Texas Instruments CY74FCT16823ETPAC

Overview

CY74FCT16823ETPAC from Texas Instruments is an 18-bit bus interface register IC with dual 9-bit sections, designed for high-speed, low-power systems requiring wide data paths and parity support. It features 64 mA sink / 32 mA source drive strength, Ioff partial-power-down capability, typical output skew <250 ps, and operates at VCC = 5V ±10% across −40°C to +85°C for industrial backplane and transmission-line interfacing.

For engineers reviewing the CY74FCT16823ETPAC datasheet, CY74FCT16823ETPAC pinout, CY74FCT16823ETPAC application, or CY74FCT16823ETPAC equivalent, key selection criteria include its 56-pin TSSOP package, asynchronous clear (active-low), clock enable (active-low), three-state output control, and compatibility with high-capacitance load driving in synchronous bus architectures.

Technical Context

The CY74FCT16823ETPAC implements two synchronized 9-bit register sections sharing common clock, clock enable, and clear controls-enabling 18-bit flow-through operation without internal bus contention. Its edge-rate controlled outputs reduce system switching noise and ground bounce (typical VOLP <1.0 V at 5 V).

Ioff circuitry disables outputs during power-down to prevent backflow current, while TTL-compatible input thresholds (VIH = 2.0 V min, VIL = 0.8 V max) ensure interoperability with legacy logic families. Propagation delay from CLK to Q is 10.0 ns max (CL = 50 pF), supporting reliable timing in 10-MHz synchronous buses.

Key Specifications

Pinout & Package

Package: 56-pin TSSOP (DGG), 1.2 mm max height, 0.5 mm pitch, JEDEC MO-153 compliant. Pin 1 marked via corner chamfer and top-side ID area.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 18-bit register applications.

Compared with CY74FCT16823ETPAC, the CT-speed variant offers faster timing for demanding clocks, while the 162823 variant trades drive strength for reduced noise on clean transmission lines-neither is pin-compatible with CY74FCT16823ETPAC due to differing output driver architectures and absence of Ioff in the 162823 series.

Availability

CY74FCT16823ETPAC is available at Aetrix Electronics and suitable for industrial backplane interface, modular PLC I/O expansion, and telecom line card timing requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY74FCT16823ETPAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions for industrial, automotive, and communications markets.

The CY74FCT16823E belongs to TI's FCT logic family-designed specifically for high-speed, low-noise bus interface applications in industrial and telecom infrastructure where signal integrity and power-down safety are critical.

FAQ

What is the maximum clock frequency supported by CY74FCT16823ETPAC?

CY74FCT16823ETPAC does not specify a maximum clock frequency but guarantees 10.0 ns max propagation delay (CLK→Q) at CL = 50 pF. For reliable operation, design margins require minimum clock period ≥2× propagation delay plus setup/hold times-supporting up to ~50 MHz in ideal conditions. Real-world bus timing depends on load capacitance and board layout; consult TI's switching characteristics table for CL = 300 pF derating.

Does CY74FCT16823ETPAC support hot-swap or partial-power-down operation?

Yes, CY74FCT16823ETPAC includes Ioff circuitry that disables outputs when VCC = 0 V, preventing damaging current backflow during hot-swap events or partial-power-down modes. This feature is fully specified per JEDEC standards and validated across the industrial temperature range, making CY74FCT16823ETPAC suitable for modular systems requiring live insertion.

What is the difference between CY74FCT16823ETPAC and CY74FCT162823ETPAC?

CY74FCT16823ETPAC provides 64 mA sink / 32 mA source drive optimized for high-capacitance backplanes, includes Ioff support, and exhibits typical ground bounce <1.0 V. In contrast, CY74FCT162823ETPAC uses balanced 24 mA drivers with current-limiting resistors, achieves <0.6 V ground bounce, but lacks Ioff-making it unsuitable for hot-swap applications despite identical pin count and package.

Can CY74FCT16823ETPAC be used with 3.3-V logic interfaces?

No, CY74FCT16823ETPAC is strictly a 5-V device (VCC = 5 V ±10%) with TTL-compatible input thresholds (VIH = 2.0 V min, VIL = 0.8 V max). While 3.3-V outputs may meet VIH, they risk violating VIL under noise or voltage droop. Direct interfacing requires level-shifting; TI does not characterize or guarantee operation below 4.5 V or above 5.5 V.

What package type and dimensions does CY74FCT16823ETPAC use?

CY74FCT16823ETPAC uses a 56-pin TSSOP package (TI drawing DGG), 13.9–14.1 mm × 6.0–6.2 mm footprint, 1.2 mm max height, 0.5 mm lead pitch, and JEDEC MO-153 compliant. Pin 1 is identified by a corner chamfer and top-side marking "FCT16823A"; land pattern follows IPC-7351 recommendations for 0.5 mm pitch TSSOP.