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Texas Instruments CY74FCT162827ETPAC
- Part No.:
- CY74FCT162827ETPAC
- Manufacturer:
- Texas Instruments
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
CY74FCT162827ETPAC.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 56TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,291
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Product details
Overview
CY74FCT162827ETPAC from Texas Instruments is a 20-bit non-inverting three-state buffer/line driver with balanced 24 mA output drivers, Ioff partial-power-down support, and edge-rate control for reduced switching noise. It operates at 5V ±10% over −40°C to +85°C and is optimized for driving transmission lines in high-speed digital systems.
For engineers reviewing the CY74FCT162827ETPAC datasheet, CY74FCT162827ETPAC pinout, CY74FCT162827ETPAC application, or CY74FCT162827ETPAC equivalent, key selection criteria include its 24 mA balanced drive strength, <0.6 V typical ground bounce (VOLP), 4.2 ns max propagation delay (CL = 50 pF), Ioff-enabled power-down isolation, and TSSOP-56 package compatibility with dense PCB layouts.
Technical Context
The CY74FCT162827ETPAC implements dual 10-bit buffers with independent NANDed output-enable pairs (OE1/OE2 per group), enabling flexible bus segmentation. Its output drivers integrate current-limiting resistors to minimize undershoot and eliminate need for external termination on controlled-impedance traces.
Designed for industrial backplane and memory interface applications, it features Ioff circuitry that disables outputs and blocks reverse current when VCC = 0 V, and edge-rate control that suppresses simultaneous switching noise-critical for signal integrity in multi-bit parallel buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Supply | 5 V ±10% - compatible with standard TTL/CMOS logic rails and eliminates need for level-shifting in 5V systems |
| Output Drive | ±24 mA - balanced sourcing/sinking enables clean signal edges on 50 Ω transmission lines without external resistors |
| Propagation Delay | 4.2 ns max (CL = 50 pF) - supports >200 MHz data rates in point-to-point or stubbed bus topologies |
| Ground Bounce (VOLP) | <0.6 V typical at VCC = 5 V, TA = 25°C - ensures reliable low-level signaling under heavy capacitive loading |
| Ioff Support | Active at VCC = 0 V - prevents backflow current during hot-swap or partial system power-down |
| Operating Temp | −40°C to +85°C - qualified for industrial environments including factory automation and telecom infrastructure |
| ESD Rating | >2000 V HBM - provides robust handling margin during board assembly and field service |
Pinout & Package
Package: 56-pin TSSOP (DGG), 1.2 mm max height, 0.5 mm pitch, 13.9 × 7.9 mm body size - suitable for automated SMT placement and high-density routing with exposed thermal pad not required.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, ..., 10 12, 13, ..., 21 23, 24, ..., 33 35, 36, ..., 45 47, 48, ..., 56 | Data Inputs (A1–A20) | 20 dedicated CMOS/TTL-compatible inputs accepting 0.8 V / 2.0 V thresholds; grouped as two 10-bit banks |
| 11, 22, 34, 46 | Output Enable (OE1, OE2 per bank) | Active-low enables for each 10-bit section; NANDed logic allows OR-style enable control per group |
| 14–20, 24–30, 36–42, 48–54 | Three-State Outputs (Y1–Y20) | 20 high-drive, edge-controlled outputs with Ioff protection; high-impedance state active when OE = HIGH |
| 55, 56, 13, 21, 33, 45 | GND | Multiple ground pins distributed across package to reduce ground bounce and improve noise immunity |
| 27, 39, 51 | VCC | Three dedicated 5V supply pins placed to minimize IR drop and decoupling loop inductance |
Key Features
| Feature | Design Value |
|---|---|
| Balanced ±24 mA outputs | Enables matched rise/fall times on transmission lines, reducing jitter and EMI in DDR or address/data buses |
| Integrated current-limiting resistors | Eliminates need for 20 discrete series termination resistors, saving board area and BOM cost |
| Ioff partial-power-down | Allows safe insertion/removal in live backplanes without disrupting adjacent powered sections |
| Edge-rate control | Reduces di/dt-induced crosstalk and ground bounce by limiting slew rate without compromising speed |
| Low VOLP (<0.6 V) | Maintains valid LOW logic margin even under worst-case simultaneous switching of all 20 outputs |
Applications
| Memory Interface Buffering | Industrial Backplane Driver |
|---|---|
Use Scenario: Driving 20-bit address/data bus between FPGA and SRAM/Flash in programmable logic controllers. IC Role / Device Role / Timing Role: Non-inverting buffer with dual OE control isolates memory access timing and enables bank-select arbitration. Use Value: 4.2 ns propagation delay and <0.6 V ground bounce ensure setup/hold timing margins are preserved across temperature and voltage extremes. | Use Scenario: Interfacing microcontroller I/O expansion to modular I/O cards via 20-line parallel backplane. IC Role / Device Role / Timing Role: Bus driver providing hot-swap-safe isolation and noise-suppressed signal integrity across 15 cm trace lengths. Use Value: Ioff support prevents backfeeding during card insertion; edge-rate control minimizes crosstalk between adjacent channels. |
| Telecom Line Card Interface | Test Equipment Signal Distribution |
Use Scenario: Level-shifting and buffering 20-bit configuration bus between management MCU and multiple ASICs on line card. IC Role / Device Role / Timing Role: Three-state driver enabling shared bus arbitration with precise OE-controlled enable/disable sequencing. Use Value: Dual NANDed OE inputs allow compact logic for priority-based bus access without external gates. | Use Scenario: Distributing synchronized test vectors from pattern generator to 20 DUT inputs in ATE fixture. IC Role / Device Role / Timing Role: Low-skew (<0.5 ns) fanout buffer ensuring deterministic timing alignment across all channels. Use Value: Typical output skew <250 ps and matched drive strength guarantee sub-nanosecond inter-channel skew for high-speed validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 20-bit buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY74FCT162827CTPACT | Same pinout, same 4.2 ns speed grade, identical electrical specs - differs only in TI's part numbering prefix (CY vs. no prefix) | No functional difference; both meet identical FCT family specifications and industrial temp range | Select based on distributor stock or legacy BOM alignment; functionally interchangeable |
| SN74FCT162827CTPACT | Identical die, same TSSOP-56 package, same 24 mA drive and Ioff - branded under TI's SN74FCT prefix instead of Cypress CY prefix | No application divergence; fully compatible in footprint, timing, and power behavior | Preferred for new designs sourcing directly from TI; same reliability and qualification data as CY74FCT162827ETPAC |
Compared with CY74FCT162827ETPAC, CY74FCT162827CTPACT offers identical performance and packaging but reflects Cypress' original ordering nomenclature, while SN74FCT162827CTPACT provides TI's standardized branding with full lifecycle support and identical production traceability.
Availability
CY74FCT162827ETPAC is available at Aetrix Electronics and suitable for industrial backplane interfaces, memory subsystem buffering, telecom line card design, and automated test equipment requiring stable component supply and long-term manufacturability.
Supply support for CY74FCT162827ETPAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions for industrial, automotive, and communications markets.
The CY74FCT162827ETPAC belongs to TI's FCT logic family, engineered specifically for high-speed, low-noise bus interfacing in industrial and telecom infrastructure where signal integrity, power-down safety, and thermal reliability are critical.
FAQ
What is the maximum propagation delay of the CY74FCT162827ETPAC under standard load conditions?
The CY74FCT162827ETPAC has a maximum propagation delay of 4.2 ns when loaded with CL = 50 pF and RL = 500 Ω, measured across the A-to-Y path. This value is guaranteed over the full industrial temperature range (−40°C to +85°C) and VCC = 4.5 V to 5.5 V, making CY74FCT162827ETPAC suitable for systems requiring tight timing budgets in high-speed parallel interfaces.
Does the CY74FCT162827ETPAC support partial power-down operation?
Yes, the CY74FCT162827ETPAC integrates Ioff circuitry that actively disables all outputs and blocks reverse current flow when VCC = 0 V. This feature enables safe use in hot-pluggable backplanes and mixed-voltage systems, and is fully characterized per JEDEC JESD78. The CY74FCT162827ETPAC maintains this capability across its entire operating temperature range.
What is the output drive strength specification for CY74FCT162827ETPAC?
The CY74FCT162827ETPAC provides balanced ±24 mA output drive strength - meaning it sources up to 24 mA and sinks up to 24 mA per output pin under VCC = 5 V conditions. This symmetric drive capability ensures consistent rise/fall times and reduces signal distortion on controlled-impedance traces, a key advantage over asymmetric drivers like the CY74FCT16827T.
Is CY74FCT162827ETPAC pin-compatible with CY74FCT16827T?
No, CY74FCT162827ETPAC is not pin-compatible with CY74FCT16827T. Although both are 20-bit buffers in 56-pin TSSOP packages, their output drive architectures differ: CY74FCT162827ETPAC uses balanced 24 mA drivers with integrated current-limiting, while CY74FCT16827T uses asymmetrical 32 mA source / 64 mA sink drivers. Pin functions and recommended layout practices are distinct.
What package type and dimensions does CY74FCT162827ETPAC use?
CY74FCT162827ETPAC uses a 56-pin TSSOP package (TI drawing DGG), with 0.5 mm pitch, 13.9 mm × 7.9 mm body size, and 1.2 mm maximum height. It complies with JEDEC MO-153 and is RoHS-compliant with NiPdAu lead finish and MSL Level-1 rating - suitable for standard reflow profiles without moisture sensitivity concerns.
CY74FCT162827ETPAC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 10
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
CY74FCT162827ETPAC FAQ
1.How can I place an order for CY74FCT162827ETPAC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY74FCT162827ETPAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY74FCT162827ETPAC reliable?
The price and inventory of CY74FCT162827ETPAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY74FCT162827ETPAC is usually 5 days.
3.What payment methods are accepted for CY74FCT162827ETPAC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY74FCT162827ETPAC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY74FCT162827ETPAC?
CY74FCT162827ETPAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY74FCT162827ETPAC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY74FCT162827ETPAC?
For technical support, including CY74FCT162827ETPAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY74FCT162827ETPAC requirements.
6.How does Aetrix verify that CY74FCT162827ETPAC is sourced from the original manufacturer or authorized distributors?
All CY74FCT162827ETPAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY74FCT162827ETPAC meets industry standards.
7.What is the process for return or replacement of CY74FCT162827ETPAC?
All CY74FCT162827ETPAC units undergo pre-shipment inspection (PSI). If there is an issue with CY74FCT162827ETPAC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY74FCT162827ETPAC part is unused and in its original packaging.
Return procedure for CY74FCT162827ETPAC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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