when high, overriding OE/WE state |
| CE2 | Active-High Chip Enable | Secondary enable for hierarchical memory decoding; must be high for any read/write operation |
| OE | Active-Low Output Enable | Controls output buffer enable only; no effect on power state; data appears only when CE1 low and CE2 high |
| WE | Active-Low Write Enable | Gates write cycles; low with CE1 low and CE2 high initiates data latch into addressed location |
| VCC | Power Supply | +5 V supply pin (Pin 28); decoupling required within 10 mm due to 70 ns switching transients |
| GND | Ground Reference | Signal and power ground (Pin 14); must be low-inductance connection to minimize read/write timing jitter |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable Logic | CE1 (active-low) + CE2 (active-high) allows cascaded memory banks using simple NAND/NOR gating without address decoding overhead |
| Automatic Power-Down | Reduces ISB to 15 mA (commercial) when CE1 inactive - cuts system standby power by >70% vs. non-power-down SRAMs |
| TTL-Compatible I/O | Meets VIH/VIL and VOH/VOL specs at 5V, eliminating level-shifter requirements in 8051, Z80, or 68K-based designs |
| Alpha Particle Immunity | Die coat layer prevents single-event upsets in medical or aerospace-adjacent environments where radiation tolerance is critical |
Applications
| Industrial PLC Data Buffers | Legacy Microcontroller Systems |
|---|---|
Use Scenario: Storing real-time I/O status and configuration registers in programmable logic controllers with 8-bit data buses. IC Role / Device Role / Timing Role: Non-volatile data buffer holding scan-cycle variables; accessed synchronously with 70 ns deterministic latency. Use Value: Eliminates need for external wait-state generation due to guaranteed 70 ns tAA, simplifying timing design for 8 MHz 8051 derivatives. | Use Scenario: Serving as main program/data RAM in retro-computing restoration projects using Z80 or 6502 CPUs. IC Role / Device Role / Timing Role: Byte-addressable working memory mapped at fixed 0x0000–0x1FFF; selected via discrete gate logic driving CE1/CE2. Use Value: Pb-free SOIC-28 footprint matches original board layouts while meeting modern compliance without redesign. |
| Point-of-Sale Terminal Memory | Medical Diagnostic Equipment Cache |
Use Scenario: Holding transaction logs and display frame buffers in thermal receipt printers with intermittent power cycling. IC Role / Device Role / Timing Role: Fast-access scratchpad memory; powered continuously but placed in CE1-driven power-down between print jobs. Use Value: 15 mA ISB2 enables battery-backed operation for >48 hours during AC outage without compromising read speed on wake-up. | Use Scenario: Caching waveform acquisition data in portable ultrasound units before transfer to flash storage. IC Role / Device Role / Timing Role: High-reliability intermediate buffer; leverages die coat for immunity against EMI-induced bit flips during RF transmission. Use Value: Meets IEC 60601-1 ESD immunity requirements without additional shielding, reducing BOM count and board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C256AL-70QLI | 256K × 8 organization, 70 ns, 5V, SOIC-28; higher density but same pinout and timing | Requires address line remapping (A13–A15 unused); not drop-in for 8K systems | Select only if future memory expansion headroom is needed and PCB layout permits A13+ NC handling |
| ON Semiconductor MCM6264B-70 | Same 8K × 8, 70 ns, 5V, SOIC-28; identical pinout and truth table, but lacks die coat and has 25 mA ISB | No alpha immunity; higher standby current increases thermal load in sealed enclosures | Prefer for cost-sensitive, non-critical applications where radiation tolerance is not required |
Compared with IS62C256AL-70QLI and MCM6264B-70, the CY6264-70SNXC uniquely delivers verified alpha immunity and lowest standby current (15 mA) in its class - making it optimal for sealed, long-life, or safety-critical commercial systems where reliability outweighs density.
Availability
CY6264-70SNXC is available at Aetrix Electronics and suitable for industrial PLC data buffers, legacy microcontroller systems, and point-of-sale terminal memory requiring stable component supply and RoHS-compliant Pb-free packaging.
Supply support for CY6264-70SNXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, PSoC, and USB solutions for embedded systems.
The CY6264 belongs to Cypress's legacy parallel SRAM product line, designed specifically for 5V bus-compatible, low-latency, high-reliability memory in industrial control, medical, and communications equipment.
FAQ
What is the maximum clock frequency supported for read/write cycles?
The CY6264-70SNXC does not use a clock; it is asynchronous. Maximum effective bus frequency depends on cycle timing: read cycle time (tRC) is 70 ns, enabling up to ~14.3 MHz sustained random access. Write cycle time (tWC) is 70 ns, with minimum WE pulse width (tPWE) of 40 ns. Timing must comply with all AC parameters in the datasheet, especially tSCE1 and tSD.
Can CE1 and CE2 be tied together for simplified decoding?
No - CE1 is active-low and CE2 is active-high; tying them directly creates a logical conflict. To simplify decoding, use an inverter on one signal or drive CE2 via a NAND gate output referenced to CE1. The dual-enable architecture is intended for hierarchical addressing, not redundancy.
Is the CY6264-70SNXC functionally compatible with the CY6264-70SC?
Yes - both share identical electrical specifications, pinout, and timing. The only differences are package dimensions (300-mil SOIC vs. 330-mil SOIC) and Pb-free finish (SNXC vs. SC). Footprint compatibility requires verification of pad layout: SN28 (300-mil) has narrower body and tighter pin pitch than S28.33.
Does this SRAM retain data during VCC brown-out conditions?
Data retention is guaranteed only down to VCC = 2.0 V per datasheet limits. Below that, data may be lost. For brown-out resilience, external circuitry (e.g., reset supervisor with VCC monitoring and hold-off) is required to assert CE1 high before VCC drops below 2.0 V, placing the device in low-power hold mode with retained contents.
CY6264-70SNXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 28-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 64Kbit
- Memory Organization:
- 8K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOIC
CY6264-70SNXC FAQ
1.How can I place an order for CY6264-70SNXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY6264-70SNXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY6264-70SNXC reliable?
The price and inventory of CY6264-70SNXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY6264-70SNXC is usually 5 days.
3.What payment methods are accepted for CY6264-70SNXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY6264-70SNXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY6264-70SNXC?
CY6264-70SNXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY6264-70SNXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY6264-70SNXC?
For technical support, including CY6264-70SNXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY6264-70SNXC requirements.
6.How does Aetrix verify that CY6264-70SNXC is sourced from the original manufacturer or authorized distributors?
All CY6264-70SNXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY6264-70SNXC meets industry standards.
7.What is the process for return or replacement of CY6264-70SNXC?
All CY6264-70SNXC units undergo pre-shipment inspection (PSI). If there is an issue with CY6264-70SNXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY6264-70SNXC part is unused and in its original packaging.
Return procedure for CY6264-70SNXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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